MC9S12D64MFU Freescale Semiconductor, MC9S12D64MFU Datasheet - Page 103

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MC9S12D64MFU

Manufacturer Part Number
MC9S12D64MFU
Description
IC MCU 64K FLASH 25MHZ 80-QFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12D64MFU

Core Processor
HCS12
Core Size
16-Bit
Speed
25MHz
Connectivity
CAN, I²C, SCI, SPI
Peripherals
PWM, WDT
Number Of I /o
59
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.25 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
80-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

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A.3.2 NVM Reliability
The reliability of the NVM blocks is guaranteed by stress test during qualification, constant process
monitors and burn-in to screen early life failures.
The failure rates for data retention and program/erase cycling are specified at the operating conditions
noted.
The program/erase cycle count on the sector is incremented every time a sector or mass erase event is
executed.
Conditions are shown in Table A-4 unless otherwise noted
Num C
NOTES:
1. Total time at the maximum guaranteed device operating temperature <= 1 year
1
2
3
4
C
C Flash number of Program/Erase cycles
C
C
Data Retention at an average junction temperature of
T
EEPROM number of Program/Erase cycles
(–40 C
EEPROM number of Program/Erase cycles
(0 C < T
Javg
= 85 C
J
T
J
140 C)
1
0 C)
Table A-12 NVM Reliability Characteristics
Rating
Symbol
t
NVMRET
n
n
n
EEPE
EEPE
FLPE
MC9S12DJ64 Device User Guide — V01.20
100,000
10,000
10,000
Min
15
Typ
Max
Cycles
Cycles
Cycles
Years
Unit
103

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