HD64F2676VFC33 Renesas Electronics America, HD64F2676VFC33 Datasheet - Page 139

IC H8S MCU FLASH 256K 144-QFP

HD64F2676VFC33

Manufacturer Part Number
HD64F2676VFC33
Description
IC H8S MCU FLASH 256K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheets

Specifications of HD64F2676VFC33

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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2.2.35 (2)
LDC (LoaD to Control register)
Operation
<EAs>
Assembly-Language Format
LDC.B <EAs>, EXR
Operand Size
Byte
Description
This instruction loads the source operand contents into the extended control register (EXR).
No interrupt requests, including NMI, are accepted for three states after execution of this
instruction.
Available Registers
Rs: R0L to R7L, R0H to R7H
Operand Format and Number of States Required for Execution
Notes
Immediate
Register direct
Addressing
Mode
EXR
LDC (B)
Mnemonic
LDC.B
LDC.B
#xx:8, EXR
Operands
Rs, EXR
1st byte
0
0
1
3
Condition Code
H: Previous value remains unchanged.
N: Previous value remains unchanged.
Z: Previous value remains unchanged.
V: Previous value remains unchanged.
C: Previous value remains unchanged.
2nd byte
4
1
Instruction Format
Rev. 4.00 Feb 24, 2006 page 123 of 322
I
rs
1
UI H
Section 2 Instruction Descriptions
3rd byte
0
U
7
N
4th byte
REJ09B0139-0400
IMM
Z
— —
V
Load EXR
States
No. of
C
2
1

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