MC68HC11E0CFNE3 Freescale Semiconductor, MC68HC11E0CFNE3 Datasheet - Page 14

IC MCU 8BIT 3MHZ 52-PLCC

MC68HC11E0CFNE3

Manufacturer Part Number
MC68HC11E0CFNE3
Description
IC MCU 8BIT 3MHZ 52-PLCC
Manufacturer
Freescale Semiconductor
Series
HC11r
Datasheets

Specifications of MC68HC11E0CFNE3

Core Processor
HC11
Core Size
8-Bit
Speed
3MHz
Connectivity
SCI, SPI
Peripherals
POR, WDT
Number Of I /o
38
Program Memory Type
ROMless
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
52-PLCC
Controller Family/series
68HC11
No. Of I/o's
38
Ram Memory Size
512Byte
Cpu Speed
3MHz
No. Of Timers
1
Embedded Interface Type
SCI, SPI
Digital Ic Case Style
LCC
Rohs Compliant
Yes
Processor Series
HC11E
Core
HC11
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
SCI, SPI
Maximum Clock Frequency
3 MHz
Number Of Programmable I/os
38
Number Of Timers
8
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit, 8 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC68HC11E0CFNE3
Manufacturer:
FREESCALE
Quantity:
6 249
Part Number:
MC68HC11E0CFNE3
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC68HC11E0CFNE3R
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
General Description
1.3 Structure
See
the table accompanying
1.4 Pin Descriptions
M68HC11 E-series MCUs are available packaged in:
Most pins on these MCUs serve two or more functions, as described in the following paragraphs. Refer
to
assignments for the PLCC/CLCC, QFP, TQFP, SDIP, and DIP packages.
14
Figure
Figure 1-1
Computer operating properly (COP) watchdog system
38 general-purpose input/output (I/O) pins:
Several packaging options:
52-pin plastic-leaded chip carrier (PLCC)
52-pin windowed ceramic leaded chip carrier (CLCC)
52-pin plastic thin quad flat pack, 10 mm x 10 mm (TQFP)
64-pin quad flat pack (QFP)
48-pin plastic dual in-line package (DIP), MC68HC811E2 only
56-pin plastic shrink dual in-line package, .070-inch lead spacing (SDIP)
1-2,
16 bidirectional I/O pins
11 input-only pins
11 output-only pins
52-pin plastic-leaded chip carrier (PLCC)
52-pin windowed ceramic leaded chip carrier (CLCC)
52-pin plastic thin quad flat pack, 10 mm x 10 mm (TQFP)
64-pin quad flat pack (QFP)
48-pin plastic dual in-line package (DIP), MC68HC811E2 only
56-pin plastic shrink dual in-line package, .070-inch lead spacing (SDIP)
Figure
for a functional diagram of the E-series MCUs. Differences among devices are noted in
1-3,
Figure
Figure
1-1.
1-4,
M68HC11E Family Data Sheet, Rev. 5.1
Figure
1-5, and
Figure 1-6
which show the M68HC11 E-series pin
Freescale Semiconductor

Related parts for MC68HC11E0CFNE3