LT1491AIS#PBF Linear Technology, LT1491AIS#PBF Datasheet - Page 12

IC OP-AMP R-R IN/OUT QUAD 14SOIC

LT1491AIS#PBF

Manufacturer Part Number
LT1491AIS#PBF
Description
IC OP-AMP R-R IN/OUT QUAD 14SOIC
Manufacturer
Linear Technology
Series
Over-The-Top®r
Datasheet

Specifications of LT1491AIS#PBF

Amplifier Type
General Purpose
Number Of Circuits
4
Output Type
Rail-to-Rail
Slew Rate
0.07 V/µs
Gain Bandwidth Product
200kHz
Current - Input Bias
1nA
Voltage - Input Offset
250µV
Current - Supply
50µA
Current - Output / Channel
25mA
Voltage - Supply, Single/dual (±)
2 V ~ 44 V, ±1 V ~ 22 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
-3db Bandwidth
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LT1491AIS#PBFLT1491AIS
Manufacturer:
LINEAR/凌特
Quantity:
20 000
Company:
Part Number:
LT1491AIS#PBF
Manufacturer:
ADI
Quantity:
2 995
Company:
Part Number:
LT1491AIS#PBF
Manufacturer:
LINEAR/凌特
Quantity:
20 000
Company:
Part Number:
LT1491AIS#PBFLT1491AIS#TRPBF
Manufacturer:
ADI/亚德诺
Quantity:
20 000
PACKAGE DESCRIPTIO
LT1490A/LT1491A
12
3.5 ±0.05
2.15 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)
0.25 ± 0.05
(.0165 ± .0015)
0.42 ± 0.04
GAUGE PLANE
(.077)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
2.38 ±0.05
TYP
(2 SIDES)
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
RECOMMENDED SOLDER PAD LAYOUT
(.206)
5.23
MIN
0.50
BSC
(.010)
0.254
U
0.675 ±0.05
PACKAGE
OUTLINE
DETAIL “A”
DETAIL “A”
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
(Reference LTC DWG # 05-08-1660)
0° – 6° TYP
0.889 ± 0.127
(.0256)
(.035 ± .005)
(.126 – .136)
0.65
BSC
3.2 – 3.45
TOP MARK
8-Lead Plastic MSOP
(NOTE 6)
(.021 ± .006)
0.53 ± 0.015
PIN 1
MS8 Package
0.200 REF
DD Package
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
SEATING
PLANE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON TOP AND BOTTOM OF PACKAGE
(1.93 ± .006)
(.118 ± .004)
3.00 ± 0.102
4.90 ± 0.15
(.009 – .015)
0.22 – 0.38
(NOTE 3)
TYP
(.043)
MAX
1.10
(.0256)
0.65
BSC
0.75 ±0.05
3.00 ±0.10
1
8
(4 SIDES)
7 6 5
2 3
0.00 – 0.05
4
1.65 ± 0.10
(2 SIDES)
3.00 ± 0.102
(.118 ± .004)
(.206)
(.034)
0.52
REF
NOTE 4
0.86
REF
(.005 ± .003)
0.13 ± 0.076
MSOP (MS8) 0802
BOTTOM VIEW—EXPOSED PAD
0.25 ± 0.05
R = 0.115
TYP
4
5
2.38 ±0.10
(2 SIDES)
8
1
0.50 BSC
0.38 ± 0.10
sn1490, 14901afbs
(DD8) DFN 1203

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