BA10324AFV-E2 Rohm Semiconductor, BA10324AFV-E2 Datasheet - Page 23

IC OPAMP QUAD 32V 0.6MA SSOP-B14

BA10324AFV-E2

Manufacturer Part Number
BA10324AFV-E2
Description
IC OPAMP QUAD 32V 0.6MA SSOP-B14
Manufacturer
Rohm Semiconductor
Datasheet

Specifications of BA10324AFV-E2

Amplifier Type
Differential
Number Of Circuits
4
Slew Rate
0.2 V/µs
Gain Bandwidth Product
500kHz
Current - Input Bias
20nA
Voltage - Input Offset
2000µV
Current - Supply
600µA
Current - Output / Channel
35mA
Voltage - Supply, Single/dual (±)
3 V ~ 32 V, ±1.5 V ~ 16 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
14-SSOP
Number Of Channels
4
Common Mode Rejection Ratio (min)
65 dB
Input Offset Voltage
7 mV
Input Bias Current (max)
250 nA
Operating Supply Voltage
3 V to 32 V
Supply Current
0.6 mA
Maximum Power Dissipation
400 mW
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Dual Supply Voltage
+/- 3 V, +/- 5 V, +/- 9 V
Maximum Dual Supply Voltage
+/- 16 V
Minimum Dual Supply Voltage
+/- 1.5 V
Mounting Style
SMD/SMT
Shutdown
No
Supply Voltage (max)
32 V
Supply Voltage (min)
3 V
Technology
Bipolar
Voltage Gain Db
100 dB
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Output Type
-
-3db Bandwidth
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
BA10324AFV-E2
BA10324AFV-E2TR

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BA10358F/FV, BA10324AF/FV, BA2904SF/FV/FVM, BA2904F/FV/FVM
BA2902SF/FV/KN, BA2902F/FV/KN, BA3404F/FVM
● Notes for use
© 2010 ROHM Co., Ltd. All rights reserved.
www.rohm.com
10) Board inspection
11) Output capacitor
1) Unused circuits
2) Input voltage
3) Power supply (single / dual)
4) Power dissipation (Pd)
5) Short-circuit between pins and erroneous mounting
6) Operation in a strong electromagnetic field
7) Radiation
8) IC handing
9) IC operation
When there are unused circuits, it is recommended that they be connected as in
Fig.127, setting the non-inverting input terminal to a potential within the in-phase
input voltage range (Vicm).
Applying VEE+32[V] (BA2904S / BA2904 /BA2902S / BA2902 family,
BA2904HFVM-C) and VEE+36[V](BA3404 family) to the input terminal is possible
without causing deterioration of the electrical characteristics or destruction,
irrespective of the supply voltage. However, this does not ensure normal circuit
operation. Please note that the circuit operates normally only when the input
voltage is within the common mode input voltage range of the electric
characteristics.
The op-amp operates when the voltage supplied is between VCC and VEE Therefore, the single supply op-mp can be
used as a dual supply op-amp as well.
Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to the rise
in chip temperature, including reduced current capability. Therefore, please take into consideration the power dissipation
(Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal derating
curves for more information.
Incorrect mounting may damage the IC. In addition, the presence of foreign substances between the outputs, the output
and the power supply, or the output and GND may result in IC destruction.
Operation in a strong electromagnetic field may cause malfunctions.
This IC is not designed to withstand radiation.
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuation of the electrical
characteristics due to piezoelectric (piezo) effects.
The output stage of the IC is configured using Class C push-pull circuits. Therefore, when the load resistor is connected to
the middle potential of VCC and VEE, crossover distortion occurs at the changeover between discharging and charging of
the output current. Connecting a resistor between the output terminal and GND, and increasing the bias current for Class
A operation will suppress crossover distortion.
Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every
process is recommended. In addition, when attaching and detaching the jig during the inspection phase, ensure that the
power is turned OFF before inspection and removal. Furthermore, please take measures against ESD in the assembly
process as well as during transportation and storage.
Discharge of the external output capacitor to VCC is possible via internal parasitic elements when VCC is shorted to VEE,
causing damage to the internal circuitry due to thermal stress. Therefore, when using this IC in circuits where oscillation
due to output capacitive load does not occur, such as in voltage comparators, use an output capacitor with a capacitance
less than 0.1μF.
23/25
Fig.
unused circuit
Please keep this
potencial in Vicm
同相入力電圧
範囲内の電位
127 Example of
Technical Note
2010.11 - Rev.A
VEE
VCC
processing

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