BA15532F-E2 Rohm Semiconductor, BA15532F-E2 Datasheet - Page 43

• Manufacturer Part Number: BA15532F-E2
• Description: IC OPAMP DUAL 20V SOP-8
• Manufacturer: Rohm Semiconductor

Specifications of BA15532F-E2

• Amplifier Type: General Purpose
• Number Of Circuits: 2
• Slew Rate: 8 V/µs
• Gain Bandwidth Product: 20MHz
• Current - Input Bias: 200nA
• Voltage - Input Offset: 500µV
• Current - Supply: 8mA
• Current - Output / Channel: 38mA
• Voltage - Supply, Single/dual (±): 6 V ~ 40 V, ±3 V ~ 20 V
• Operating Temperature: -20°C ~ 75°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Output Type: -
• -3db Bandwidth: -
• Other names: BA15532F-E2; BA15532F-E2TR

●Derating curve
BA4558F,BA4558R F/FV/FVM,BA4560F,BA4560RF/FV/FVM,BA4564RFVBA4580RF/FVM,BA4584FV,
BA4584RF/FV,BA8522RF/FV/FVM,BA15218F,BA14741F,BA15532F,BA4510F/FV,BA2115F/FVM
© 2010 ROHM Co., Ltd. All rights reserved.
www.rohm.com
Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature).IC is heated
when it consumed power, and the temperature of IC ship becomes higher than ambient temperature. The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal
resistance of package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum
value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame
of the package. The parameter which indicates this heat dissipation capability (hardness of heat release) is called thermal
resistance, represented by the symbol θj-a[℃/W]. The temperature of IC inside the package can be estimated by this
thermal resistance. Fig.319 (a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient
temperature Ta, junction temperature Tj, and power dissipation Pd can be calculated by the equation below:
Derating curve in Fig.319 (b) indicates power that can be consumed by IC with reference to ambient temperature. Power that
can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at
certain ambient temperature. This gradient is determined by thermal resistance θja. Thermal resistance θja depends on chip
size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of
package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Fig.320(c), ～, (f)
show a derating curve for an example of BA4558, BA4558R, BA4560, BA4560R, BA4564R, BA4580R, BA4584, BA4584R,
BA8522R, BA15218, BA14741, BA15532, BA4510, BA2115.
When using the unit above Ta=25[℃], subtract the value above per degree[℃]. Permissible dissipation is the value.
When FR4 glass epoxy board 70[mm]×70[mm]×1.6[mm] (cooper foil area below 3[%]) is mounted.
(c)BA4558R/BA4560R/BA4580R/BA8522R/BA2115 family
(e)BA4558/BA4560/BA15218/BA15532/BA4510 family
(*37)
6.2
θja = (Tj-Ta) / Pd
1000
1000
800
600
400
200
800
600
400
200
0
0
(a) Thermal resistance
Chip surface temperature Tj [℃]
Power dissipation P [W]
0
θja = ( Tj ー Ta ) / Pd [ ℃ /W]
0
550mW (*43)
620mW (*42)
690mW (*38)
590mW (*39)
780mW (*37)
BA4558RFV
BA4564RFV
BA8522RFV
Ambient temperature Ta [℃]
(*38)
5.5
Ambient temperature Ta [℃]
Ambient Temperature Ta [℃]
チップ 表面温度 Tj [ ℃ ]
消費電力 P [W]
25
25
周囲温度 Ta [ ℃ ]
BA4510F
周囲温度 Ta [℃]
周囲温度 Ta [℃]
BA2115FVM
50
50
BA4558F
BA4560F
BA15218F
BA4510F
BA2115F
[℃/W]
BA4558RF
BA4564RF
BA4580RF
BA8522RF
(*39)
4.7
75
75
BA4558RFVM
BA4564RFVM
BA4580RFVM
BA8522RFVM
BA15532F
Fig. 319 Thermal resistance and derating curve
100
100
・・・・・ (Ⅰ)
(*40)
7.0
125
125
Fig. 320 Derating curve
(*41)
43/48
5.3
Power dissipation of LSI [W]
(*42)
6.2
LSI の 消 費 電 力 [W]
P2
P1
0
Pd (max)
(d)BA4564R/BA4584/BA4584R family
1000
1000
800
600
400
200
800
600
400
200
25
0
0
Ambient temperature Ta [℃]
0
0
870mW (*40)
610mW (*41)
(b) Derating curve
490mW (*44)
(*43)
5.5
Ambient temperature Ta [℃]
50
BA4584RF
Ambient Temperature Ta [℃]
θ' ja1
25
25
周 囲 温 度 Ta [ ℃ ]
周囲温度 Ta [℃]
周囲温度 Ta [℃]
(f)BA14741F
75
θ ja1
θja2 < θja1
50
50
BA14741F
BA4584FV
θ' ja2
100
(*44)
BA4564RFV
BA4584RFV
4.9
75
θ ja2
75
125
Tj ' (max)
100
Technical Note
100
2010.12 - Rev.A
150
[mW/℃]
125
Unit
125
Tj (max)