HA3-5002-5Z Intersil, HA3-5002-5Z Datasheet - Page 5

• Manufacturer Part Number: HA3-5002-5Z
• Description: IC BUFFER 110MHZ HIGH OUT 8-DIP
• Manufacturer: Intersil
• Type: High Output, High Slew Rater

Specifications of HA3-5002-5Z

• Amplifier Type: Buffer
• Number Of Circuits: 1
• Slew Rate: 1300 V/µs
• -3db Bandwidth: 110MHz
• Current - Input Bias: 2µA
• Voltage - Input Offset: 5000µV
• Current - Supply: 8.3mA
• Current - Output / Channel: 220mA
• Voltage - Supply, Single/dual (±): 10 V ~ 40 V, ±5 V ~ 20 V
• Operating Temperature: 0°C ~ 75°C
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Bandwidth: 110 MHz
• Current, Input Bias: 2 μA
• Current, Output: 220 mA
• Current, Supply: 8.3 mA
• Harmonic Distortion: 0.005 %
• Impedance, Thermal: 92 °C/W
• Number Of Amplifiers: Single
• Package Type: PDIP-8
• Propagation Delay: 2 ns
• Resistance, Input: 3 Megohms
• Temperature, Operating, Range: 0 to +75 °C
• Time, Rise: 3.6 ns
• Voltage, Gain: 0.995 V/V
• Voltage, Input Offset: 5 mV
• Voltage, Noise: 18 μVp-p
• Voltage, Output Swing: ±13.9 V
• Voltage, Supply: ±15 V
• No. Of Amplifiers: 1
• Gain Bandwidth: 110MHz
• Supply Voltage Range: ± 12V To ± 15V
• Output Current: 220mA
• Amplifier Output: Single Ended
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Output Type: -
• Gain Bandwidth Product: -
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

Test Circuit and Waveforms
Schematic Diagram
Application Information
Layout Considerations
The wide bandwidth of the HA-5002 necessitates that high
frequency circuit layout procedures be followed. Failure to
follow these guidelines can result in marginal performance.
Probably the most crucial of the RF/video layout rules is the
use of a ground plane. A ground plane provides isolation and
minimizes distributed circuit capacitance and inductance
which will degrade high frequency performance.
V
OUT
V
IN
LARGE SIGNAL WAVEFORMS
R
S
= 50Ω, R
Q
R
15
5
10
L
= 100Ω
Q
Q
Q
Q
25
11
23
9
Q
R
R
R
10
Q
(Continued)
5
7
9
21
Q
Q
24
22
Q
Q
IN
26
27
R
Q
Q
12
16
20
R
HA-5002
8
R
3
Q
Q
17
19
Q
Q
Q
R
8
18
Other considerations are proper power supply bypassing
and keeping the input and output connections as short as
possible which minimizes distributed capacitance and
reduces board space.
Power Supply Decoupling
For optimal device performance, it is recommended that the
positive and negative power supplies be bypassed with
capacitors to ground. Ceramic capacitors ranging in value
from 0.01 to 0.1µF will minimize high frequency variations in
supply voltage, while low frequency bypassing requires
7
6
V
OUT
V
Q
Q
IN
Q
V
V
3
14
R
4
1
1
4
+
-
R
2
Q
Q
R
R
R
6
5
11
N2
1
LARGE SIGNAL WAVEFORMS
Q
Q
13
R
12
R
N3
N1
R
S
= 50Ω, R
Q
Q
1
2
V
OUT
V
2
2
+
-
L
= 1kΩ
March 8, 2006
FN2921.11