IC OPAMP GP 2.8MHZ DUAL 8DIP

TLE2022CP

Manufacturer Part NumberTLE2022CP
DescriptionIC OPAMP GP 2.8MHZ DUAL 8DIP
ManufacturerTexas Instruments
SeriesExcalibur™
TLE2022CP datasheet
 


Specifications of TLE2022CP

Amplifier TypeGeneral PurposeNumber Of Circuits2
Slew Rate0.65 V/µsGain Bandwidth Product2.8MHz
Current - Input Bias35nAVoltage - Input Offset120µV
Current - Supply550µACurrent - Output / Channel30mA
Voltage - Supply, Single/dual (±)4 V ~ 40 V, ±2 V ~ 20 VOperating Temperature0°C ~ 70°C
Mounting TypeThrough HolePackage / Case8-DIP (0.300", 7.62mm)
Number Of Channels2Common Mode Rejection Ratio (min)85 dB
Input Voltage Range (max)Positive Rail - 1.5 VInput Voltage Range (min)Negative Rail
Input Offset Voltage0.6 mVInput Bias Current (max)70 nA
Operating Supply Voltage40 VSupply Current0.7 mA
Maximum Power Dissipation1000 mWMaximum Operating Temperature+ 70 C
Minimum Operating Temperature0 CDual Supply Voltage+/- 3 V, +/- 5 V, +/- 9 V
Maximum Dual Supply Voltage+/- 20 VMinimum Dual Supply Voltage+/- 2 V
Mounting StyleThrough HoleShutdownNo
Supply Voltage (max)40 VSupply Voltage (min)4 V
TechnologyBiCOMVoltage Gain Db123.52 dB
Lead Free Status / RoHS StatusLead free / RoHS CompliantOutput Type-
-3db Bandwidth-Other names296-10366-5
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TLE2022Y chip information
This chip, when properly assembled, displays characteristics similar to TLE2022. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(7)
(8)
80
(1)
(2)
TLE202x, TLE202xA, TLE202xB, TLE202xY
EXCALIBUR HIGH-SPEED LOW-POWER PRECISION
SLOS191D − FEBRUARY 1997 − REVISED NOVEMBER 2010
(6)
(5)
(4)
(3)
86
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
OPERATIONAL AMPLIFIERS
V
CC+
(8)
(3)
IN +
+
(1)
OUT
(2)
IN −
(5)
+
IN +
(7)
OUT
(6)
IN −
(4)
V
CC −
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4
4 MILS MINIMUM
T
max = 150 C
J
TOLERANCES ARE 10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
5