AD845KNZ Analog Devices Inc, AD845KNZ Datasheet - Page 3

• Manufacturer Part Number: AD845KNZ
• Description: IC OPAMP JFET 16MHZ PREC 8DIP
• Manufacturer: Analog Devices Inc

Specifications of AD845KNZ

• Slew Rate: 100 V/µs
• Amplifier Type: J-FET
• Number Of Circuits: 1
• Gain Bandwidth Product: 16MHz
• Current - Input Bias: 500pA
• Voltage - Input Offset: 100µV
• Current - Supply: 10mA
• Current - Output / Channel: 50mA
• Voltage - Supply, Single/dual (±): ±4.75 V ~ 18 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Op Amp Type: Precision
• No. Of Amplifiers: 1
• Bandwidth: 16MHz
• Supply Voltage Range: ± 4.75V To ± 18V
• Amplifier Case Style: DIP
• No. Of Pins: 8
• Common Mode Rejection Ratio: 113
• Current, Input Bias: 0.1 nA
• Current, Input Offset: 15 pA
• Current, Output: 50 mA
• Impedance, Thermal: 100 °C/W
• Package Type: PDIP-8
• Power Dissipation: 1.6 W
• Resistance, Input: 10^11 Kilohms
• Temperature, Operating, Range: 0 to +70 °C
• Voltage, Input: ±20 V (Differential), +10.5/-13 V (Common-Mode)
• Voltage, Noise: 80 nV/sqrt Hz
• Voltage, Offset: 0.1 mV
• Voltage, Output, High: +12.5 V
• Voltage, Output, Low: -12.5 V
• Voltage, Supply: ±15 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Output Type: -
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

ABSOLUTE MAXIMUM RATINGS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 18 V
Internal Power Dissipation
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +V
Output Short-Circuit Duration . . . . . . . . . . . . . . . . Indefinite
Differential Input Voltage . . . . . . . . . . . . . . . . . . +V
Storage Temperature Range
Lead Temperature Range (Soldering 60 sec) . . . . . . . . . 300∞C
NOTES
1
2
nent damage to the device. This is a stress rating only, and functional operation of
the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Stresses above those listed under Absolute Maximum Ratings may cause perma-
Mini-DIP package: q
package: q
Plastic Mini-DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.6 W
CERDIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.4 W
16-Lead SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5 W
Q . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–65∞C to +150∞C
N, R . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–65∞C to +125∞C
JA
= 100∞C/W.
JA
= 100∞C/W; CERDIP package: q
Model
AD845JN
AD845KN
AD845JR-16
AD845JR-16-REEL
AD845JR-16-REEL7
AD845AQ
AD845BQ
AD845SQ
AD845SQ/883B
5962-8964501PA
AD845JCHIPS
NOTES
1
2
N = Plastic DIP; Q = CERDIP; R = Small Outline IC (SOIC).
See military data sheet.
2
1
2
JA
= 110∞C/W; SOIC
Temperature
Range
0∞C to 70∞C
0∞C to 70∞C
0∞C to 70∞C
0∞C to 70∞C
0∞C to 70∞C
–40∞C to +85∞C
–40∞C to +85∞C
–55∞C to +125∞C
–55∞C to +125∞C
–55∞C to +125∞C
0∞C to 70∞C
S
and –V
ORDERING GUIDE
S
S
–3–
SUBSTRATE CONNECTED TO +V
Package
Description
8-Lead PDIP
8-Lead PDIP
16-Lead SOIC
Tape and Reel
Tape and Reel
8-Lead CERDIP
8-Lead CERDIP
8-Lead CERDIP
8-Lead CERDIP
8-Lead CERDIP
Die
METALIZATION PHOTOGRAPH
Dimensions shown in inches and (mm).
Contact factory for latest dimensions.
S
Package
Option
N-8
N-8
R-16
R-16
R-16
Q-8
Q-8
Q-8
Q-8
Q-8
1
AD845