IC OPAMP GP R-R 6.4MHZ 8MSOP

TLV2462IDGKR

Manufacturer Part NumberTLV2462IDGKR
DescriptionIC OPAMP GP R-R 6.4MHZ 8MSOP
ManufacturerTexas Instruments
TLV2462IDGKR datasheets
 


Specifications of TLV2462IDGKR

Amplifier TypeGeneral PurposeNumber Of Circuits2
Output TypeRail-to-RailSlew Rate1.6 V/µs
Gain Bandwidth Product6.4MHzCurrent - Input Bias1.3nA
Voltage - Input Offset500µVCurrent - Supply550µA
Current - Output / Channel80mAVoltage - Supply, Single/dual (±)2.7 V ~ 6 V, ±1.35 V ~ 3 V
Operating Temperature-40°C ~ 125°CMounting TypeSurface Mount
Package / Case8-MSOP, Micro8™, 8-uMAX, 8-uSOP,Number Of Channels2
Common Mode Rejection Ratio (min)71 dBInput Voltage Range (max)Positive Rail
Input Voltage Range (min)Negative RailInput Offset Voltage2 mV
Input Bias Current (max)14 nAOutput Current (typ)80 mA
Operating Supply Voltage6 VSupply Current1.3 mA
Maximum Power Dissipation481 mWMaximum Operating Temperature+ 125 C
Minimum Operating Temperature- 40 CDual Supply Voltage+/- 3 V
Maximum Dual Supply Voltage+/- 3 VMinimum Dual Supply Voltage+/- 1.35 V
Mounting StyleSMD/SMTShutdownNo
Supply Voltage (max)6 VSupply Voltage (min)2.7 V
Voltage Gain Db109 dBLead Free Status / RoHS StatusLead free / RoHS Compliant
-3db Bandwidth-Other names296-7561-2
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SLOS220J − JULY 1998 − REVISED FEBRUARY 2004
TLV2460C/I/AI and TLV2461C/I/AI AVAILABLE OPTIONS
V IO max
V IO max
T A
AT 25 C
0 C to 70 C
2000 V
2000 V
−40 C to 125 C
−40 C to 125 C
1500 V
† This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2460CDR).
‡ Chip forms are tested at T A = 25 C only.
TLV2460M/AM/Q/AQ and TLV2461M/AM/Q/AQ AVAILABLE OPTIONS
V IO max
SMALL
T A
OUTLINE †
AT 25 C
TLV2460QD
2000 V
TLV2461QD
−40 C to 125 C
−40 C to 125 C
TLV2460AQD
1500 V
TLV2461AQD
2000 V
−55 C to 125 C
−55 C to 125 C
1500 V
† This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2460QDR).
TLV2462C/I/AI and TLV2463C/I/AI AVAILABLE OPTIONS
V IO max
SMALL
T A
OUTLINE †
AT 25 C
(D)
TLV2462CD
0 C to 70 C
2000 V
TLV2463CD
TLV2462ID
2000 V
TLV2463ID
−40 C to
−40 C to
125 C
TLV2462AID
1500 V
TLV2463AID
† This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2462CDR).
‡ Chip forms are tested at T A = 25 C only.
2
PACKAGED DEVICES
SOT-23 †
SMALL OUTLINE
(D)
(DBV)
TLV2460CD
TLV2460CDBV
TLV2461CD
TLV2461CDBV
TLV2460ID
TLV2460IDBV
TLV2461ID
TLV2461IDBV
TLV2460AID
TLV2461AID
PACKAGED DEVICES
SMALL
CERAMIC DIP
OUTLINE †
(JG)
(D)
(PW)
TLV2460QPW
TLV2461QPW
TLV2460AQPW
TLV2461AQPW
TLV2460MJG
TLV2461MJG
TLV2460AMJG
TLV2461AMJG
PACKAGED DEVICES
MSOP †
MSOP
SYMBOL
(DGK)
(DGS)
TLV2462CDGK
xxTIAAI
TLV2463CDGS
TLV2462IDGK
xxTIAAJ
TLV2463IDGS
WWW.TI.COM
PLASTIC DIP
SYMBOL
(P)
VAOC
TLV2460CP
VAPC
TLV2461CP
VAOI
TLV2460IP
VAPI
TLV2461IP
TLV2460AIP
TLV2461AIP
CERAMIC
CHIP CARRIER
FLATPACK
(FK)
(U)
TLV2460MU
TLV2460MFK
TLV2461MU
TLV2461MFK
TLV2460AMU
TLV2460AMFK
TLV2461AMU
TLV2461AMFK
PLASTIC DIP
PLASTIC DIP
SYMBOL
(N)
(P)
TLV2462CP
xxTIAAK
TLV2463CN
TLV2462IP
xxTIAAL
TLV2463IN
TLV2462AIP
TLV2463AIN