IC OPAMP GP R-R 6.4MHZ 8MSOP

TLV2462IDGKR

Manufacturer Part NumberTLV2462IDGKR
DescriptionIC OPAMP GP R-R 6.4MHZ 8MSOP
ManufacturerTexas Instruments
TLV2462IDGKR datasheets
 


Specifications of TLV2462IDGKR

Amplifier TypeGeneral PurposeNumber Of Circuits2
Output TypeRail-to-RailSlew Rate1.6 V/µs
Gain Bandwidth Product6.4MHzCurrent - Input Bias1.3nA
Voltage - Input Offset500µVCurrent - Supply550µA
Current - Output / Channel80mAVoltage - Supply, Single/dual (±)2.7 V ~ 6 V, ±1.35 V ~ 3 V
Operating Temperature-40°C ~ 125°CMounting TypeSurface Mount
Package / Case8-MSOP, Micro8™, 8-uMAX, 8-uSOP,Number Of Channels2
Common Mode Rejection Ratio (min)71 dBInput Voltage Range (max)Positive Rail
Input Voltage Range (min)Negative RailInput Offset Voltage2 mV
Input Bias Current (max)14 nAOutput Current (typ)80 mA
Operating Supply Voltage6 VSupply Current1.3 mA
Maximum Power Dissipation481 mWMaximum Operating Temperature+ 125 C
Minimum Operating Temperature- 40 CDual Supply Voltage+/- 3 V
Maximum Dual Supply Voltage+/- 3 VMinimum Dual Supply Voltage+/- 1.35 V
Mounting StyleSMD/SMTShutdownNo
Supply Voltage (max)6 VSupply Voltage (min)2.7 V
Voltage Gain Db109 dBLead Free Status / RoHS StatusLead free / RoHS Compliant
-3db Bandwidth-Other names296-7561-2
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TLV2462M/AM/Q/AQ and TLV2463M/AM/Q/AQ AVAILABLE OPTIONS
V IO max
SMALL
T A
OUTLINE †
AT 25 C
(D)
TLV2462QD
2000 V
TLV2463QD
−40 C to 125 C
−40 C to 125 C
TLV2462AQD
1500 V
TLV2463AQD
2000 V
−55 C to 125 C
−55 C to 125 C
1500 V
† This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2462QDR).
TLV2464C/I/AI and TLV2465C/I/AI AVAILABLE OPTIONS
T A
0 C to 70 C
−40 C to 125 C
−40 C to 125 C
† This package is available taped and reeled. To order this packaging option, add an R suffix to the part
number(e.g., TLV2464CDR).
‡ Chip forms are tested at T A = 25 C only.
TLV2464M/AM/Q/AQ and TLV2465M/AM/Q/AQ AVAILABLE OPTIONS
V IO max
T A
AT 25 C
2000 V
- 40 C to 125 C
- 40 C to 125 C
1500 V
2000 V
−55 C to 125 C
−55 C to 125 C
1500 V
† This package is available taped and reeled. To order this packaging option, add an R suffix to the part number
(e.g., TLV2464QDR).
SLOS220J − JULY 1998 − REVISED FEBRUARY 2004
PACKAGED DEVICES
SMALL
CERAMIC
CERAMIC DIP
OUTLINE †
(JG)
(PW)
TLV2462QPW
TLV2463QPW
TLV2462AQPW
TLV2463AQPW
TLV2462MJG
TLV2463MJ
TLV2462AMJG
TLV2463AMJ
PACKAGED DEVICES
V IO max
V IO max
SMALL OUTLINE
PLASTIC DIP
AT 25 C
(D)
TLV2464CD
TLV2464CN
2000 V
TLV2465CD
TLV2465CN
TLV2464ID
TLV2464IN
2000 V
TLV2465ID
TLV2465IN
TLV2464AID
TLV2464AIN
1500 V
TLV2465AID
TLV2465AIN
PACKAGED DEVICES
SMALL
SMALL
CERAMIC DIP
OUTLINE †
OUTLINE †
(D)
(PW)
TLV2464QD
TLV2464QPW
TLV2465QD
TLV2465QPW
TLV2464AQD
TLV2464AQPW
TLV2465AQD
TLV2465AQPW
TLV2464MJ
TLV2465MJ
TLV2464AMJ
TLV2465AMJ
WWW.TI.COM
CERAMIC
CHIP CAR-
DIP
FLATPACK
RIER
(J)
(U)
(FK)
TLV2462MU
TLV2462MFK
TLV2463MFK
TLV2462AMU
TLV2462AMFK
TLV2463AMFK
TSSOP
(N)
(PW)
TLV2464CPW
TLV2465CPW
TLV2464IPW
TLV2465IPW
TLV2464AIPW
TLV2465AIPW
CHIP CARRIER
(J)
(FK)
TLV2464MFK
TLV2465MFK
TLV2464AMFK
TLV2465AMFK
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