IC OPAMP GP R-R 6.4MHZ 8MSOP

TLV2462IDGKR

Manufacturer Part NumberTLV2462IDGKR
DescriptionIC OPAMP GP R-R 6.4MHZ 8MSOP
ManufacturerTexas Instruments
TLV2462IDGKR datasheets
 


Specifications of TLV2462IDGKR

Amplifier TypeGeneral PurposeNumber Of Circuits2
Output TypeRail-to-RailSlew Rate1.6 V/µs
Gain Bandwidth Product6.4MHzCurrent - Input Bias1.3nA
Voltage - Input Offset500µVCurrent - Supply550µA
Current - Output / Channel80mAVoltage - Supply, Single/dual (±)2.7 V ~ 6 V, ±1.35 V ~ 3 V
Operating Temperature-40°C ~ 125°CMounting TypeSurface Mount
Package / Case8-MSOP, Micro8™, 8-uMAX, 8-uSOP,Number Of Channels2
Common Mode Rejection Ratio (min)71 dBInput Voltage Range (max)Positive Rail
Input Voltage Range (min)Negative RailInput Offset Voltage2 mV
Input Bias Current (max)14 nAOutput Current (typ)80 mA
Operating Supply Voltage6 VSupply Current1.3 mA
Maximum Power Dissipation481 mWMaximum Operating Temperature+ 125 C
Minimum Operating Temperature- 40 CDual Supply Voltage+/- 3 V
Maximum Dual Supply Voltage+/- 3 VMinimum Dual Supply Voltage+/- 1.35 V
Mounting StyleSMD/SMTShutdownNo
Supply Voltage (max)6 VSupply Voltage (min)2.7 V
Voltage Gain Db109 dBLead Free Status / RoHS StatusLead free / RoHS Compliant
-3db Bandwidth-Other names296-7561-2
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Orderable Device
(1)
Package Type Package
Status
TLV2465IN
ACTIVE
PDIP
TLV2465INE4
ACTIVE
PDIP
TLV2465IPW
ACTIVE
TSSOP
TLV2465IPWG4
ACTIVE
TSSOP
TLV2465IPWR
ACTIVE
TSSOP
TLV2465IPWRG4
ACTIVE
TSSOP
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Pins
Package Qty
(2)
Eco Plan
Drawing
Ball Finish
N
16
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
N
16
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
PW
16
90
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
PW
16
90
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
PW
16
2000
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
PW
16
2000
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
Addendum-Page 13
PACKAGE OPTION ADDENDUM
28-Aug-2010
Lead/
(3)
Samples
MSL Peak Temp
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