LM258D STMicroelectronics, LM258D Datasheet - Page 12
LM258D
Manufacturer Part Number
LM258D
Description
IC OP AMP DUAL LOW POWER 8-SOIC
Manufacturer
STMicroelectronics
Datasheet
1.LM358DT.pdf
(19 pages)
Specifications of LM258D
Amplifier Type
General Purpose
Number Of Circuits
2
Slew Rate
0.6 V/µs
Gain Bandwidth Product
1.1MHz
Current - Input Bias
20nA
Voltage - Input Offset
2000µV
Current - Supply
700µA
Current - Output / Channel
60mA
Voltage - Supply, Single/dual (±)
3 V ~ 30 V, ±1.5 V ~ 15 V
Operating Temperature
-40°C ~ 105°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Number Of Channels
2
Common Mode Rejection Ratio (min)
70 dB
Input Offset Voltage
5 mV
Input Bias Current (max)
150 nA
Operating Supply Voltage
5 V, 9 V, 12 V, 15 V
Supply Current
1.2 mA
Maximum Power Dissipation
500 mW
Maximum Operating Temperature
+ 105 C
Minimum Operating Temperature
- 40 C
Dual Supply Voltage
+/- 3 V, +/- 5 V, +/- 9 V, +/- 12 V
Maximum Dual Supply Voltage
+/- 15 V
Minimum Dual Supply Voltage
+/- 1.5 V
Mounting Style
SMD/SMT
Shutdown
No
Supply Voltage (max)
30 V
Supply Voltage (min)
3 V
Technology
Bipolar
Voltage Gain Db
100 dB
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Output Type
-
-3db Bandwidth
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LM258D
Manufacturer:
MOTOROLA/摩托罗拉
Quantity:
20 000
Part Number:
LM258DGK
Manufacturer:
TI/德州仪器
Quantity:
20 000
Company:
Part Number:
LM258DGKR
Manufacturer:
TI
Quantity:
2 300
Part Number:
LM258DGKR
Manufacturer:
TI/德州仪器
Quantity:
20 000
Part Number:
LM258DGKRG4
Manufacturer:
TI/德州仪器
Quantity:
20 000
Part Number:
LM258DMR2
Manufacturer:
ON/安森美
Quantity:
20 000
Package information
6
12/19
Package information
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
®
packages. These packages have a lead-free second level interconnect. The
LM158-LM258-LM358