IC OPAMP GP 2.8MHZ DUAL 8DIP

TLE2022CPE4

Manufacturer Part NumberTLE2022CPE4
DescriptionIC OPAMP GP 2.8MHZ DUAL 8DIP
ManufacturerTexas Instruments
SeriesExcalibur™
TLE2022CPE4 datasheet
 


Specifications of TLE2022CPE4

Amplifier TypeGeneral PurposeNumber Of Circuits2
Slew Rate0.65 V/µsGain Bandwidth Product2.8MHz
Current - Input Bias35nAVoltage - Input Offset120µV
Current - Supply550µACurrent - Output / Channel30mA
Voltage - Supply, Single/dual (±)4 V ~ 40 V, ±2 V ~ 20 VOperating Temperature0°C ~ 70°C
Mounting TypeThrough HolePackage / Case8-DIP (0.300", 7.62mm)
Lead Free Status / RoHS StatusLead free / RoHS CompliantOutput Type-
-3db Bandwidth-  
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TLE202x, TLE202xA, TLE202xB, TLE202xY
EXCALIBUR HIGH-SPEED LOW-POWER PRECISION
OPERATIONAL AMPLIFIERS
SLOS191D − FEBRUARY 1997 − REVISED NOVEMBER 2010
V
max
SMALL
IO
T
A
AT 25 C
OUTLINE
(D)
0 C to
0 C to
200 V
200 V
TLE2021ACD
TLE2021ACD
TLE2021CDBLE
TLE2021CDBLE
70 C
500 V
TLE2021CD
−40 C
200 V
200 V
TLE2021AID
TLE2021AID
to
to
500 V
TLE2021ID
85 C
−55 C
−55 C
100 V
100 V
to
to
500 V
500 V
TLE2021MD
TLE2021MD
125 C
The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2021CDR).
The DB and PW packages are only available left-end taped and reeled.
§
Chip forms are tested at 25 C only.
V
max
SMALL
IO
T
SSOP
A
AT 25 C
OUTLINE
(D)
0 C
150 V
TLE2022BCD
to
to
300 V
300 V
TLE2022ACD
TLE2022ACD
70 C
500 V
TLE2022CD
TLE2022CDBLE
−40 C
150 V
TLE2022BID
to
to
300 V
300 V
TLE2022AID
TLE2022AID
85 C
500 V
TLE2022ID
−55 C
−55 C
150 V
150 V
to
to
300 V
300 V
TLE2022AMD
TLE2022AMD
125 C
500 V
TLE2022MD
The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2022CDR).
The DB and PW packages are only available left-end taped and reeled.
§
Chip forms are tested at 25 C only.
V
max
IO
T
A
AT 25 C
500 V
500 V
TLE2024BCDW
TLE2024BCDW
750 V
750 V
TLE2024ACDW
TLE2024ACDW
0 C to 70 C
0 C to 70 C
1000 V
TLE2024CDW
500 V
500 V
TLE2024BIDW
TLE2024BIDW
750 V
750 V
TLE2024AIDW
TLE2024AIDW
−40 C to 85 C
40 C to 85 C
1000 V
TLE2024IDW
500 V
500 V
TLE2024BMDW
TLE2024BMDW
−55 C to 125 C
55 C to 125 C
750 V
750 V
TLE2024AMDW
TLE2024AMDW
1000 V
TLE2024MDW
§
Chip forms are tested at 25 C only.
2
TLE2021 AVAILABLE OPTIONS
PACKAGED DEVICES
CHIP
CERAMIC DIP
SSOP
CARRIER
(DB)
(JG)
(FK)
TLE2021BMFK TLE2021BMJG
TLE2021BMFK
TLE2021BMJG
TLE2021MFK
TLE2021MFK
TLE2021MJG
TLE2021MJG
TLE2022 AVAILABLE OPTIONS
PACKAGED DEVICES
CHIP
CERAMIC
CARRIER
DIP
(DB)
(FK)
(JG)
TLE2022BMJG
TLE2022BMJG
TLE2022AMFK
TLE2022AMFK
TLE2022AMJG
TLE2022AMJG
TLE2022MFK
TLE2022MJG
TLE2024 AVAILABLE OPTIONS
PACKAGED DEVICES
SMALL
CHIP
CERAMIC
OUTLINE
CARRIER
DIP
(DW)
(FK)
TLE2024BMFK
TLE2024BMFK
TLE2024BMJ
TLE2024BMJ
TLE2024AMFK
TLE2024AMFK
TLE2024AMJ
TLE2024AMJ
TLE2024MFK
TLE2024MJ
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
PLASTIC DIP
TSSOP
(P)
(PW)
TLE2021ACP
TLE2021ACP
TLE2021CP
TLE2021CPWLE
TLE2021Y
TLE2021AIP
TLE2021AIP
TLE2021IP
TLE2021MP
TLE2021MP
PLASTIC
FORM
TSSOP
DIP
(PW)
(P)
TLE2022ACP
TLE2022ACP
TLE2022CP
TLE2022CPWLE
TLE2022Y
TLE2022AIP
TLE2022AIP
TLE2022IP
TLE2022AMP
TLE2022AMP
TLE2022MP
CHIP
CHIP
PLASTIC
§
FORM
DIP
(Y)
(J)
(N)
TLE2024BCN
TLE2024BCN
TLE2024ACN
TLE2024ACN
TLE2024CN
TLE2024Y
TLE2024BIN
TLE2024BIN
TLE2024AIN
TLE2024AIN
TLE2024IN
TLE2024BMN
TLE2024BMN
TLE2024AMN
TLE2024AMN
TLE2024MN
CHIP
CHIP
§
FORM
(Y)
CHIP
CHIP
§
(Y)