IC OPAMP GP 2.8MHZ DUAL 8DIP

TLE2022CPE4

Manufacturer Part NumberTLE2022CPE4
DescriptionIC OPAMP GP 2.8MHZ DUAL 8DIP
ManufacturerTexas Instruments
SeriesExcalibur™
TLE2022CPE4 datasheet
 


Specifications of TLE2022CPE4

Amplifier TypeGeneral PurposeNumber Of Circuits2
Slew Rate0.65 V/µsGain Bandwidth Product2.8MHz
Current - Input Bias35nAVoltage - Input Offset120µV
Current - Supply550µACurrent - Output / Channel30mA
Voltage - Supply, Single/dual (±)4 V ~ 40 V, ±2 V ~ 20 VOperating Temperature0°C ~ 70°C
Mounting TypeThrough HolePackage / Case8-DIP (0.300", 7.62mm)
Lead Free Status / RoHS StatusLead free / RoHS CompliantOutput Type-
-3db Bandwidth-  
1
Page 1
2
Page 2
3
Page 3
4
Page 4
5
Page 5
6
Page 6
7
Page 7
8
Page 8
9
Page 9
10
Page 10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
Page 6/76

Download datasheet (2Mb)Embed
PrevNext
TLE202x, TLE202xA, TLE202xB, TLE202xY
EXCALIBUR HIGH-SPEED LOW-POWER PRECISION
OPERATIONAL AMPLIFIERS
SLOS191D − FEBRUARY 1997 − REVISED NOVEMBER 2010
TLE2024Y chip information
This chip, when properly assembled, displays characteristics similar to the TLE2024. Thermal compression or
ultrasonic bonding may be used on the doped aluminum-bonding pads. This chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
100
6
140
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
V
CC +
(4)
(3)
1IN +
+
(1)
1OUT
(2)
1IN −
(5)
+
2IN +
(7)
2OUT
(6)
2IN −
(10)
2IN +
+
(8)
3OUT
(9)
3IN −
(12)
+
4IN +
(14)
4OUT
(13)
4IN −
(11)
V
CC − /GND
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4
4 MILS MINIMUM
T
max = 150 C
J
TOLERANCES ARE 10%.
ALL DIMENSIONS ARE IN MILS.
PIN (11) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.