IC OPAMP GP 1.7MHZ QUAD 14SOIC

 

TLV2344IDG4

Manufacturer Part NumberTLV2344IDG4
DescriptionIC OPAMP GP 1.7MHZ QUAD 14SOIC
ManufacturerTexas Instruments
SeriesLinCMOS™
TLV2344IDG4 datasheets

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Specifications of TLV2344IDG4

Amplifier TypeGeneral PurposeNumber Of Circuits4
Slew Rate3.6 V/µsGain Bandwidth Product1.7MHz
Current - Input Bias0.6pAVoltage - Input Offset1100µV
Current - Supply2.7mACurrent - Output / Channel30mA
Voltage - Supply, Single/dual (±)2 V ~ 8 V, ±1 V ~ 4 VOperating Temperature-40°C ~ 85°C
Mounting TypeSurface MountPackage / Case14-SOIC (3.9mm Width), 14-SOL
Lead Free Status / RoHS StatusLead free / RoHS CompliantOutput Type-
-3db Bandwidth-  
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TLV2344Y chip information
This chip, when properly assembled, displays characteristics similar to the TLV2344. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(14)
(12)
(13)
68
(2)
(1)
(3)
TLV2342, TLV2342Y, TLV2344, TLV2344Y
LinCMOS LOW-VOLTAGE HIGH-SPEED
(11)
(8)
(10)
(9)
(6)
(4) (5)
(7)
108
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
OPERATIONAL AMPLIFIERS
SLOS194 – FEBRUARY 1997
V DD
(4)
(3)
+
1IN +
(1)
1OUT
(2)
1IN –
–
(3)
(5)
+
2IN +
(7)
2OUT
(6)
–
2IN –
(10)
+
3IN +
(8)
3OUT
(9)
3IN –
–
(12)
+
4IN +
(14)
4OUT
(13)
4IN –
–
(11)
V DD – /GND
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4
4 MILS MINIMUM
T J max = 150 C
TOLERANCES ARE 10%.
ALL DIMENSIONS ARE IN MILS.
3

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