LMC8101BP National Semiconductor, LMC8101BP Datasheet

IC OP AMP R-R I/O 8-MICROSMD

LMC8101BP

Manufacturer Part Number
LMC8101BP
Description
IC OP AMP R-R I/O 8-MICROSMD
Manufacturer
National Semiconductor
Datasheet

Specifications of LMC8101BP

Amplifier Type
General Purpose
Number Of Circuits
1
Output Type
Rail-to-Rail
Slew Rate
1.2 V/µs
Gain Bandwidth Product
1.3MHz
Current - Input Bias
1pA
Voltage - Input Offset
700µV
Current - Supply
1.1mA
Current - Output / Channel
90mA
Voltage - Supply, Single/dual (±)
2.7 V ~ 10 V, ±1.35 V ~ 5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-MicroSMD
For Use With
LMC8101BPCONV - BOARD EVALUATION LMC8101BP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
-3db Bandwidth
-
Other names
LMC8101BPTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LMC8101BP
Manufacturer:
NS
Quantity:
5 292
Part Number:
LMC8101BPX
Manufacturer:
NSC
Quantity:
18 000
Part Number:
LMC8101BPX
Manufacturer:
NSC
Quantity:
2 867
Part Number:
LMC8101BPX
Manufacturer:
NSC
Quantity:
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© 2004 National Semiconductor Corporation
LMC8101
Rail-to-Rail Input and Output, 2.7V Op Amp in
micro SMD package with Shutdown
General Description
The LMC8101 is a Rail-to-Rail Input and Output high perfor-
mance CMOS operational amplifier. The LMC8101 is ideal
for low voltage (2.7V to 10V) applications requiring Rail-to-
Rail inputs and output. The LMC8101 is supplied in the die
sized micro SMD as well as the 8 pin MSOP packages. The
micro SMD package requires 75% less board space as
compared to the SOT23-5 package. The LMC8101 is an
upgrade to the industry standard LMC7101.
The LMC8101 incorporates a simple user controlled meth-
odology for shutdown. This allows ease of use while reduc-
ing the total supply current to 1nA typical. This extends
battery life where power saving is mandated. The shutdown
input threshold can be set relative to either V
the SL pin (see Application Note section for details).
Other enhancements include improved offset voltage limit,
three times the output current drive and lower 1/f noise when
compared to the industry standard LMC7101 Op Amp. This
makes the LMC8101 ideal for use in many battery powered,
wireless communication and Industrial applications.
Connection Diagrams
8-Pin MSOP
Top View
DS101240
+
10124079
or V
using
Features
V
specified.
n Rail-to-Rail Inputs
n Rail-to-Rail Output
n Packages Offered:
n
n
n Low Supply Current
n Shutdown Current
n Versatile Shutdown feature
n Output Short Circuit Current
n Offset Voltage
n Gain-Bandwidth
n Supply Voltage Range
n THD
n Voltage Noise
Applications
n Portable Communication (voice, data)
n Cellular Phone Power Amp Control Loop
n Buffer AMP
n Active Filters
n Battery Sense
n VCO Loop
S
Swing
= 2.7V, T
micro SMD package
MSOP package
A
= 25˚C, R
Within 35mV of Supplies (R
micro SMD
Top View
L
to V
+
/2, Typical values unless
1.39mm x 1.41mm
3.0mm x 4.9mm
www.national.com
±
<
10µs turn-on
5 mV (max)
10124080
1mA (max)
1µA (max)
May 2004
2.7V-10V
36
L
=2kΩ)
0.18%
10mA
1MHz

Related parts for LMC8101BP

LMC8101BP Summary of contents

Page 1

... LMC7101 Op Amp. This makes the LMC8101 ideal for use in many battery powered, wireless communication and Industrial applications. Connection Diagrams 8-Pin MSOP Top View © 2004 National Semiconductor Corporation Features V = 2.7V specified. ...

Page 2

... Absolute Maximum Ratings If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. ESD Tolerance V differential IN Output Short Circuit Duration + − Supply Voltage (V − Voltage at Input/Output pins Current at Input Pin Current at Output Pin (Notes 3, 12) ...

Page 3

Electrical Characteristics Unless otherwise specified, all limits guaranteed for T Boldface limits apply at the temperature extremes. Symbol Parameter A Large Signal Voltage Gain VOL V Output Swing O High Output Swing Low I Output Short Circuit Current SC ...

Page 4

Electrical Characteristics Unless otherwise specified, all limits guaranteed for T Boldface limits apply at the temperature extremes. Symbol Parameter V Input Offset Voltage OS TCV Input Offset Voltage Average Drift os I Input Bias Current B I Input ...

Page 5

Electrical Characteristics Unless otherwise specified, all limits guaranteed for T Boldface limits apply at the temperature extremes. Symbol Parameter SR Slew Rate (Note 8) f Unity Gain-Bandwidth u GBW Gain Bandwidth Product e Input-Referred Voltage Noise n i ...

Page 6

Typical Performance Characteristics specified Gain/Phase vs. Frequency (R L Gain/Phase vs. Frequency (R Unity Gain Frequency vs. Supply Voltage www.national.com V = 2.7V, Single Supply ± 1.35V) Gain/Phase vs. Frequency (R S 10124002 = ...

Page 7

Typical Performance Characteristics specified (Continued) Unity Gain Frequency and Phase Margin vs. Load PSRR vs. Frequency CMRR vs. Frequency V = 2.7V, Single Supply Unity Gain Frequency and Phase Margin vs. Load 10124007 PSRR vs. Frequency 10124010 Input ...

Page 8

Typical Performance Characteristics specified (Continued) Input Current vs. Temperature V = 10V OUT V vs OUT www.national.com V = 2.7V, Single Supply 10124091 10124083 Supply Current vs. Supply Voltage 10124024 8 ...

Page 9

Typical Performance Characteristics specified (Continued) Delta V vs (Ref V = 1.35V) CM Offset Voltage vs. V SUPPLY Output Positive Swing vs. Supply Voltage + 2.7V, Single Supply, ...

Page 10

Typical Performance Characteristics specified (Continued) Output Negative Swing vs. Supply Voltage Short Circuit Sourcing Current vs. Supply Voltage Step Response 1% settling time and % overshoot vs. Cap Load www.national.com V = 2.7V, Single ...

Page 11

Typical Performance Characteristics specified (Continued) Small Signal Step Response Small Signal Step Response Large Signal Step Response V = 2.7V, Single Supply Large Signal Step Response 10124016 Small Signal Step Response 10124018 Large Signal Step Response 10124020 11 ...

Page 12

Typical Performance Characteristics specified (Continued) Small Signal Step Response Slew Rate vs. Capacitive Load Slew Rate vs. Capacitive Load www.national.com V = 2.7V, Single Supply Slew Rate vs. Supply Voltage 10124022 Slew Rate vs. Capacitive Load 10124039 Slew ...

Page 13

Typical Performance Characteristics specified (Continued) Voltage Noise vs. Frequency THD+N vs. Amplitude Sourcing Current vs. Output Voltage ( 2.7V, Single Supply Voltage Noise vs. V 10124040 THD+N vs. Frequency 10124044 = 2.7V) Sinking Current vs. Output ...

Page 14

Typical Performance Characteristics specified (Continued) Sourcing Current vs. Output Voltage (V Cap Load vs. I www.national.com V = 2.7V, Single Supply 10V) Sinking Current vs. Output Voltage (V S 10124086 OUT 10124088 /2, ...

Page 15

Application Notes SHUTDOWN FEATURES The LMC8101 is capable of being turned off in order to conserve power. Once in shutdown, the device supply cur- rent is drastically reduced (1µA maximum) and the output will be "Tri-stated". The shutdown feature of ...

Page 16

... V Ordering Information Package Part Number LMC8101BP 8-Bump micro SMD Leaded LMC8101BPX LMC8101TP 8-Bump micro SMD Lead Free LMC8101TPX LMC8101MM 8-Pin MSOP LMC8101MMX www.national.com • Isolation resistor between output and cap load: ...

Page 17

... PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. REMAINING PINS ARE NUMBERED COUNTERCLOCKWISE. 5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH PACKAGE LENGTH AND X3 IS PACKAGE HEIGHT. 6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC. Order Package Number LMC8101BP, LMC8101BPCONV or LMC8101BPX 8-Bump micro SMD Package NS Package Number BPA08FFB X = 1.412 ...

Page 18

... Physical Dimensions NOTES: UNLESS OTHERWISE SPECIFIED 1. EPOXY COATING 2. FOR SOLDER BUMP COMPOSITION, SEE “SOLDER INFORMATION”. IN THE PACKAGING SECTION OF THE NATIONAL SEMICONDUCTOR WEB PAGE (www.national.com) 3. RECOMMENDED NON-SOLDER MASK DEFINED LANDING PAD. 4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. ...

Page 19

... BANNED SUBSTANCE COMPLIANCE National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ‘‘Banned Substances’’ as defined in CSP-9-111S2. ...

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