MC78L24ACP Fairchild Semiconductor, MC78L24ACP Datasheet

IC REGULATOR 24V 0.1A 5% TO-92

MC78L24ACP

Manufacturer Part Number
MC78L24ACP
Description
IC REGULATOR 24V 0.1A 5% TO-92
Manufacturer
Fairchild Semiconductor
Datasheet

Specifications of MC78L24ACP

Regulator Topology
Positive Fixed
Voltage - Output
24V
Voltage - Input
Up to 40V
Voltage - Dropout (typical)
1.7V @ 40mA
Number Of Regulators
1
Current - Output
100mA (Max)
Operating Temperature
0°C ~ 125°C
Mounting Type
Through Hole
Package / Case
TO-92-3 (Standard Body), TO-226
Polarity
Positive
Number Of Outputs
1
Output Type
Fixed
Output Voltage
24 V
Output Current
100 mA
Line Regulation
300 mV
Load Regulation
200 mV
Dropout Voltage (max)
1.7 V
Input Voltage Max
30 V
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
0 C
Maximum Power Dissipation
750 mW
Mounting Style
Through Hole
Voltage Regulation Accuracy
5 %
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Limit (min)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
MC78L24ACPFS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
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MC78L24ACPG
Quantity:
2 000
Part Number:
MC78L24ACPG
Manufacturer:
ON Semiconductor
Quantity:
9 650
Company:
Part Number:
MC78L24ACPG
Quantity:
8 000
This is to inform you that a design and/or process change will be made to the following
product(s). This notification is for your information and concurrence.
If you require data or samples to qualify this change, please contact Fairchild Semiconductor
within 30 days of receipt of this notification.
Updated process quality documentation, such as FMEAs and Control Plans, are available for
viewing upon request.
If you have any questions concerning this change, please contact:
PCN Originator:
Name: Lee, Woonbong
E-mail: Woonbong.Lee@notes.fairchildsemi.com
Phone: 82326801758
Implementation of change:
Expected 1st Device Shipment Date: 2008/11/16
Earliest Year/Work Week of Changed Product: 0847
Change Type Description: Bond Wire Material Composition, Lead Frame Composition, Lead
Frame Dimensions (Internal and External)
Description of Change (From): TO92R package assembled in AUK-D using copper leadframe
and Au wire as referenced in table 1
Description of Change (To): TO92R package assembly at AUK-D will utilize Fe leadframe and
Cu wire in addition to the current Copper leadframe and Au wire.(There is no difference in
package dimension and electrical specification)
Reason for Change : To improve product availability and manufacturing flexibility
Qual/REL Plan Numbers : Q20080333
Qualification :
The qualification plan is intended to meet our criteria for qualifying changed BOM(Fe
LF and Cu wire)
Change To
DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL
Technical Contact:
Name: Lee, Woonbong
E-mail: Woonbong.Lee@notes.fairchildsemi.com
Phone: 82326801758
Date Issued On : 2008/08/08
Date Created : 2008/03/18
PCN# : Q1081203
Pg. 1

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MC78L24ACP Summary of contents

Page 1

... This is to inform you that a design and/or process change will be made to the following product(s). This notification is for your information and concurrence. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. Updated process quality documentation, such as FMEAs and Control Plans, are available for viewing upon request ...

Page 2

Results/Discussion for Qual Plan NumberQ20080333 Test: (Autoclave) Lot Device Q20080333AAACLV KA431AZ Q20080333ABACLV KA431AZ Q20080333ACACLV KA431AZ Test: (High Temperature Op Life) Lot Device Q20080333AAHTOL KA431AZ Q20080333ABHTOL Q20080333ACHTOL Test: (High Temperature Storage Life) Lot Device Q20080333AAHTSL Q20080333ABHTSL Q20080333ACHTSL Test: (Temperature Humidity Biased ...

Page 3

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