MCP1727-3302E/SN Microchip Technology, MCP1727-3302E/SN Datasheet
MCP1727-3302E/SN
Specifications of MCP1727-3302E/SN
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MCP1727-3302E/SN Summary of contents
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... DELAY GND 4 5 PWRGD GND 4 © 2007 Microchip Technology Inc. MCP1726 Description The MCP1726 Low Dropout (LDO) linear regulator that provides high current and low output voltages in a very small package. The MCP1726 comes in a fixed (or adjustable) output voltage version, with an output voltage range of 0.8V to 5.0V. The 1A ...
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... MCP1726 Fixed Output Voltage OUT OUT 3 SHDN C 6 DELAY 4 GND PWRGD 5 MCP1726 Adjustable Output Voltage OUT ADJ IN 3 SHDN C 6 DELAY 4 GND PWRGD 1. OUT µ 100 kΩ 1000 pF PWRGD OUT kΩ µ 100 kΩ kΩ 1000 pF PWRGD © 2007 Microchip Technology Inc. ...
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... Functional Block Diagram V IN Undervoltage Lock Out (UVLO) SHDN Overtemperature Sensing V IN SHDN Soft-Start GND © 2007 Microchip Technology Inc. PMOS I SNS Driver w/limit EA and SHDN – SHDN V REF Reference Comp 92 REF MCP1726 V OUT ADJ PWRGD T DELAY C DELAY DS21936C-page 3 ...
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... Peak Current LOAD 2. 6.0V OUT 6.0V ADJ ppm/°C Note 3 V Note 1A 2.3V OUT IN(MIN) (Note 5) DROPOUT. is the desired set point output R is the highest voltage measured over the ). Exceeding the maximum allowable power © 2007 Microchip Technology Inc. ...
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... The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the desired junction temperature. The test time is small enough such that the rise in the junction temperature over the ambient temperature is not significant. © 2007 Microchip Technology Inc 0.5V) or 2.3V, whichever is greater, I ...
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... J T — — +150 J T -65 — +150 A θ — 41 — JA θ — 150 — JA Units Conditions °C Steady State °C Transient °C °C/W 4-Layer JC51-7 Standard Board with vias °C/W 4-Layer JC51-7 Standard Board © 2007 Microchip Technology Inc. ...
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... OUT 140 V = 5.0V IN 130 2.5V IN 120 110 100 Temperature (°C) FIGURE 2-3: Quiescent Current vs. Junction Temperature (1.2V Adjustable). © 2007 Microchip Technology Inc 0.5V and T = +25°C. OUT OUT A 0.05 0.04 0.03 0.02 0.01 0 -0.01 -0.02 5.3 5.8 FIGURE 2-4: Temperature (1 ...
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... Input Voltage (V) Quiescent Current vs. Input V =3.3V OUT OUT +125°C +25°C -40°C Input Voltage (V) Quiescent Current vs. Input = 2.3V for 0.8V device V =3.3V OUT V =0.8V OUT 200 400 600 800 1000 Load Current (mA) Ground Current vs. Load © 2007 Microchip Technology Inc. ...
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... OUT 0.005 0 I =500 mA OUT -0.005 -0.01 -0.015 I =100 mA OUT -0.02 -0.025 Temperature (°C) FIGURE 2-15: Line Regulation vs. Temperature (0.8V Fixed) © 2007 Microchip Technology Inc 0.5V and T = +25°C. OUT OUT A 0.025 V OUT 0.02 0.015 0.01 0.005 0 -0.005 -0.01 FIGURE 2-16: Temperature (3 ...
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... Frequency (kHz) Output Noise Voltage V = 1.2V OUT V = 2. 100 1000 Frequency (kHz) Power Supply Ripple = 1.2V OUT V = 1.2V OUT V = 2. 100 1000 Frequency (kHz) Power Supply Ripple = 1.2V OUT © 2007 Microchip Technology Inc. ...
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... OUT 0 0.01 0 Frequency (kHz) FIGURE 2-26: Power Supply Ripple Rejection (PSRR) vs. Frequency (V Fixed). V OUT PWRGD V IN FIGURE 2-27: 2.5V (Adj.) Startup from V © 2007 Microchip Technology Inc 0.5V and T = +25°C. OUT OUT 2.5V OUT OUT SHDN 100 1000 FIGURE 2-28 ...
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... OUT OUT A V OUT µ µF OUT I OUT V IN FIGURE 2-33: (2.5V Fixed 1000 mA). V OUT µ µF OUT I OUT V IN FIGURE 2-34: (2.5V Fixed, 100 mA to 1000 mA). Dynamic Load Response Dynamic Load Response © 2007 Microchip Technology Inc. ...
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... For fixed output voltage versions greater than 2.5V, the hysteresis is 0.7%. The PWRGD output is delayed on power-up by 200 µs (typical, no capaci- tance on C pin). This delay time is controlled by DELAY the C pin. DELAY © 2007 Microchip Technology Inc. Table 3-1. Name Description V Input Voltage Supply IN V ...
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... ESR of 50 milli-ohms. Larger LDO output capacitors can be used with the R 2 MCP1726 to improve dynamic performance and power supply ripple rejection performance. A maximum of 22 µF is recommended. capacitors are not recommended for low-temperature applications of < -25° Aluminum-electrolytic © 2007 Microchip Technology Inc. ...
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... Figure 4-3. © 2007 Microchip Technology Inc. The power good output is an open-drain output that can be pulled up to any voltage that is equal to or less than the LDO input voltage. This output is capable of sinking 1 ...
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... LDO. For applications with input voltages near 2.3V, these PCB trace voltage drops can sometimes lower the input voltage enough to trigger a shutdown due to undervoltage lockout. Figure 4-5 for a timing diagram 400 ns (typ) 70 µs Shutdown Input Timing © 2007 Microchip Technology Inc. ...
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... The junction temperature of the die is a function of power dissipation, ambient temperature and package thermal resistance. See Section 5.0 “Application Circuits/Issues” for more information on LDO power dissipation and junction temperature. © 2007 Microchip Technology Inc. MCP1726 DS21936C-page 17 ...
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... LDO pin with no IN LDO output current (LDO quiescent current) ) term. Because of the CMOS construc- for the MCP1726 is 140 µA. GND C To estimate ° the JA C/W. ° × Rθ TOTAL JA AMAX temperature ambient © 2007 Microchip Technology Inc. ...
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... Rise in device junction temperature J(RISE) over the ambient temperature T = Ambient temperature A © 2007 Microchip Technology Inc. 5.3 Typical Application Internal power dissipation, junction temperature rise, junction temperature and maximum power dissipation is calculated in the following example. The power dissi- pation as a result of ground current is small enough to be neglected ...
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... DFN package. The exposed tab of the DFN package provides a very good thermal path from the die of the LDO to the PCB. The PCB then acts like a heatsink, providing more area to distribute the heat generated by the LDO. DS21936C-page 20 © 2007 Microchip Technology Inc. ...
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... Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. © 2007 Microchip Technology Inc. Example Voltage Code Option ...
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... BSC A 0.80 A1 0.00 A3 0.20 REF D 3.00 BSC E2 0.00 E 3.00 BSC D2 0.00 b 0.25 L 0. NOTE NOM MAX 8 0.90 1.00 0.02 0.05 – 1.60 – 2.40 0.30 0.35 0.30 0.55 – – Microchip Technology Drawing C04-062B © 2007 Microchip Technology Inc. ...
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... Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. © 2007 Microchip Technology Inc ...
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... MCP1726 NOTES: DS21936C-page 24 © 2007 Microchip Technology Inc. ...
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... System (PIS) section. Revision B (March 2005) The following is the list of modifications: 1. Replaced 3x3 DFN package diagram. 2. Emphasized (bolded) a few specifications of Section 1.0 “Electrical Characteristics” in the DC Characteristics table. Revision A (February 2005) • Original Release of this Document. © 2007 Microchip Technology Inc. MCP1726 DS21936C-page 25 ...
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... MCP1726 NOTES: DS21936C-page 26 © 2007 Microchip Technology Inc. ...
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... Tolerance 2 = 2.0% Temperature Range E = -40°C to +125°C Package * SN = Plastic SOIC, (150 mil Body) 8-Lead MF = Plastic Dual Flat No Lead, 3x3 mm Body (DFN), 8-Lead *Both packages are Lead Free. © 2007 Microchip Technology Inc. Examples MCP1726-0802E/MF: 0.8V, 1A LDO, Temp. Package Range b) MCP1726-1202E/SN: 1.20V, 1A LDO, c) MCP1726T-1802E/MF:Tape and Reel, 1 ...
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... MCP1726 NOTES: DS21936C-page 28 © 2007 Microchip Technology Inc. ...
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... PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. ...
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