ADP3335ARM-3.3-RL7 Analog Devices Inc, ADP3335ARM-3.3-RL7 Datasheet - Page 5

IC REG LDO 3.3V 500MA 8-MSOP

ADP3335ARM-3.3-RL7

Manufacturer Part Number
ADP3335ARM-3.3-RL7
Description
IC REG LDO 3.3V 500MA 8-MSOP
Manufacturer
Analog Devices Inc
Series
anyCAP®r
Datasheet

Specifications of ADP3335ARM-3.3-RL7

Rohs Status
RoHS non-compliant
Regulator Topology
Positive Fixed
Voltage - Output
3.3V
Voltage - Input
Up to 12V
Voltage - Dropout (typical)
0.2V @ 500mA
Number Of Regulators
1
Current - Output
500mA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
Current - Limit (min)
-
Other names
ADP3335ARM-3.3RL7
ADP3335ARM-3.3RL7
ADP3335ARM3.3R7TR

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PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Table 3. Pin Function Descriptions
Pin No.
1, 2, 3
4
5
6
7, 8
EP
Mnemonic
OUT
GND
NR
SD
IN
Exposed
Pad
Function
Output of the Regulator. Bypass to ground with a 1.0 μF or larger capacitor. All pins must be connected together
for proper operation.
Ground Pin.
Noise Reduction Pin. Used for further reduction of output noise (see the Noise Reduction section for further
details).
Active Low Shutdown Pin. Connect to ground to disable the regulator output. When shutdown is not used, this
pin should be connected to the input pin.
Regulator Input. All pins must be connected together for proper operation.
The exposed pad on the bottom of the LFCSP package enhances thermal performance and is electrically
connected to the die substrate, which is electrically common with the input pins, IN (Pin 7 and Pin 8), inside the
package.
NOTES
1. THE EXPOSED PAD ON THE BOTTOM OF THE PACKAGE
ENHANCES THE THERMAL PERFORMANCE AND IS
ELECTRICALLY CONNECTED TO DIE SUBSTRATE.
THERMAL VIAS MUST BE ISOLATED OR CONNECTED
TO IN. DO NOT CONNECT THE THERMAL PAD TO
GROUND.
OUT
GND
OUT
OUT
GND
OUT
OUT
OUT
1
2
3
4
Figure 3. 8-Lead MSOP
Figure 4. 8-Lead LFCSP
1
2
3
4
Rev. B | Page 5 of 16
(Not to Scale)
(Not to Scale)
ADP3335
ADP3335
TOP VIEW
TOP VIEW
8
7
6
5
8
7
6
5
IN
IN
SD
NR
IN
SD
NR
IN
ADP3335

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