MCT0603MD4701BP100 Vishay, MCT0603MD4701BP100 Datasheet - Page 4

• Manufacturer Part Number: MCT0603MD4701BP100
• Description: RES 4.7K OHM 0.125W 0.1% 0603
• Manufacturer: Vishay
• Series: MCT 0603r

Specifications of MCT0603MD4701BP100

• Temperature Coefficient: ±25ppm/°C
• Resistance (ohms): 4.7K
• Power (watts): 0.125W, 1/8W
• Composition: Thin Film
• Tolerance: ±0.1%
• Size / Dimension: 0.061" L x 0.033" W (1.55mm x 0.85mm)
• Height: 0.018" (0.45mm)
• Lead Style: Surface Mount (SMD - SMT)
• Package / Case: 0603 (1608 Metric)
• Resistance In Ohms: 4.70K
• Case: 0603 (1608 metric)
• Resistance: 4.7kohm
• Resistance Tolerance: ± 0.1%
• Power Rating: 125mW
• Voltage Rating: 75V
• Resistor Element Material: Thin Film
• Resistor Case Style: 0603
• No.: RoHS Compliant
• Termination Style: SMD/SMT
• Dimensions: 0.85 mm W x 1.55 mm L x 0.45 mm H
• Product: Thin Film Resistors SMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Details
• Other names: MCT0603-4.7K-MBTR

DIMENSIONS
SOLDER PAD DIMENSIONS
Note
• The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of
Document Number: 28785
Revision: 19-Nov-09
DIMENSIONS AND MASS
TYPE
MCS 0402 AT
MCT 0603 AT
MCU 0805 AT
MCA 1206 AT
RECOMMENDED SOLDER PAD DIMENSIONS
TYPE
MCS 0402 AT
MCT 0603 AT
MCU 0805 AT
MCA 1206 AT
power dissipation may raise the temperature of the solder joint, hence special solder alloys or boardmaterials may be required to maintain the
reliability of the assembly. Specified power rating above 125 °C requires dedicated heat-sink pads, which depend on boardmaterials.
The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or in
publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other
parameters.
Still, the given solder pad dimensions will be found adequate for most general applications, e.g. those referring to “standard operation mode”.
Please note however that applications for “power operation mode” require special considerations for the design of solder pads and adjacent
conductor areas.
0.45 + 0.1/- 0.05
0.32 ± 0.05
MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision
0.52 ± 0.1
0.55 ± 0.1
(mm)
0.55
0.80
1.40
(mm)
G
-
H
3.2 + 0.1/- 0.2
(mm)
WAVE SOLDERING
1.55 ± 0.05
1.10
1.25
1.50
1.0 ± 0.05
2.0 ± 0.1
Y
-
(mm)
H
For technical questions, contact:
L
Precision Thin Film Chip Resistors
W W
Superior Moisture Resistivity
T
(mm)
1.10
1.50
1.90
T
X
2
-
1.25 ± 0.15
0.5 ± 0.05
0.85 ± 0.1
1.6 ± 0.15
(mm)
W
T
1
Z
(mm)
2.75
3.30
4.40
L
Z
-
> 75 % of W
> 75 % of W
> 75 % of W
> 75 % of W
G
[e-mail]
(mm)
W
T
Y
(mm)
0.35
0.65
0.90
1.50
G
0.2 + 0.1/- 0.15
0.3 + 0.15/- 0.2
0.4 + 0.1/- 0.2
0.5 ± 0.25
(mm)
T
1
REFLOW SOLDERING
X
(mm)
0.55
0.70
0.90
1.15
Y
0.3 + 0.15/- 0.2
0.4 + 0.1/- 0.2
Vishay Beyschlag
0.5 ± 0.25
0.2 ± 0.1
(mm)
T
2
(mm)
0.55
0.95
1.40
1.75
X
www.vishay.com
MASS
(mg)
(mm)
0.6
1.9
4.6
9.2
1.45
2.05
2.70
3.80
Z
291