MCT0603MD4701BP100 Vishay, MCT0603MD4701BP100 Datasheet - Page 8

• Manufacturer Part Number: MCT0603MD4701BP100
• Description: RES 4.7K OHM 0.125W 0.1% 0603
• Manufacturer: Vishay
• Series: MCT 0603r

Specifications of MCT0603MD4701BP100

• Temperature Coefficient: ±25ppm/°C
• Resistance (ohms): 4.7K
• Power (watts): 0.125W, 1/8W
• Composition: Thin Film
• Tolerance: ±0.1%
• Size / Dimension: 0.061" L x 0.033" W (1.55mm x 0.85mm)
• Height: 0.018" (0.45mm)
• Lead Style: Surface Mount (SMD - SMT)
• Package / Case: 0603 (1608 Metric)
• Resistance In Ohms: 4.70K
• Case: 0603 (1608 metric)
• Resistance: 4.7kohm
• Resistance Tolerance: ± 0.1%
• Power Rating: 125mW
• Voltage Rating: 75V
• Resistor Element Material: Thin Film
• Resistor Case Style: 0603
• No.: RoHS Compliant
• Termination Style: SMD/SMT
• Dimensions: 0.85 mm W x 1.55 mm L x 0.45 mm H
• Product: Thin Film Resistors SMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Details
• Other names: MCT0603-4.7K-MBTR

Document Number: 28785
Revision: 19-Nov-09
TEST PROCEDURES AND REQUIREMENTS
4.37
4.40
4.22
4.17.2
4.18.2
4.29
4.32
4.33
4.7
4.35
CLAUSE
60115-1
EN
METHOD
21 (Ue
21 (Ue
60068-2
45 (XA)
58 (Td)
58 (Td)
6 (Fc)
TEST
IEC
-
-
-
-
MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision
3
1
)
)
(Electro Static Discharge)
standard operation mode
Component solvent
Substrate bending
Shear (adhesion)
Periodic electric
soldering heat
Resistance to
Voltage proof
Flammability
Solderability
resistance
overload;
Vibration
TEST
ESD
For technical questions, contact:
Precision Thin Film Chip Resistors
Superior Moisture Resistivity
(equivalent to MIL-STD-883,
Stability for product types:
SnPb40; non-activated flux
Isopropyl alcohol + 50 °C;
SnAg3Cu0.5 or SnAg3.5;
Endurance by sweeping;
(215 ± 3) °C; (3 ± 0.3) s
(235 ± 3) °C; (2 ± 0.2) s
(260 ± 5) °C; (10 ± 1) s
Needle flame test; 10 s
U
amplitude ≤ 1.5 mm or
MCS 0402 AT: 500 V
MCT 0603 AT: 1000 V
MCU 0805 AT: 1500 V
MCA 1206 AT: 2000 V
Depth 2 mm, 3 times
U =
Solder bath method;
Solder bath method;
Solder bath method;
RMS
non-activated flux;
0.1 s on; 2.5 s off;
10 Hz to 2000 Hz;
RR 3216M; 45 N
RR 1608M; 9 N
IEC 61340-3-1;
RR 1005M and
RR 2012M and
3 pos. + 3 neg.
≤ 200 m/s
PROCEDURE
no resonance;
Method 3015)
≤ 2 x U
1000 cycles
= U
method 2
15 x P
ins
MCU 0805 AT
MCA 1206 AT
MCS 0402 AT
MCT 0603 AT
[e-mail]
; (60 ± 5) s
max.
2
70
; 6 h
;
x R
no visible damage; no open circuit in bent position
STABILITY CLASS 0.25 OR BETTER
Good tinning (≥ 95 % covered);
Good tinning (≥ 95 % covered);
PERMISSIBLE CHANGE (ΔR)
No flashover or breakdown
± (0.05 % R + 0.01 Ω)
± (0.05 % R + 0.01 Ω)
± (0.05 % R + 0.01 Ω)
No burning after 30 s
± (0.5 % R + 0.05 Ω)
± (0.5 % R + 0.05 Ω)
No visible damage
No visible damage
REQUIREMENTS
no visible damage
no visible damage
no visible damage
no visible damage
47 Ω to 100 kΩ
47 Ω to 100 kΩ
47 Ω to 100 kΩ
47 Ω to 47 kΩ
Vishay Beyschlag
www.vishay.com
(1)
295