B72724A8151V62 EPCOS Inc, B72724A8151V62 Datasheet

Page 1

Ceramic transient voltage suppressors SMD multilayer transient voltage suppressors, high-speed series Series/Type: Date: November 2010 © EPCOS AG 2010. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. ...

Page 2

Multilayer varistors (MLVs) High-speed series EPCOS type designation system for high-speed series CA 04 Construction: CT Single chip with nickel barrier termination (AgNiSn) CA Chip array with nickel barrier termination (AgNiSn) Case sizes: 0201 0201 single chip 0402 0402 single ...

Page 3

Multilayer varistors (MLVs) High-speed series Features ESD protection level acc. to ISO 10605, IEC 61000-4-2 level 4 Bidirectional protection Capacitance ratings down Low insertion loss Low leakage current No signal distortion RoHS-compatible Suitable for lead-free soldering Applications ...

Page 4

Multilayer varistors (MLVs) High-speed series General technical data Maximum RMS operating voltage Maximum DC operating voltage Contact discharge ESD capability Air discharge ESD capability Maximum surge current Typical capacitance Maximum clamping voltage Operating temperature Operating temperature Storage temperature Storage temperature ...

Page 5

Multilayer varistors (MLVs) High-speed series Electrical specifications and ordering codes Maximum ratings (T ) op,max Type Ordering code 2-fold array CA04P2S14THSG B72762A8140S160 CA04P2V150THSG B72762A8251V060 4-fold array CA05P4S14THSG B72714A8140S160 CA06P4V150THSG B72724A8151V062 Single chip CT0201S4AHSG B72440T8040S160 CT0402S14AHSG B72590T8140S160 CT0402V150HSG B72590T8151V060 CT0603S14AHSG B72500T8140S160 ...

Page 6

Multilayer varistors (MLVs) High-speed series Dimensional drawings Single chip Dimensions in mm Case size l w EIA / mm 0201 / 0603 0.60 0.03 0.30 0.03 0402 / 1005 1.00 0.15 0.50 0.10 0405 / 1014 1.37 0.15 1.00 +0/ ...

Page 7

Multilayer varistors (MLVs) High-speed series Recommended solder pad layout Single chip Dimensions in mm Case size EIA / mm 0201 / 0603 Single chip 0402 / 1005 Single chip 0603 / 1608 Single chip 0405 / 1014 2-fold array 0508 ...

Page 8

Multilayer varistors (MLVs) High-speed series Taping and packing 1 Taping and packing for SMD components 1.1 Blister tape (the taping to IEC 60286-3) Dimensions in mm 8-mm tape Case size (inch/mm) 0508/ 1220 0603/ 0506/ 0805/ 1608 1216 2012 A ...

Page 9

Multilayer varistors (MLVs) High-speed series Part orientation in tape pocket for blister tape For discrete chip, case sizes 0603, 0805, 1206, 1210, 1812 and 2220 For arrays 0506 and 1012 Additional taping information Reel material Tape material Tape break force ...

Page 10

Multilayer varistors (MLVs) High-speed series 1.2 Cardboard tape (taping to IEC 60286-3) Dimensions in mm 0201/0603 0402/1005 0405/1012 0603/1608 1003/2508 0508/1220 A 0.38 0.05 0. 0.68 0.05 1. 0.35 0.02 0.60 T 0.4 min. 0.70 2 ...

Page 11

Multilayer varistors (MLVs) High-speed series Part orientation in tape pocket for cardboard tape For discrete chip case sizes 0201, 0402, 0603 and 1003 For array case size 0508 Additional taping information Reel material Tape material Tape break force Top cover ...

Page 12

Multilayer varistors (MLVs) High-speed series 1.3 Reel packing Dimensions in mm 8-mm tape 180-mm reel 330-mm reel A 180 3/+0 W 8.4 +1. 14.4 max. 2 Leader, trailer Please read Cautions and warnings and Important notes at ...

Page 13

Multilayer varistors (MLVs) High-speed series 1.4 Packing units for discrete chip and array chip Case size Chip thickness inch/mm th 0201/0603 0.33 mm 0402/1005 0.6 mm 0405/1012 0.7 mm 0506/1216 0.5 mm 0508/1220 0.9 mm 0603/1608 0.9 mm 0612/1632 0.9 ...

Page 14

Multilayer varistors (MLVs) High-speed series 2 Delivery mode for leaded SHCV varistors Standard delivery mode for SHCV types is bulk. Alternative taping modes (AMMO pack or taped on reel) are available upon request. Packing units for: Type Pieces SR6 2000 ...

Page 15

Multilayer varistors (MLVs) High-speed series Soldering directions 1 Terminations 1.1 Nickel barrier termination The nickel barrier layer of the silver/nickel/tin termination prevents leaching of the silver base met- allization layer. This allows great flexibility in the selection of soldering parameters. ...

Page 16

Multilayer varistors (MLVs) High-speed series 1.3 Silver-platinum termination Silver-platinum terminations are mainly used for the large case sizes 1812 and 2220. The silver- platinum termination is approved for reflow soldering, SnPb soldering and lead-free soldering with a silver containing solder ...

Page 17

Multilayer varistors (MLVs) High-speed series Profile feature Preheat and soak - Temperature min - Temperature max - Time Average ramp-up rate Liquidous temperature Time at liquidous Peak package body temperature T Time ( within specified ...

Page 18

Multilayer varistors (MLVs) High-speed series 2.3 Lead-free soldering processes EPCOS multilayer CTVS with AgNiSn termination are designed for the requirements of lead-free soldering processes only. Soldering temperature profiles to JEDEC J-STD-020D, IEC 60068-2-58 and ZVEI recommenda- tions. 3 Recommended soldering ...

Page 19

Multilayer varistors (MLVs) High-speed series 3.5 Tinned copper alloy All EPCOS CU types with tinned termination are approved for lead-free and SnPb soldering. 3.6 Tinned iron wire All EPCOS SHCV types with tinned termination are approved for lead-free and SnPb ...

Page 20

Multilayer varistors (MLVs) High-speed series Good and poor solder joints caused by amount of solder in reflow soldering. 5 Conductive adhesion Attaching surface-mounted devices (SMDs) with electrically conductive adhesives is a commer- cially attractive method of component connection to supplement ...

Page 21

Multilayer varistors (MLVs) High-speed series A further advantage of adhesion is that the components are subjected to virtually no temperature shock at all. The curing temperatures of the adhesives are between 120 C and 180 C, typical curing times are ...

Page 22

Multilayer varistors (MLVs) High-speed series Note: Leaching of the termination Effective area at the termination might be lost if the soldering temperature and/or immersion time are not kept within the recommended conditions. Leaching of the outer electrode should not ex- ...

Page 23

Multilayer varistors (MLVs) High-speed series 7.5 Adhesive application Thin or insufficient adhesive causes chips to loosen or become disconnected during curing. Low viscosity of the adhesive causes chips to slip after mounting advised to consult the manufacturer of ...

Page 24

Multilayer varistors (MLVs) High-speed series 7.10 Standards CECC 00802 IEC 60068-2-58 IEC 60068-2-20 JEDEC J-STD-020D Please read Cautions and warnings and Important notes at the end of this document. Page ...

Page 25

Multilayer varistors (MLVs) High-speed series Symbols and terms Symbol Term C Typical capacitance per line line,typ C Maximum capacitance max C Minimum capacitance min C Nominal capacitance nom C Tolerance of nominal capacitance nom C Typical capacitance typ f Minimum ...

Page 26

Multilayer varistors (MLVs) High-speed series V Maximum AC operating voltage, root-mean-square value RMS,max V Varistor voltage (also termed breakdown voltage Minimum varistor voltage V,min V Maximum varistor voltage V,max V Tolerance of varistor voltage V W Maximum load ...

Page 27

Multilayer varistors (MLVs) High-speed series Cautions and warnings General Some parts of this publication contain statements about the suitability of our ceramic transient voltage suppressor (CTVS) components (multilayer varistors (MLVs), CeraDiodes, ESD/EMI filters, SMD disk varistors (CU types), leaded transient ...

Page 28

Multilayer varistors (MLVs) High-speed series Specified values only apply to CTVS components that have not been subject to prior electrical, mechanical or thermal damage. The use of CTVS devices in line-to-ground applications is therefore not advisable, and it is only ...

Page 29

Multilayer varistors (MLVs) High-speed series Conductive adhesive gluing Only multilayer varistors (MLVs) with an AgPd termination are approved for conductive adhesive gluing. Operation Use CTVS only within the specified operating temperature range. Use CTVS only within specified voltage and current ...

Page 30

Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical ...