RR0816P-164-D Susumu, RR0816P-164-D Datasheet - Page 7

RES 160K OHM 1/16W .5% 0603 SMD

RR0816P-164-D

Manufacturer Part Number
RR0816P-164-D
Description
RES 160K OHM 1/16W .5% 0603 SMD
Manufacturer
Susumu
Series
RRr
Datasheet

Specifications of RR0816P-164-D

Resistance (ohms)
160K
Power (watts)
0.063W, 1/16W
Composition
Thin Film
Temperature Coefficient
±25ppm/°C
Tolerance
±0.5%
Size / Dimension
0.063" L x 0.031" W (1.60mm x 0.80mm)
Height
0.016" (0.40mm)
Lead Style
Surface Mount (SMD - SMT)
Package / Case
0603 (1608 Metric)
Resistance In Ohms
160K
Case
0603 (1608 metric)
Resistance
160 KOhms
Power Rating
0.0625 Watt (1/16 Watt)
Voltage Rating
75 Volts
Operating Temperature Range
- 55 C to + 125 C
Termination Style
SMD/SMT
Dimensions
0.8 mm W x 1.6 mm L x 0.4 mm H
Product
Thin Film Resistors SMD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
 Details
Other names
RR0816P164D
RR08P160KDTR
TITLE:
6.2.2 Body strength
6.2.3 Resistance to soldering heat
6.2.4 Solderability
Method;
(1) Solder bath method
(2) Reflow soldering method
(3) Soldering iron method
Specification:
Method;
Specification:
Method;
The resistor shall be stored at standard atmospheric conditions for 1 hr after which the measurements shall
be made.
For other procedures, refer to IEC 60115-1, Sub-clause 4.18.
A new uniform coating of solder shall cover minimum of 95% of the surface being immersed.
A load of 10 N {1.02kgf} using a R0.5 pressure rod shall be applied
to the center in the direction of arrow and held for 10 s.
Change in resistance : ±(0.5%+0.05Ω)
Without mechanical damage.
Electrical characteristics shall be satisfied.
Temperature of solder
Duration of immersion
For other procedures, refer to IEC 60115-1, Sub-clause 4.17.
Specification;
The heating apparatus shall be the upper-heated oven and the temperature shall be board surface
temperature.
Preheat
Temperature
Peak temperature
Temperature
Bit temperature
Time
Change in resistance
Without mechanical damage such as breaks.
Chip resistor RR0816 series
Specification for
3 +1/0 s.
:
350±5deg C
100∼110deg C
260±5deg C
220deg C over
270±5deg C
2±0.5 s.
235±5deg C
245±5deg C
±(0.5%+0.05Ω)
10 sec. or less
60 s. max.
SUSUMU
(Solder alloy: Sn-37Pb)
CO.,LTD
(Solder alloy: Sn-3Ag-0.5Cu)
10±1 s.
30 s.
SPEC.NO:
RR00-1098
1/2
R0.5
Pressurizing jig
Specimen
Rev. No.
0
7/16

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