CRCW08053K65FKEAHP Vishay, CRCW08053K65FKEAHP Datasheet - Page 5

RES 3.65K OHM .33W 1% 0805 SMD

CRCW08053K65FKEAHP

Manufacturer Part Number
CRCW08053K65FKEAHP
Description
RES 3.65K OHM .33W 1% 0805 SMD
Manufacturer
Vishay
Series
CRCW-HPr
Datasheet

Specifications of CRCW08053K65FKEAHP

Resistance (ohms)
3.65K
Power (watts)
0.333W, 1/3W
Composition
Thick Film
Features
Pulse Withstanding
Temperature Coefficient
±100ppm/°C
Tolerance
±1%
Size / Dimension
0.079" L x 0.049" W (2.00mm x 1.25mm)
Height
0.020" (0.50mm)
Lead Style
Surface Mount (SMD - SMT)
Package / Case
0805 (2012 Metric)
Resistance In Ohms
3.65K
Case
0805 (2012 metric)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
CRCW-HP e3
Vishay Draloric
All tests are carried out in accordance with the following specifications:
• EN 60115-1, generic specification
• EN 140400, sectional specification
• EN 140401-802, detail specification
• IEC 60068-2, environmental test procedures
Packaging of components is done in paper or blister tapes according to IEC 60286-3.
www.vishay.com
174
CLAUSE
60115-1
TEST PROCEDURES AND REQUIREMENTS
4.5
4.7
4.13
4.17.2
4.8.4.2
4.32
4.33
4.19
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
4.25.1
4.18.2
4.35
4.24
4.25.3
4.40
4.29
4.30
4.22
4.37
4.27
EN
METHOD
78 (Cab)
60068-2
21 (U
21 (U
45 (XA)
45 (XA)
58 (Td)
14 (Na)
30 (Db)
30 (Db)
58 (Td)
13 (M)
2 (Ba)
1 (Aa)
TEST
6 (Fc)
IEC
-
-
-
-
-
-
-
-
-
-
-
-
U3
U1
)
)
Single pulse high voltage overload,
Vibration, endurance by sweeping
Flammability, needle flame test
Component solvent resistance
Solvent resistance of marking
Rapid change of temperature
Resistance to soldering heat
upper category temperature
Periodic electric overload
Damp heat, steady state
Temperature coefficient
Electrostatic discharge
(human body model)
Endurance at 70 °C
Short time overload
Substrate bending
Damp heat, cyclic
Damp heat, cyclic
Shear (adhesion)
Low air pressure
Voltage proof
Endurance at
10 µs/700 µs
Solderability
Resistance
Pulse Proof, High Power Thick Film Chip Resistors
D.C. load
Dry heat
TEST
cold
-
For technical questions, contact:
Solder bath method; (260 ± 5) °C; (10 ± 1) s
non-activated flux; (235 ± 5) °C; (2 ± 0.2) s
non-activated flux; (245 ± 5) °C; (3 ± 0.3) s
discharges; ESD voltage according to size
Stability for product types:
IEC 61340-3-1; 3 positive and 3 negative
≤ 2 × U
Solder bath method; Sn96.5Ag3Cu0.5;
f = 10 Hz to 2000 Hz; x, y, z ≤ 1.5 mm;
0.1 s “ON”; 2.5 s “OFF”; 1000 cycles
30 min. at - 55 °C; 30 min at 125 °C
(40 ± 2) °C; (93 ± 3) % RH; 56 days
Isopropyl alcohol; 50 °C; method 1;
(20/- 55/20) °C and (20/125/20) °C
Isopropyl alcohol; 50 °C; method 2
A ≤ 200 m/s
U
Solder bath method; Sn60Pb40;
Û
55 °C; ≥ 90 % RH; 24 h; 1 cycle
55 °C; ≥ 90 % RH; 24 h; 5 cycle
=
=
RR 1608 and smaller: 9 N
RR 2012 and larger: 45 N
max.
1 kPa; (25 ± 10) °C; 1 h
U
10 x
IEC 60695-15-5; 10 s
Depth 2 mm; 3 times
U
15 x P
U = 1.4 x U
1.5 h on; 0.5 h off;
; duration: According to style
=
U
=
155 °C; 1000 h
thickfilmchip@vishay.com
PROCEDURE
70 °C; 1000 h
70 °C; 8000 h
125 °C; 16 h
1000 cycles
- 55 °C; 2 h
toothbrush
2.5 x
=
P
2
10 pulses
5 cycles
P
; 10 sweeps per axis
70
70
70
P
-
-
x R
x R
x R
70
ins
P
x R
; 60 s
70
U
CRCW-HP e3
2 x U
2 x U
x R
max.
max.
max.
STABILITY CLASS 2 OR BETTER
REQUIREMENTS PERMISSIBLE
Good tinning (≥ 95 % covered)
Good tinning (≥ 95 % covered)
no open circuit in bent position
± 100 ppm/K, ± 200 ppm/K
± (0.25 % R + 0.05 Ω)
No burning after 30 s
± (0.5 % R + 0.05 Ω)
± (0.5 % R + 0.05 Ω)
± (0.5 % R + 0.05 Ω)
± (0.5 % R + 0.05 Ω)
No visible damage,
± (1 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
No visible damage
No visible damage
no visible damage
no visible damage
no visible damage
± (2 % R + 0.1 Ω)
± (4 % R + 0.1 Ω)
± (2 % R + 0.1 Ω)
± (2 % R + 0.1 Ω)
Marking legible,
Document Number: 20043
CHANGE (ΔR)
± 1 %, ± 5 %
1 Ω to 1 MΩ
Revision: 08-Dec-10
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