AXN320038P Panasonic Electric Works, AXN320038P Datasheet - Page 5

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AXN320038P

Manufacturer Part Number
AXN320038P
Description
CONN SOCKET .8MM 20POS SMD
Manufacturer
Panasonic Electric Works
Series
P8r
Datasheet

Specifications of AXN320038P

Connector Type
Socket, Center Strip Contacts
Number Of Positions
20
Pitch
0.031" (0.80mm)
Number Of Rows
2
Mounting Type
Surface Mount
Features
Board Guide
Contact Finish
Gold
Mated Stacking Heights
3mm, 4mm, 5mm
Height Above Board
0.087" (2.20mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Contact Finish Thickness
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AXN320038P
Manufacturer:
Panasonic Electric Works
Quantity:
12 000
AXN(1/3/4)
SPECIFICATIONS
1. Characteristics
2. Material and surface treatment
Electrical
characteristics
Mechanical
characteristics
Environmental
characteristics
Lifetime
characteristics
Unit weight
Molded portion
Part name
Bracket
Contact
Panasonic Corporation
Rated current
Rated voltage
Breakdown voltage
Insulation resistance
Contact resistance
Composite insertion force
Composite removal force
Contact holding force
Ambient temperature
Soldering heat resistance
Storage temperature
Thermal shock resistance
(header and socket mated)
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
H
(header and socket mated)
SO
(header and socket mated)
Insertion and removal life
2
S resistance
Item
2
resistance
Heat-resistant resin
Copper alloy
(UL94V-0)
Material
3.0mm, 3.5mm, 4.0mm, 4.5mm, 5.0mm, 5.5mm,
6.0mm, 7.0mm, 8.0mm, 13.0mm, 14.0mm type
Automation Controls Business Unit
Contact portion:
Ni plating on base, Au plating on surface
Terminal portion:
Ni plating on base, Au plating on surface
(Except for thick of terminal)
5.0mm, 5.5mm, 6.0mm, 7.0mm,
5 cycles,
120 hours, insulation resistance
24 hours, insulation resistance
48 hours, contact resistance
48 hours, contact resistance
50 times
Mated height 3mm 30 pin contacts; Socket: 0.26g Header: 0.26g
8.0mm, 13.0mm, 14.0mm type
3mm, 3.5mm, 4mm, 4.5mm,
Max. peak temperature of 245°C (on the surface of the PC board
50 pin contacts or more:
40 pin contacts or less:
Max. 43.1N {4.40kgf}
Min. 6.37N {0.65kgf}
Min. 0.981N {100 gf}
Min. 1.96N {200 gf}
(30 pin contacts)
(30 pin contacts)
Max. 60mΩ
insulation resistance
min. 100MΩ,
contact resistance
max. 60mΩ
min. 100MΩ,
contact resistance
max. 60mΩ
min. 100MΩ,
contact resistance
max. 60mΩ
max. 60mΩ
max. 60mΩ
Surface treatment
–55°C to +85°C (product only)
–40°C to +50°C (standard packing)
around the connector terminals)
50 pin contacts; Socket: 0.40g Header: 0.44g
300°C within 5 seconds
250V AC for 1 minute
–55°C to +85°C
Min. 1,000MΩ
Specifications
60V AC/DC
0.5A
Max. 0.785N {80gf} × no. of pins
5 cycles,
240 hours, insulation resistance
48 hours, insulation resistance
96 hours, contact resistance
96 hours, contact resistance
100 times
Min. 0.127N {13gf} × no. of pins
industrial.panasonic.com/ac/e
Min. 1.96N {200 gf}
11.5mm type
Max. 50mΩ
insulation resistance
min. 100MΩ,
contact resistance
max. 50mΩ
min. 100MΩ,
contact resistance
max. 50mΩ
min. 100MΩ,
contact resistance
max. 50mΩ
max. 50mΩ
max. 50mΩ
(initial)
Copper alloy
Copper alloy
(UL94V-0)
LCP resin
Material
Detection current: 1mA
Using 500V DC megger
Based on the contact resistance
measurement method specified by
JIS C 5402.
Measuring the maximum force.
As the contact is axially pull out.
No freezing at low temperatures
Infrared reflow soldering
Soldering iron
No freezing at low temperatures.
No dew condensation.
Sequence
1. –55 °C, 30 minutes
2. ~ , Max. 5 minutes
3. 85 °C, 30 minutes
4. ~ , Max. 5 minutes
Bath temperature 40±2°C,
humidity 90 to 95% R.H.
Bath temperature 35±2°C,
saltwarter concentration 5±1%
Bath temperature 40±2°C,
gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Bath temperature 40±2°C,
gas concentration 10±3 ppm,
humidity 90 to 95% R.H.
Repeated insertion and removal speed of
max. 200 times/hours
11.5mm type
Contact portion:
Ni plating on base, Au plating on surface
Terminal portion:
Ni plating on base, Au plating on surface
(Except for thick of terminal)
Cu plating on base, Sn plating on surface
+3
0
–3
0
Surface treatment
Conditions
ACCTB25E 201201-T

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