AYF530565 Panasonic Electric Works, AYF530565 Datasheet - Page 7

• Manufacturer Part Number: AYF530565
• Description: CONN SOCKET FPC 0.5MM 5POS SMD
• Manufacturer: Panasonic Electric Works
• Series: Y5BWr

Specifications of AYF530565

• Connector Type: Top and Bottom Contacts
• Number Of Positions: 5
• Pitch: 0.020" (0.50mm)
• Ffc, Fcb Thickness: 0.30mm
• Height Above Board: 0.039" (1.00mm)
• Mounting Type: Surface Mount, Right Angle
• Cable End Type: Notched or Through Hole
• Termination: Solder
• Locking Feature: Flip Lock, Backlock
• Contact Finish: Gold
• Contact Finish Thickness: Flash
• Operating Temperature: -55°C ~ 85°C
• Current Rating: 0.200A (per Contact)
• Voltage Rating: 50V
• Housing Material: Liquid Crystal Polymer (LCP)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -

FPC CONNECTORS COMMON CAUTIONS FOR USE
COMMON CAUTIONS FOR USE
Design the recommended foot pattern in
order to secure the mechanical strength
in the soldered areas of the terminal.
Design the FPC based on the
recommended dimensions to ensure the
required connector performance.
In addition, carefully check the equipment
design and take required measures for
the equipment to prevent the FPC from
being removed subsequent to a fall,
vibration, or other impact due to the FPC
size, weight, or the reaction force of the
routed FPC.
In case the connector is picked up by
chucking during mounting, an excessive
mounter chucking force may deform the
molded or metal part of the connector.
Consult us in advance if chucking is to be
applied.
1) Manual soldering.
• Due to the low profile, if an excessive
amount of solder is applied to this
product during manual soldering, the
solder may creep up to near the contact
points, or interference by solder may
cause imperfect contact.
• Make sure that the soldering iron tip is
heated within the temperature and time
limits indicated in the specifications.
• Flux from the solder wire may adhere to
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any flux before use.
• Be aware that a load applied to the
connector terminals while soldering may
displace the contact.
• Thoroughly clean the iron tip.
2) Reflow soldering
• Screen-printing is recommended for
printing paste solder.
Y3FT/Y3F/Y3B/Y5F/Y5B/Y5BW
To determine the relationship between
the screen opening area and the PC
board foot pattern area, refer to the
diagrams in the recommended
patterns for PC boards and metal
masks when setting.
Note that excess solder on the
terminals prevents complete insertion
of the FPC, and that excess solder on
the metal clips prevents the lever from
rotating.
PC board design
FPC and equipment design
Connector mounting
Soldering
Y5S
Y3FT/Y3F/Y3B/Y5S/Y5B/Y5BW
• Consult us when using a screen-printing
thickness other than that recommended.
• Depending on the size of the connector
being used, self alignment may not be
possible. Accordingly, carefully position
the terminal with the PC board pattern.
• The recommended reflow temperature
profile is given in the figure below
Y3FT/Y3F/Y3B/Y5B/Y5BW
Y5S
Y5F
• The temperature is measured on the
surface of the PC board near the
connector terminal.
Note that excess solder inhibits the
slider lock operation.
Screen thickness of 120µm is recom-
mended for paste solder printing.
Recommended reflow temperature
Temperature
Temperature
Temperature
260°C
230°C
180°C
150°C
250°C
200°C
180°C
150°C
260°C
200°C
180°C
150°C
60 to 120 sec.
60 to 120 sec.
Preheating
Preheating
profile
Upper limit (Soldering heat resistance)
Lower limit (Solder wettability)
60 to 120 sec.
Terminal
Preheating
Peak temperature
Peak temperature
PC board foot pattern
Min. 200°C,
Min. 200°C,
70 sec.
70 sec.
Peak temperature
Paste solder
Time
Time
220°C
200°C
25 sec.
70 sec.
Time
panasonic-electric-works.net/ac
• Some solder and flux types may cause
serious solder creeping. Take the solder
and flux characteristics into consideration
when setting the reflow soldering
conditions.
• When performing reflow soldering on
the back of the PC board after reflow
soldering the connector, secure the
connector using, for example, an
adhesive. (Double reflow soldering on the
same side is possible)
3) Reworking on a soldered portion
• Finish reworking in one operation.
• For reworking of the solder bridge, use
a soldering iron with a flat tip. Do not add
flux, otherwise, the flux may creep to the
contact parts.
• Use a soldering iron whose tip
temperature is within the temperature
range specified in the specifications.
carelessly. Otherwise, the terminals
may become deformed due to
excessive force or the solderability
during reflow soldering may degrade.
remove an FPC until the connector is
soldered. Forcibly applied external
pressure on the terminals can weaken
the adherence of the terminals to the
molded part or cause the terminals to
lose their evenness. In addition, do
not insert an FPC into the connector
before soldering the connector.
board after mounting the connector,
be careful that the soldered sections
are subjected to excessive forces.
When coating the PC board after
soldering the connector to prevent the
deterioration of insulation, perform the
coating in such a way so that the coating
does not get on the connector.
The connectors are not meant to be used
for switching.
For other details, please verify with the
product specification sheets.
When cutting or bending the PC
Do not drop the product or handle
Don’t open/close the lever or insert/
Other Notes
Do not the soldered areas to be subjected to forces