NDF03N60ZG ON Semiconductor, NDF03N60ZG Datasheet
NDF03N60ZG
Specifications of NDF03N60ZG
NDF03N60ZGOS
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NDF03N60ZG Summary of contents
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NDF03N60Z, NDP03N60Z, NDD03N60Z N-Channel Power MOSFET 600 V, 3.3 W Features • Low ON Resistance • Low Gate Charge • 100% Avalanche Tested • These Devices are Pb−Free and are RoHS Compliant ABSOLUTE MAXIMUM RATINGS (T Rating Symbol Drain−to−Source Voltage ...
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THERMAL RESISTANCE Parameter Junction−to−Case (Drain) Junction−to−Ambient Steady State 3. Insertion mounted 4. Surface mounted on FR4 board using 1″ sq. pad size, (Cu area = 1.127 oz] including traces). ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage ...
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V 3.5 3 2.5 2.0 1.5 1.0 0.5 0.0 0.0 5.0 10.0 15 DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 1. On−Region Characteristics 5.00 4.75 4.50 4.25 4.00 3.75 3.50 3.25 5.5 6.0 ...
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T = 150° 125° 100 150 200 250 300 350 400 450 500 550 600 V , DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 7. Drain−to−Source Leakage Current versus Voltage 15.0 14.0 13.0 ...
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SINGLE PULSE 100 25° 0.1 R DS(on) THERMAL LIMIT PACKAGE LIMIT 0.01 0 DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 12. ...
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... Figure 16. Thermal Impedance (Junction−to−Case) for NDF03N60Z Measurement made between leads and heatsink with all leads shorted together. *For additional mounting information, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 1E−03 1E−02 1E−01 PULSE TIME (s) ...
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... ORDERING INFORMATION Order Number NDF03N60ZG NDP03N60ZG NDD03N60Z−1G NDD03N60ZT4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. NDF03N60ZG or NDP03N60ZG AYWW Gate Drain Package TO−220FP (Pb−Free) TO−220AB (Pb−Free) IPAK (Pb− ...
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PACKAGE DIMENSIONS TO−220 FULLPAK −B− −Y− 0.25 (0.010 ...
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... PL G 0.13 (0.005 0.13 (0.005) M *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS IPAK CASE 369D−01 ISSUE DPAK CASE 369AA−01 ISSUE A −T− SEATING PLANE SOLDERING FOOTPRINT* 6 ...
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... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...