DSP56303VL100 Freescale Semiconductor, DSP56303VL100 Datasheet - Page 22

IC DSP 24BIT 100MHZ 196-MAPBGA

DSP56303VL100

Manufacturer Part Number
DSP56303VL100
Description
IC DSP 24BIT 100MHZ 196-MAPBGA
Manufacturer
Freescale Semiconductor
Series
DSP563xxr
Type
Fixed Pointr
Datasheet

Specifications of DSP56303VL100

Interface
Host Interface, SSI, SCI
Clock Rate
100MHz
Non-volatile Memory
ROM (576 B)
On-chip Ram
24kB
Voltage - I/o
3.30V
Voltage - Core
3.30V
Operating Temperature
-40°C ~ 100°C
Mounting Type
Surface Mount
Package / Case
196-MAPBGA
Device Core Size
24b
Format
Fixed Point
Clock Freq (max)
100MHz
Mips
100
Device Input Clock Speed
100MHz
Ram Size
24KB
Program Memory Size
Not RequiredKB
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (min)
3V
Operating Supply Voltage (max)
3.6V
Operating Temp Range
-40C to 100C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
196
Package Type
MA-BGA
Package
196MA-BGA
Maximum Speed
100 MHz
Device Million Instructions Per Second
100 MIPS
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Specifications
2.3 Thermal Characteristics
2.4 DC Electrical Characteristics
2-2
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Thermal characterization parameter
Notes:
Supply voltage
Input high voltage
Input low voltage
Input leakage current
High impedance (off-state) input current (@ 2.4 V / 0.4 V)
Output high voltage
Output low voltage
Internal supply current
PLL supply current
Input capacitance
D[0–23], BG, BB, TA
MOD
JTAG/ESSI/SCI/Timer/HI08 pins
EXTAL
D[0–23], BG, BB, TA, MOD
All JTAG/ESSI/SCI/Timer/HI08 pins
EXTAL
TTL (I
CMOS (I
TTL (I
CMOS (I
In Normal mode
In Wait mode
In Stop mode
1
OH
OL
/IRQ
1.
2.
3.
4.
8
8
OH
OL
= 1.6 mA, open-drain pins I
= –0.4 mA)
1
Junction-to-ambient thermal resistance is based on measurements on a horizontal single-sided printed circuit board per
JEDEC Specification JESD51-3.
Junction-to-case thermal resistance is based on measurements using a cold plate per SEMI G30-88, with the exception that
the cold plate temperature is used for the case temperature.
These are simulated values. See note 1 for test board conditions.
These are simulated values. The test board has two 2-ounce signal layers and two 1-ounce solid ground planes internal to the
test board.
, RESET, PINIT/NMI and all
= 10 µA)
= –10 µA)
3
4
Characteristic
5
2
:
5,7
5
5
Characteristics
1
/IRQ
2
1
, RESET, PINIT
1
OL
= 6.7 mA)
Table 2-3.
Table 2-2.
DSP56303 Technical Data, Rev. 11
5,7
R
R
Symbol
θJC
θJA
Ψ
or θ
or θ
JT
DC Electrical Characteristics
Thermal Characteristics
JA
JC
TQFP Value
Symbol
I
V
V
I
V
V
V
V
V
I
I
CCW
C
V
CCS
V
CCI
I
TSI
56
11
IHP
IHX
CC
ILP
ILX
IN
OH
OL
IH
7
IN
IL
V
0.8 × V
CC
Min
–0.3
–0.3
–0.3
–10
–10
2.0
2.0
2.4
3.0
– 0.01
MAP-BGA
CC
Value
6
57
15
8
3
Typ
127
100
3.3
7.5
1
MAP-BGA
Freescale Semiconductor
Value
28
0.2 × V
Max
5.25
0.01
V
V
3.6
0.8
0.8
0.4
2.5
10
10
10
CC
CC
4
CC
°
°
°
Unit
C/W
C/W
C/W
Unit
mA
mA
mA
µA
µA
µA
pF
V
V
V
V
V
V
V
V
V
V
V

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