TJA1042T/3,112 NXP Semiconductors, TJA1042T/3,112 Datasheet
TJA1042T/3,112
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TJA1042T/3,112 Summary of contents
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TJA1042 High-speed CAN transceiver with Standby mode Rev. 6 — 23 March 2011 1. General description The TJA1042 is a high-speed CAN transceiver that provides an interface between a Controller Area Network (CAN) protocol controller and the physical two-wire CAN ...
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... NXP Semiconductors Transceiver disengages from the bus when not powered up (zero load) 2.3 Protections High ESD handling capability on the bus pins Bus pins protected against transients in automotive environments Transmit Data (TXD) dominant time-out function Bus-dominant time-out function in Standby mode ...
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... NXP Semiconductors 5. Block diagram TXD STB RXD ( transceiver with a SPLIT pin, the V Fig 1. TJA1042 Product data sheet High-speed CAN transceiver with Standby mode TEMPERATURE PROTECTION ( TIME-OUT ( MODE CONTROL 8 4 MUX AND DRIVER Block diagram All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning 1 8 TXD STB GND 2 7 CANH TJA1042T CANL CC RXD 4 5 SPLIT 015aaa018 a. TJA1042T: SO8 Fig 2. Pin configuration diagrams 6.2 Pin description Table 3. Symbol TXD GND V CC RXD SPLIT V IO CANL CANH STB TJA1042 Product data sheet ...
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... NXP Semiconductors 7. Functional description The TJA1042 is a HS-CAN stand-alone transceiver with Standby mode. It combines the functionality of the PCA82C250, PCA82C251 and TJA1040 transceivers with improved EMC and ESD handling capability and quiescent current performance. Improved slope control and high DC handling capability on the bus pins provide additional application flexibility ...
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... NXP Semiconductors 7.2 Fail-safe features 7.2.1 TXD dominant time-out function A ‘TXD dominant time-out’ timer is started when pin TXD is set LOW. If the LOW state on pin TXD persists for longer than t lines to recessive state. This function prevents a hardware and/or software application failure from driving the bus lines to a permanent dominant state (blocking all network communications) ...
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... NXP Semiconductors Fig 3. 7.3.2 V supply pin IO Pin V IO microcontroller supply voltage (see pins TXD, RXD and STB to the I/O levels of the microcontroller. Pin V internal supply voltage for the low-power differential receiver of the transceiver. For applications running in low-power mode, this allows the bus lines to be monitored for ...
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... NXP Semiconductors Table 5. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND. Symbol Parameter V electrostatic discharge voltage ESD T virtual junction temperature vj T storage temperature stg [1] Verified by an external test house to ensure pins CANH and CANL can withstand ISO 7637 part 3 automotive transient test pulses 1, 2a, 3a and 3b. IEC 61000-4-2 (150 pF, 330 ...
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... NXP Semiconductors Table 7. Static characteristics +150 4 5 defined with respect to ground; Positive currents flow into the IC. Symbol Parameter I supply current CC V undervoltage detection uvd(VCC) voltage on pin V CC I/O level adapter supply; pin supply voltage on pin supply current on pin V ...
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... NXP Semiconductors Table 7. Static characteristics +150 4 5 defined with respect to ground; Positive currents flow into the IC. Symbol Parameter V bus differential output voltage V O(dif)bus V recessive output voltage O(rec) V differential receiver threshold th(RX)dif voltage V differential receiver hysteresis hys(RX)dif voltage I dominant output current ...
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... NXP Semiconductors 11. Dynamic characteristics Table 8. Dynamic characteristics +150 4 5 defined with respect to ground. Positive currents flow into the IC. Symbol Parameter Transceiver timing; pins CANH, CANL, TXD and RXD; see t delay time from TXD to bus dominant d(TXD-busdom) t delay time from TXD to bus recessive ...
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... NXP Semiconductors TXD CANH CANL V O(dif)(bus) RXD t d(TXD-busdom) Fig 5. 12. Application information Fig 6. TJA1042 Product data sheet High-speed CAN transceiver with Standby mode 0. d(busdom-RXD) t PD(TXD-RXD) CAN transceiver timing diagram 5 V BAT CANH CANH SPLIT TJA1042T CANL CANL Typical application with TJA1042T and microcontroller. ...
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... NXP Semiconductors Fig 7. 13. Test information 13.1 Quality information This product has been qualified to the appropriate Automotive Electronics Council (AEC) standard Q100 or Q101 and is suitable for use in automotive applications. TJA1042 Product data sheet High-speed CAN transceiver with Standby mode BAT 3 V INH ...
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... NXP Semiconductors 14. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 0. terminal 1 index area terminal 1 index area Dimensions (1) Unit max 1.00 0.05 0.35 mm nom 0.85 0.03 0.30 0.2 min 0.80 0.00 0.25 Note 1. Plastic or metal protrusions of 0.075 maximum per side are not included. ...
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... NXP Semiconductors 15. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling ensure that the appropriate precautions are taken as described in JESD625-A or equivalent standards. 16. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “ ...
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... NXP Semiconductors • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities 16.4 Reflow soldering Key characteristics in reflow soldering are: • ...
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... NXP Semiconductors Fig 10. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 17. Soldering of HVSON packages Section 16 Surface Mounted Devices (SMD). A more detailed discussion on soldering HVSON leadless package ICs can found in the following application notes: • ...
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... NXP Semiconductors 18. Revision history Table 11. Revision history Document ID Release date TJA1042 v.6 20110323 • Modifications Section • Section • Table 5: parameter T • Table 7: measuring conditions for parameters I TJA1042 v.5 20110118 TJA1042 v.4 20091006 TJA1042 v.3 20090825 TJA1042 v.2 20090708 TJA1042 v.1 ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding ...
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... NXP Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 2.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.2 Low-power management . . . . . . . . . . . . . . . . . 1 2.3 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Functional description . . . . . . . . . . . . . . . . . . . 5 7.1 Operating modes . . . . . . . . . . . . . . . . . . . . . . . 5 7.1.1 Normal mode ...