2NBS16-TG2-103 Bourns Inc., 2NBS16-TG2-103 Datasheet

2NBS16-TG2-103

Manufacturer Part Number

2NBS16-TG2-103

Description

RESNET 10K OHM 16PIN BUSS SOIC

Manufacturer

Bourns Inc.

Series

2NBSr

Datasheet

1.2QSP16-TG2-103.pdf (4 pages)

Specifications of 2NBS16-TG2-103

Resistance (ohms)

10K

Number Of Resistors

Circuit Type

Bussed

Temperature Coefficient

±100ppm/°C

Tolerance

±2%

Power Per Element

100mW

Number Of Pins

Package / Case

16-SOIC (0.154", 3.90mm Width)

Size / Dimension

0.393" L x 0.157" W (9.98mm x 3.99mm)

Height

0.069" (1.75mm)

Mounting Type

Surface Mount

Operating Temperature

-55°C ~ 125°C

Current page: 1 of 4
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Bussed Resistor networks are typically used in DC pull-up

and pull-down applications where system data or control lines

must be tied to a fixed potential. Fabricated with a Tantalum

Nitride and Nickel Chromium on Silicon process, these

resistors feature excellent stability, TCR and tracking

performance. Bussed Resistor Networks are available in a

range of miniature package types conforming to JEDEC

standards.

*RoHS Directive 2002/95/EC Jan 27, 2003 including Annex

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

General Information

Electrical Characteristics

Resistance Range

Tolerance:

TCR:

Operating Voltage

Environmental Characteristics

ESD

Operating Temperature

Storage Temperature

Power Rating per Resistor @ 70 °C

Power Rating per Package @ 70 °C:

Electrical & Environmental Characteristics

Absolute

Ratio

Absolute

Tracking

QSOP:

NBSOIC: 8 Pin

16 Pin

20, 24 Pin

28 Pin

14, 16 Pin

Thin Film on Silicon 2QSP / 2NBS-XX2 Bussed Resistors

Features

■

Lead free

RoHS compliant*

Multiple resistors tied to a common node

Stable thin-film-on-silicon technology

Ultra-miniature packages to JEDEC

standards

Symbol

T stg

T J

Minimum

Package Schematic

±0.5 %

±0.1 %

100

2 K

-55

-65

Nominal

100

Applications

■

Bus termination

Pull-up/pull-down

Ideal for space-constrained applications

Models 2QSP-XX2 and 2NBS-XX2

are obsolete and not recommended

for new designs.

Maximum

100 K

±5 %

±2 %

+125

+150

0.75

1.00

1.12

0.60

1.00

150

0.1

ppm/°C

Unit

Watt

°C

Ω

Related parts for 2NBS16-TG2-103

2NBS16-TG2-103 Summary of contents

Page 1

... Customers should verify actual device performance in their specific applications. Features ■ Lead free RoHS compliant* ■ ■ Multiple resistors tied to a common node ■ Stable thin-film-on-silicon technology ■ Ultra-miniature packages to JEDEC standards Thin Film on Silicon 2QSP / 2NBS-XX2 Bussed Resistors Package Schematic Symbol Minimum R 100 ±0.5 % ±0 ...

Page 2

... Model A 2NBS08 4.80 - 4.98 (.189 - .196) 2NBS14 8.56 - 8.74 (.337 - .344) 2NBS16 9.80 - 9.98 (.386 - .393) Governing dimensions are in mm. Dimensions in parentheses are in inches and are approximate. JEDEC Reference Number MS-012. Specifications are subject to change without notice. ...

Page 3

... Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Narrow-Body SOIC Package Power Temperature Derating Curve 125 150 ° Standard Resistance Values 1.0 2NBS14, 2NBS16 .8 .6 2NBS08 . 100 125 150 AMBIENT TEMPERATURE ( C ) ° Resistance Resistance (ohms) ...

Page 4

... Thin Film on Silicon 2QSP / 2NBS -XX2 Bussed Resistors Dispensing For large quantities, the product will be dispensed in Tape and Reel (see diagram below Package A 0 QSOP 16 Pin 6.4 (0.252) 20, 24 Pin 6.5 (0.256) 28 Pin 6.5 (0.256) NBSOIC 8 Pin 6.4 (0.252) 14 Pin 6.5 (0.256) 16 Pin 6 ...

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