HHM1522B1 TDK Corporation, HHM1522B1 Datasheet
HHM1522B1
Specifications of HHM1522B1
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HHM1522B1 Summary of contents
Page 1
... Multilayer Baluns, HHM Series HHM1710D1 For Bluetooth & IEEE802.11b/g SHAPES AND DIMENSIONS/CIRCUIT 1.6±0.1 0.6±0 0.55±0.1 0.3±0.1 0.1±0.1 0.25±0.1 Dimensions in mm RECOMMENDED PCB PATTERN 0.25 0.25 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate. ...
Page 2
... Multilayer Baluns, HHM Series HHM1711D1 For Bluetooth & IEEE802.11b/g SHAPES AND DIMENSIONS/CIRCUIT 1.6±0.1 0.6±0 0.55±0.1 0.3±0.1 0.1±0.1 0.25±0.1 Dimensions in mm RECOMMENDED PCB PATTERN 0.25 0.25 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate. ...
Page 3
... Multilayer Baluns, HHM Series HHM1712D1 For Bluetooth & IEEE802.11b/g SHAPES AND DIMENSIONS/CIRCUIT 1.6±0.1 0.6±0 0.55±0.1 0.3±0.1 0.1±0.1 0.25±0.1 Dimensions in mm RECOMMENDED PCB PATTERN 0.25 0.25 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate. ...
Page 4
... Multilayer Baluns, HHM Series HHM1713D1 For Bluetooth & IEEE802.11b/g SHAPES AND DIMENSIONS/CIRCUIT 1.6±0.1 0.6±0 0.55±0.1 0.3±0.1 0.1±0.1 0.25±0.1 Dimensions in mm RECOMMENDED PCB PATTERN 0.25 0.25 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate. ...
Page 5
... Multilayer Baluns, HHM Series HHM1720A1 For EGSM SHAPES AND DIMENSIONS/CIRCUIT 1.6±0.1 0.6±0 0.55±0.1 0.3±0.1 0.1±0.1 0.25±0.1 Dimensions in mm RECOMMENDED PCB PATTERN 0.25 0.25 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate 0.3 0.3 ø ...
Page 6
... Multilayer Baluns, HHM Series HHM1726L1 For PDC800/Tx+Rx SHAPES AND DIMENSIONS/CIRCUIT 1.6±0.1 0.6±0 0.55±0.1 0.3±0.1 0.1±0.1 0.25±0.1 Dimensions in mm RECOMMENDED PCB PATTERN 0.25 0.25 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate 0.3 0.3 ø ...
Page 7
... Multilayer Baluns, HHM Series HHM1731A2 For DCS/Tx+Rx SHAPES AND DIMENSIONS/CIRCUIT 1.6±0.1 0.6±0 0.55±0.1 0.3±0.1 0.1±0.1 0.25±0.1 Dimensions in mm RECOMMENDED PCB PATTERN 0.25 0.25 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate 0.3 0.3 ø ...
Page 8
... Multilayer Baluns, HHM Series HHM1732B1 For W-LAN SHAPES AND DIMENSIONS/CIRCUIT 1.6±0.1 0.6±0 0.55±0.1 0.3±0.1 0.1±0.1 0.25±0.1 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.25 0.25 0.3 Unbal Port Bal Port ø0.3 Through-hole Line width be designed to match 50Ω characteristic impedance depending on PCB material and thickness ...
Page 9
... Multilayer Baluns, HHM Series HHM1733B1 For W-LAN SHAPES AND DIMENSIONS/CIRCUIT 1.6±0.1 0.6±0 0.55±0.1 0.3±0.1 0.1±0.1 0.25±0.1 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.25 0.25 0.3 Unbal Port Bal Port ø0.3 Through-hole Line width be designed to match 50Ω characteristic impedance depending on PCB material and thickness ...
Page 10
... Multilayer Baluns, HHM Series HHM1743L1 For PDC1500/Local SHAPES AND DIMENSIONS/CIRCUIT 1.6±0.1 0.6±0 0.55±0.1 0.3±0.1 0.1±0.1 0.25±0.1 Dimensions in mm RECOMMENDED PCB PATTERN 0.25 0.25 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate 0.3 0.3 ø ...
Page 11
... Multilayer Baluns, HHM Series HHM1748A2 For DCS/Tx+Rx SHAPES AND DIMENSIONS/CIRCUIT 1.6±0.1 0.6±0 0.55±0.1 0.3±0.1 0.1±0.1 0.25±0.1 Dimensions in mm RECOMMENDED PCB PATTERN 0.25 0.25 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate 0.3 0.3 ø ...
Page 12
... Multilayer Baluns, HHM Series HHM1752A1 For W-LAN SHAPES AND DIMENSIONS/CIRCUIT 1.6±0.1 0.6±0 0.55±0.1 0.3±0.1 0.1±0.1 0.25±0.1 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.25 0.25 0.3 Unbal Port Bal Port ø0.3 Through-hole Line width be designed to match 50Ω characteristic impedance depending on PCB material and thickness ...
Page 13
... Multilayer Baluns, HHM Series HHM1752A2 For W-LAN SHAPES AND DIMENSIONS/CIRCUIT 1.6±0.1 0.6±0 0.55±0.1 0.3±0.1 0.1±0.1 0.25±0.1 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.25 0.25 0.3 Unbal Port Bal Port ø0.3 Through-hole Line width be designed to match 50Ω characteristic impedance depending on PCB material and thickness ...
Page 14
... Multilayer Baluns, HHM Series HHM1763A1 For EGSM SHAPES AND DIMENSIONS/CIRCUIT 1.6±0.1 0.6±0 0.55±0.1 0.3±0.1 0.1±0.1 0.25±0.1 Dimensions in mm RECOMMENDED PCB PATTERN 0.25 0.25 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate 0.3 0.3 ø ...
Page 15
... Multilayer Baluns, HHM Series HHM1502 For DCS/Local SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 16
... Multilayer Baluns, HHM Series HHM1506 For W-CDMA/Tx-Rx SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 17
... Multilayer Baluns, HHM Series HHM1509 For EGSM-DCS/Local SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 18
... Multilayer Baluns, HHM Series HHM1515B2 For EGSM/Tx-Rx SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 19
... Multilayer Baluns, HHM Series HHM1516 For DCS-PCS/Tx-Rx SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 20
... Multilayer Baluns, HHM Series HHM1517 For Bluetooth&IEEE802.11b/g SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 21
... Multilayer Baluns, HHM Series HHM1517A2 For Bluetooth&IEEE802.11b/g SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 22
... Multilayer Baluns, HHM Series HHM1518A3 For DCS-PCS/Tx-Rx SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 23
... Multilayer Baluns, HHM Series HHM1520 For Bluetooth&IEEE802.11b/g SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 24
... Multilayer Baluns, HHM Series HHM1520A2 For Bluetooth&IEEE802.11b/g SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 25
... Multilayer Baluns, HHM Series HHM1521 For Bluetooth&IEEE802.11b/g SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 26
... Multilayer Baluns, HHM Series HHM1521A2 For Bluetooth&IEEE802.11b/g SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 27
... Multilayer Baluns, HHM Series HHM1522A7 For AGSM/Tx-Rx SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 28
... Multilayer Baluns, HHM Series HHM1522B1 For EGSM/Tx-Rx SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 29
... Multilayer Baluns, HHM Series HHM1523B3 For AGSM/Tx-Rx SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 30
... Multilayer Baluns, HHM Series HHM1523C1 For EGSM/Tx-Rx SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 31
... Multilayer Baluns, HHM Series HHM1524B1 For EGSM/Tx-Rx SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 32
... Multilayer Baluns, HHM Series HHM1524B4 For AGSM/Tx-Rx SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 33
... Multilayer Baluns, HHM Series HHM1525 For DCS-PCS/Tx-Rx SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 34
... Multilayer Baluns, HHM Series HHM1526 For DCS-PCS/Tx-Rx SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 35
... Multilayer Baluns, HHM Series HHM1533 For W-CDMA/Tx-Rx SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 36
... Multilayer Baluns, HHM Series HHM1534 For W-CDMA/Tx-Rx SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 37
... Multilayer Baluns, HHM Series HHM1536B1 For 3.7GHz SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 38
... Multilayer Baluns, HHM Series HHM1537 For W-CDMA/Tx-Rx SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 39
... Multilayer Baluns, HHM Series HHM1538 For DCS/Local SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 40
... Multilayer Baluns, HHM Series HHM1541 For Bluetooth&IEEE802.11b/g SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 41
... Multilayer Baluns, HHM Series HHM1541E1 For Bluetooth SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 42
... Multilayer Baluns, HHM Series HHM1541E2 For Bluetooth&IEEE802.11b/g SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 43
... Multilayer Baluns, HHM Series HHM1544 For W-LAN SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 44
... Multilayer Baluns, HHM Series HHM1545 For 3.7GHz SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 45
... Multilayer Baluns, HHM Series HHM1547 For 3.7GHz SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 46
... Multilayer Baluns, HHM Series HHM1548A2 For 3.7GHz SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 47
... Multilayer Baluns, HHM Series HHM1548C2 For 3.7GHz SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 48
... Multilayer Baluns, HHM Series HHM1548E1 For 3.7GHz SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 49
... Multilayer Baluns, HHM Series HHM1562B For W-LAN SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.25 0.25 0.3 Unbal Port Bal Port ø0.3 Through-hole Line width be designed to match 50Ω characteristic impedance depending on PCB material and thickness ...
Page 50
... Multilayer Baluns, HHM Series HHM1564A4 For AGSM/Tx-Rx SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate ø0.3 Through-hole ...
Page 51
... Multilayer Baluns, HHM Series HHM1570B1 For W-LAN SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.25 0.25 0.3 Unbal Port Bal Port ø0.3 Through-hole Line width be designed to match 50Ω characteristic impedance depending on PCB material and thickness ...
Page 52
... Multilayer Baluns, HHM Series HHM1582A1 For 2218 to 2458MHz SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.2 This width is 50Ω. Micro-strip line for 0.4mm thick glass-epoxy substrate. ...
Page 53
... Multilayer Baluns, HHM Series HHM1583B1 For UWB SHAPES AND DIMENSIONS/CIRCUIT 2.0±0.15 0.95±0 0.65±0.2 0.3±0.2 0.2±0.2 0.35±0.2 Dimensions in mm RECOMMENDED PCB PATTERN 0.3 0.25 0.25 0.3 Unbal Port Bal Port ø0.3 Through-hole Line width be designed to match 50Ω characteristic impedance depending on PCB material and thickness ...