AD6623S/PCB Analog Devices Inc, AD6623S/PCB Datasheet - Page 10

• Manufacturer Part Number: AD6623S/PCB
• Description: BOARD EVAL SGNL PROCESSOR AD6623
• Manufacturer: Analog Devices Inc

Specifications of AD6623S/PCB

• Rohs Status: RoHS non-compliant
• Module/board Type: Evaluation Board
• For Use With/related Products: AD6623
• Lead Free Status / Rohs Status: Not Compliant

AD6623
ABSOLUTE MAXIMUM RATINGS*
VDDIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +3.6 V
VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +2.75 V
Input Voltage . . . . . . . . . . . . . . –0.3 V to +5 V (5 V Tolerant)
Output Voltage Swing . . . . . . . . . . –0.3 V to VDDIO + 0.3 V
Load Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 pF
Junction Temperature Under Bias . . . . . . . . . . . . . . . . . 125°C
Operating Temperature . . . . . . . . . –40°C to +85°C (Ambient)
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (5 sec) . . . . . . . . . . . . . . . . . . . . . . . 280°C
*Stresses greater than those listed above may cause permanent damage to the
Model
AD6623AS
AD6623ABC
AD6623S/PCB
AD6623BC/PCB
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD6623 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
device. These are stress ratings only; functional operation of the devices at these
or any other conditions greater than those indicated in the operational sections of
this specification is not implied. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
Temperature Range
–40°C to +85°C (Ambient)
–40°C to +85°C (Ambient)
Package Description
128-Lead MQFP (Plastic Quad Flatpack)
196-Lead CSPBGA (Chip Scale Package Ball Grid Array) BC-196
MQFP Evaluation Board with AD6623 and Software
CSPBGA Evaluation Board with AD6623 and Software
ORDERING GUIDE
–10–
THERMAL CHARACTERISTICS
128-Lead MQFP with Internal Heat Spreader:
196-Lead BGA:
Thermal measurements made in the horizontal position on a
4-layer board.
EXPLANATION OF TEST LEVELS
I.
II. 100% Production Tested at 25°C, and Sample Tested at
III. Sample Tested Only
IV. Parameter Guaranteed by Design and Analysis
V. Parameter is Typical Value Only
JA
JA
JA
JA
JA
= 28.1°C/W, no airflow
= 22.6°C/W, 200 lfpm airflow
= 20.5°C/W, 400 lfpm airflow
= 26.3°C/W, no airflow
= 22°C/W, 200 lfpm airflow
100% Production Tested
Specified Temperatures
WARNING!
ESD SENSITIVE DEVICE
Package Option
S-128
REV. A