AD6623S/PCB Analog Devices Inc, AD6623S/PCB Datasheet - Page 46

• Manufacturer Part Number: AD6623S/PCB
• Description: BOARD EVAL SGNL PROCESSOR AD6623
• Manufacturer: Analog Devices Inc

Specifications of AD6623S/PCB

• Rohs Status: RoHS non-compliant
• Module/board Type: Evaluation Board
• For Use With/related Products: AD6623
• Lead Free Status / Rohs Status: Not Compliant

AD6623
Figure 45. Composite Response to First CIC5 Null
–100
–10
–20
–30
–40
–50
–60
–70
–80
–90
10
0
CIC RESPONSE
–10
COMPOSITE
–8
RESPONSE
–6
–4
–2
MHz
0
2
4
6
RESPONSE
DESIRED
8
10
–46–
THERMAL MANAGEMENT
The power dissipation of the AD6623 is primarily determined by
three factors: the clock rate, the number of channels active, and
the distribution of interpolation rates. The faster the clock rate
the more power dissipated by the CMOS structures of the AD6623
and the more channels active the higher the overall power of the
chip. Low interpolation rates in the CIC stages (CIC5, CIC2)
results in higher power dissipation. All these factors should be
analyzed as each application has different thermal requirements.
The AD6623 128-Lead MQFP is specially designed to provide
excellent thermal performance. To achieve the best performance
the power and ground leads should be connected directly to
planes on the PC board. This provides the best thermal transfer
from the AD6623 to the PC board.
REV. A