BGA2011,115 NXP Semiconductors, BGA2011,115 Datasheet

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BGA2011,115

Manufacturer Part Number
BGA2011,115
Description
MMIC AMPLIFIER 900MHZ SOT363
Manufacturer
NXP Semiconductors
Type
General Purpose Amplifierr
Datasheet

Specifications of BGA2011,115

Noise Figure
1.5dB
Package / Case
SC-70-6, SC-88, SOT-363
Current - Supply
10mA ~ 20mA
Frequency
900MHz
Gain
19dB
P1db
10dBm
Rf Type
CDMA, DECT, PHS
Test Frequency
900MHz
Voltage - Supply
4.5V
Mounting Style
SMD/SMT
Number Of Channels
1
Operating Frequency
900 MHz
Operating Supply Voltage
3 V
Supply Current
20 mA @ 3 V
Maximum Power Dissipation
135 mW
Maximum Operating Temperature
+ 150 C
Manufacturer's Type
Low Noise Amplifier
Frequency (max)
900MHz
Operating Supply Voltage (typ)
3V
Operating Supply Voltage (max)
4.5V
Package Type
SOT-363
Mounting
Surface Mount
Pin Count
6
Noise Figure (typ)
1.7@900MHzdB
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-2064-2
934056365115
BGA2011 T/R
Product specification
Supersedes data of 2000 Sep 06
dbook, halfpage
DATA SHEET
BGA2011
900 MHz high linear low noise
amplifier
DISCRETE SEMICONDUCTORS
MBD128
2000 Dec 04

Related parts for BGA2011,115

BGA2011,115 Summary of contents

Page 1

DATA SHEET dbook, halfpage BGA2011 900 MHz high linear low noise amplifier Product specification Supersedes data of 2000 Sep 06 DISCRETE SEMICONDUCTORS MBD128 2000 Dec 04 ...

Page 2

... NXP Semiconductors 900 MHz high linear low noise amplifier FEATURES  Low current, low voltage  High linearity  High power gain  Low noise  Integrated temperature compensated biasing  Control pin for adjustment bias current. APPLICATIONS  RF front end  ...

Page 3

... NXP Semiconductors 900 MHz high linear low noise amplifier THERMAL CHARACTERISTICS SYMBOL PARAMETER R thermal resistance from junction th j-s to solder point CHARACTERISTICS RF input AC coupled SYMBOL PARAMETER I supply current S I control current C R return losses input return losses output L OUT insertion power gain ...

Page 4

... NXP Semiconductors 900 MHz high linear low noise amplifier APPLICATION INFORMATION handbook, full pagewidth List of components (see Fig.2) COMPONENT DESCRIPTION C1, C2 multilayer ceramic chip capacitor C3, C5 multilayer ceramic chip capacitor C4 multilayer ceramic chip capacitor C6 multilayer ceramic chip capacitor L1 SMD inductor L2 SMD inductor Note 1. The stripline (w = 0.7 mm gold plated double copper-clad printed-circuit board ( ...

Page 5

... NXP Semiconductors 900 MHz high linear low noise amplifier 30 handbook, halfpage gain (dB max 1000 = 30 dBm mA Fig.3 Insertion gain (s 21 functions of frequency; typical values. 20 handbook, halfpage (dB −3 − 30 dBm 900 MHz Fig.5 Insertion gain as a function of control current; typical values. ...

Page 6

... NXP Semiconductors 900 MHz high linear low noise amplifier 2 handbook, halfpage NF (dB) 1.6 1.2 0.8 0 900 MHz Fig.7 Noise figure as a function of supply current; typical values. Scattering parameters = 30 dBm MAGNITUDE ANGLE (MHz) (ratio) (deg) 22.45 100 0.553 42.12 200 0.499  ...

Page 7

... NXP Semiconductors 900 MHz high linear low noise amplifier handbook, full pagewidth 180° = 30 dBm mA Fig.8 Common emitter input reflection coefficient (s handbook, full pagewidth 180° = 30 dBm mA Fig.9 Common emitter forward transmission coefficient (s 2000 Dec 04 90° +1 135° ...

Page 8

... NXP Semiconductors 900 MHz high linear low noise amplifier handbook, full pagewidth 180° = 30 dBm mA Fig.10 Common emitter reverse transmission coefficient (s handbook, full pagewidth 180° = 30 dBm mA Fig.11 Common emitter output reflection coefficient (s 2000 Dec 04 90° 135° ...

Page 9

... NXP Semiconductors 900 MHz high linear low noise amplifier PACKAGE OUTLINE Plastic surface-mounted package; 6 leads y 6 pin 1 index DIMENSIONS (mm are the original dimensions UNIT max 1.1 0.30 0.25 mm 0.1 0.20 0.8 0.10 OUTLINE VERSION IEC SOT363 2000 Dec scale 2.2 1.35 2 ...

Page 10

... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the ...

Page 11

... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...

Page 12

... Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. ...

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