BGM1014,115 NXP Semiconductors, BGM1014,115 Datasheet

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BGM1014,115

Manufacturer Part Number
BGM1014,115
Description
MMIC AMPLIFIER SOT-363
Manufacturer
NXP Semiconductors
Type
MMIC Wideband Amplifierr
Datasheet

Specifications of BGM1014,115

Package / Case
SC-70-6, SC-88, SOT-363
Current - Supply
17mA ~ 25mA
Frequency
0Hz ~ 2.2GHz
Gain
31.5dB ~ 33dB
Noise Figure
4.2dB ~ 4.3dB
P1db
12.5dBm ~ 12.9dBm
Rf Type
ISM
Test Frequency
1GHz
Voltage - Supply
5 V ~ 6 V
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4.5 V
Supply Current
30 mA
Operating Temperature Range
- 40 C to + 85 C
Mounting Style
SMD/SMT
Manufacturer's Type
Broadband Amplifier
Number Of Channels
1
Operating Supply Voltage (min)
4.5V
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (max)
5.5V
Package Type
SOT-363
Mounting
Surface Mount
Pin Count
6
Noise Figure (typ)
4.1@2200MHzdB
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-2077-2
934059057115
BGM1014 T/R

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BGM1014,115
Manufacturer:
KYOCERA
Quantity:
7 600
1. Product profile
CAUTION
MSC895
1.1 General description
1.2 Features
1.3 Applications
1.4 Quick reference data
Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifier with internal
matching circuit in a 6-pin SOT363 SMD plastic package.
Table 1:
Symbol
V
I
NF
P
s
S
S
L(sat)
21
BGM1014
MMIC wideband amplifier
Rev. 01 — 11 March 2005
Internally matched to 50
Good output match to 75
32 dB to 34 dB positive sloped gain for Low Noise Block (LNB) application
12.9 dBm saturated load power at 1 GHz
40 dB isolation
LNB Intermediate Frequency (IF) amplifiers
Cable systems
General purpose
2
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
Quick reference data
Parameter
DC supply voltage
DC supply current
insertion power gain
noise figure
saturated load power
Conditions
RF input; AC coupled
f = 1 GHz
f = 1 GHz
f = 1 GHz
Product data sheet
Min
-
17
31.5
-
12.5
Typ
5
21.0
32.3
4.2
12.9
Max
6
25
33.0
4.3
-
Unit
V
mA
dB
dB
dBm

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BGM1014,115 Summary of contents

Page 1

BGM1014 MMIC wideband amplifier Rev. 01 — 11 March 2005 1. Product profile 1.1 General description Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifier with internal matching circuit in a 6-pin SOT363 SMD plastic package. CAUTION This device is sensitive ...

Page 2

Philips Semiconductors 2. Pinning information Table 2: Pin Ordering information Table 3: Type number BGM1014 4. Marking Table 4: Type number BGM1014 5. Limiting values Table 5: In accordance with the Absolute Maximum ...

Page 3

Philips Semiconductors 7. Thermal characteristics Table 7: Thermal characteristics Symbol Parameter R thermal resistance from junction to solder point th(j-sp) 8. Characteristics Table 8: Characteristics 21.1 mA measured on demo ...

Page 4

Philips Semiconductors Table 8: Characteristics …continued 21.1 mA measured on demo board; unless otherwise specified Symbol Parameter IP3 input third order intercept point in IP3 output third ...

Page 5

Philips Semiconductors 180 I = 21.1 mA dBm Fig 2. Output reflection coefficient ( (dB 1000 I = 21.1 ...

Page 6

Philips Semiconductors (dBm) (1) 15 (2) ( GHz ( 4.5 ...

Page 7

Philips Semiconductors 9. Application information Figure 9 internally matched to 50 impedance matching is also achieved with blocking capacitors C1 and C2 should be not more than 100 pF for applications above 100 MHz. Their values can ...

Page 8

Philips Semiconductors Figure 10 Fig 10. Printed-circuit board layout and component view for typical application Table 9: Component C1 9397 750 14499 Product data sheet shows the PCB layout used for the typical application ...

Page 9

Philips Semiconductors Table 10: Scattering parameters 21.1 mA dBm (MHz) Magnitude Angle (ratio) (deg) 100 0.287 16.1 200 0.328 3.9 400 0.319 28.8 600 ...

Page 10

Philips Semiconductors 10. Package outline Plastic surface mounted package; 6 leads y 6 pin 1 index DIMENSIONS (mm are the original dimensions UNIT max 0.30 1.1 0.25 mm 0.1 0.20 0.8 0.10 ...

Page 11

Philips Semiconductors 11. Revision history Table 11: Revision history Document ID Release date BGM1014_1 20050311 9397 750 14499 Product data sheet Data sheet status Change notice product data sheet - Rev. 01 — 11 March 2005 BGM1014 MMIC wideband amplifier ...

Page 12

Philips Semiconductors 12. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...

Page 13

Philips Semiconductors 16. Contents 1 Product profi 1.1 General description ...

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