MC13770FCR2 Freescale Semiconductor, MC13770FCR2 Datasheet - Page 7

IC RF LN AMP W-CDMA QFN-12

MC13770FCR2

Manufacturer Part Number
MC13770FCR2
Description
IC RF LN AMP W-CDMA QFN-12
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MC13770FCR2

Current - Supply
8mA
Frequency
2.1GHz ~ 2.4GHz
Gain
15dB
Noise Figure
1.5dB
Package / Case
12-QFN
Rf Type
W-CDMA
Test Frequency
2.14GHz
Voltage - Supply
2.7 V ~ 3 V
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
P1db
-
Other names
MC13770FCTR
5
Freescale Semiconductor
Packaging Information
PIN 1 BACKSIDE IDENTIFIER
B
3
12X
DETAIL S
0.05
0.1
0.3
0.18
12X
DETAIL M
M
M
0.75
0.5
2X
C
C
0.1
9
7
A B
LASER MARK FOR PIN 1
IDENTIFICATION IN
THIS AREA
3
C
8X
(0.777)
VIEW M-M
10
4X
0.1
6
1.25
0.95
(0.25)
C
12
8X
4
A B
0.5
2X
Figure 4. Outline Dimensions for QFN-12
A
0.1
1
3
N
2X
C
1.25
0.95
DETAIL M
PIN 1 IDENTIFIER
MC13770 Technical Data, Rev. 2
EXPOSED DIE
ATTACH PAD
0.39
0.31
PIN 1 BACKSIDE IDENTIFIER
(Case 1345-01, Issue A)
G
DETAIL S
0.1
M
M
C
A B
(90°)
2X
0.0
0.1
1.0 1.00
0.8 0.75
0.05
0.00
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES PER
3. THE COMPLETE JEDEC DESIGNATOR FOR THIS
4. CORNER CHAMFER MAY NOT BE PRESENT.
5. COPLANARITY APPLIES TO LEADS, CORNER LEADS,
12X
ASME Y14.5M, 1994.
PACKAGE IS: HF-PQFP-N.
DIMENSIONS OF OPTIONAL FEATURES ARE FOR
REFERENCE ONLY.
AND DIE ATTACH PAD.
0.065
0.015
VIEW ROTATED 90° CLOCKWISE
(0.5)
DETAIL G
3X
CORNER CONFIGURATION
(R0.09)
4X
(0.24)
(0.18)
DETAIL N
4
8X
Packaging Information
C
(1.177)
0.1
0.05
SEATING PLANE
4X
C
C
(45°)
5
7

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