BGA2709,115

Manufacturer Part NumberBGA2709,115
DescriptionMMIC AMPLIFIER SOT-363
ManufacturerNXP Semiconductors
TypeGeneral Purpose Wideband Amplifier
BGA2709,115 datasheet
 

Specifications of BGA2709,115

Package / CaseSC-70-6, SC-88, SOT-363Current - Supply23.5mA
Frequency1.8GHzGain22.7dB
Noise Figure4dBRf TypeISM
Test Frequency1GHzVoltage - Supply5V ~ 6V
Supply Current23.5 mAMounting StyleSMD/SMT
Lead Free Status / RoHS StatusLead free / RoHS CompliantP1db-
Other names568-2068-2
934056949115
BGA2709 T/R
  
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DATA SHEET
dbook, halfpage
BGA2709
MMIC wideband amplifier
Product specification
Supersedes data of 2002 Feb 05
DISCRETE SEMICONDUCTORS
MBD128
2002 Aug 06

BGA2709,115 Summary of contents

  • Page 1

    DATA SHEET dbook, halfpage BGA2709 MMIC wideband amplifier Product specification Supersedes data of 2002 Feb 05 DISCRETE SEMICONDUCTORS MBD128 2002 Aug 06 ...

  • Page 2

    ... NXP Semiconductors MMIC wideband amplifier FEATURES  Internally matched to 50   Very wide frequency range (3.6 GHz bandwidth)  Flat 23 dB gain (DC to 2.6 GHz flatness)  12.5 dBm saturated output power at 1 GHz  High linearity (22 dBm OIP3 at 1 GHz)  ...

  • Page 3

    ... NXP Semiconductors MMIC wideband amplifier THERMAL CHARACTERISTICS SYMBOL PARAMETER R thermal resistance from junction to solder th j-s point CHARACTERISTICS = 25 C unless otherwise specified 23.5 mA SYMBOL PARAMETER I supply current insertion power gain 21 R return losses input return losses output L OUT isolation 12 NF noise figure ...

  • Page 4

    ... NXP Semiconductors MMIC wideband amplifier APPLICATION INFORMATION Figure 2 shows a typical application circuit for the BGA2709 MMIC. The device is internally matched to 50 , and therefore does not need any external matching. The value of the input and output DC blocking capacitors C2, C3 should be not more than 100 pF for applications above 100 MHz ...

  • Page 5

    ... NXP Semiconductors MMIC wideband amplifier handbook, full pagewidth 180° = 30 dBm 23.5 mA handbook, full pagewidth 180° = 30 dBm 23.5 mA 2002 Aug 06 90° +1 135° +0.5 +0.2 100 MHz 0.2 0 GHz −0.2 −0.5 −135° −1 −90°  ...

  • Page 6

    ... NXP Semiconductors MMIC wideband amplifier 0 handbook, halfpage (dBm) −10 −20 −30 −40 −50 0 1000 2000 = 30 dBm 23.5 mA Fig.9 Isolation (| function of frequency; 12 typical values. 15 handbook, halfpage P L (dBm −5 −10 −30 −  GHz ( Fig.11 Load power as a function of drive power at 1 GHz ...

  • Page 7

    ... NXP Semiconductors MMIC wideband amplifier 5.5 handbook, halfpage NF (dB) 5 4.5 (2) 4 3.5 0 500 1000 1500 = 30 dBm  ( 18 23 28 Fig.13 Noise figure as a function of frequency; typical values. 2002 Aug 06 MLD900 handbook, halfpage (3) (1) 2000 2500 f (MHz) ...

  • Page 8

    Table 1 Scattering parameters 23.5 mA (MHz) MAGNITUDE ANGLE( MAGNITUDE (ratio) deg) (ratio) 100 0.23362 32.281 12.90523 200 0.25252 11.824 13.22858 2.149 400 0.25838 13.43580 8.784 600 0.25990 13.51088 12.76 800 0.26278 13.56715 ...

  • Page 9

    ... NXP Semiconductors MMIC wideband amplifier PACKAGE OUTLINE Plastic surface-mounted package; 6 leads y 6 pin 1 index DIMENSIONS (mm are the original dimensions UNIT max 1.1 0.30 0.25 mm 0.1 0.20 0.8 0.10 OUTLINE VERSION IEC SOT363 2002 Aug scale 2.2 1.35 2.2 1.3 0.65 1.8 1 ...

  • Page 10

    ... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the ...

  • Page 11

    ... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...

  • Page 12

    ... Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. ...