AMMP-6222-BLKG Avago Technologies US Inc., AMMP-6222-BLKG Datasheet - Page 11

• Manufacturer Part Number: AMMP-6222-BLKG
• Description: IC MMIC AMP LNA 7GHZ-21GHZ 8SMD
• Manufacturer: Avago Technologies US Inc.
• Series: -r

Specifications of AMMP-6222-BLKG

• Rf Type: WiMax
• Gain: 24dB
• Current - Supply: 120mA
• Frequency: 7GHz ~ 21GHz
• Noise Figure: 2.3dB
• P1db: 15.5dBm
• Package / Case: 8-SMD
• Voltage - Supply: 3 V ~ 5 V
• Frequency Rf: 21GHz
• Noise Figure Typ: 2.3dB
• Supply Current: 120mA
• Msl: MSL 2A - 4 Weeks
• Supply Voltage Range: 3V To 5V
• Frequency Max: 21GHz
• Test Frequency: -
• Number Of Channels: 1
• Power Supply Requirement: Single
• Single Supply Voltage (min): 3V
• Single Supply Voltage (typ): 4V
• Single Supply Voltage (max): 5V
• Package Type: SMD
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Pin Count: 8
• Mounting: Surface Mount
• Filter Terminals: SMD
• Frequency Min: 7GHz
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Test Frequency: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Manual Assembly
x Follow ESD precautions while handling packages.
x Handling should be along the edges with tweezers.
x Recommended attachment is conductive solder paste.
x Apply solder paste using a stencil printer or dot
x Follow solder paste and vendor’s recommendations
x Packages have been qualified to withstand a peak
Figure 24. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste
Package, Tape & Reel, and Ordering Information
AMMP-6222 Part Number Ordering Information
11
Part Number
AMMP-6222-BLKG
AMMP-6222-TR1G
AMMP-6222-TR2G
Please see recommended solder reflow profile. Neither
Conductive epoxy or hand soldering is recommended.
placement. The volume of solder paste will be
dependent on PCB and component layout and should
be controlled to ensure consistent mechanical and
electrical performance.
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room
temperature to the pre-heat temp. to avoid damage
due to thermal shock.
temperature of 260°C for 20 seconds. Verify that the
profile will not expose device beyond these limits.
300
250
200
150
100
50
0
0
Ramp 1
50
Preheat Ramp 2
Devices Per Container
Peak = 250 ± 5˚C
100
100
500
Seconds
10
150
Reflow
Melting point = 218˚C
200
Cooling
Antistatic bag
Container
250
7” Reel
7” Reel
300
A properly designed solder screen or stencil is required to
ensure optimum amount of solder paste is deposited onto
the PCB pads. The recommended stencil layout is shown
in Figure 23. The stencil has a solder paste deposition
opening approximately 70% to 90% of the PCB pad.
Reducing stencil opening can potentially generate more
voids underneath. On the other hand, stencil openings
larger than 100% will lead to excessive solder paste smear
or bridging across the I/O pads. Considering the fact that
solder paste thickness will directly affect the quality of
the solder joint, a good choice is to use a laser cut stencil
composed of 0.127mm (5 mils) thick stainless steel which
is capable of producing the required fine stencil outline.
The most commonly used solder reflow method is
accomplished in a belt furnace using convection heat
transfer. The suggested reflow profile for automated reflow
processes is shown in Figure 24. This profile is designed
to ensure reliable finished joints. However, the profile
indicated in Figure 14 will vary among different solder
pastes from different manufacturers and is shown here for
reference only.