AMMP-6233-BLKG Avago Technologies US Inc., AMMP-6233-BLKG Datasheet

IC MMIC LNA 18GHZ-31GHZ 8SMD

AMMP-6233-BLKG

Manufacturer Part Number
AMMP-6233-BLKG
Description
IC MMIC LNA 18GHZ-31GHZ 8SMD
Manufacturer
Avago Technologies US Inc.
Type
Low Noise Amplifierr
Datasheet

Specifications of AMMP-6233-BLKG

Rf Type
VSAT, DBS
Gain
23.2dB
Current - Supply
65mA
Frequency
18GHz ~ 32GHz
Noise Figure
2.6dB
P1db
8dBm
Package / Case
8-SMD
Test Frequency
18GHz
Voltage - Supply
3 V ~ 5 V
Frequency Rf
32GHz
Noise Figure Typ
2.6dB
Supply Current
65mA
Supply Voltage Range
3V To 5V
Frequency Max
32GHz
Termination Type
SMD
Package
8SMD
Typical Output Power
8(Min)@29000MHz dBm
Typical Power Gain
23.6@29000MHz dB
Typical Output Intercept Point
18(Min)@29000MHz dBm
Maximum Output Return Loss
13(Min)@29000MHz dB
Maximum Input Return Loss
10(Min)@29000MHz dB
Maximum Supply Voltage
5 V
Number Of Channels
1
Frequency (max)
32GHz
Power Supply Requirement
Single
Single Supply Voltage (min)
3V
Single Supply Voltage (typ)
3V
Single Supply Voltage (max)
5V
Package Type
SMD
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (typ)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Pin Count
8
Mounting
Surface Mount
Filter Terminals
SMD
Rohs Compliant
Yes
Frequency Min
18GHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AMMP-6233-BLKG
Manufacturer:
AVAGO/安华高
Quantity:
20 000
AMMP-6233
18 to 32 GHz GaAs Low Noise Amplifier
Data Sheet
Description
Avago Technologies’ AMMP-6233 is a high gain, low-
noise amplifier that operates from 18 GHz to 32 GHz. It
has a 3 dB noise figure, over 20 dB of gain and designed
to be an easy-to-use drop-in with any surface mount PCB
application. Popular applications include microwave ra-
dios, 802.16 and satellite VSAT or DBS receivers. The fully
integrated microwave circuit eliminated the complex
tuning and assembly processes typically required by
hybrid (discrete-FET) amplifiers. The surface mount pack-
age allows elimination of “chip & wire” assembly for lower
cost. The device has 50 Ω input and output match and
is unconditionally stable. The MMIC has fully integrated
input and output DC blocking capacitors and bias choke.
The backside of the package is both RF and DC ground
that simplifies the assembly process. It is fabricated in
a PHEMT process to provide exceptional low noise and
gain performance.
Pin Connections (Top View)
1
7
2
6
Note: these devices are esd seNsitive. the followiNg precautioNs are stroNgly recommeNded. eNsure
that aN esd approved carrier is used wheN uNits are traNsported from oNe destiNatioN to aNother.
persoNal grouNdiNg is to be worN at all times wheN haNdliNg these devices. the maNufacturer as-
sumes No respoNsibilities for esd damage due to improper storage aNd haNdliNg of these devices.
3
5
Pin Function
1
2
3
4
5
6
7
8
Vdd
RFout
RFin
Features
• Surface Mount Package, 5.0 x 5.0 x 1.25 mm
• Integrated DC block and choke
• 50 Ω Input and Output Match
• Single Positive Supply Pin
• No Negative Gate Bias
Specifications (Vd=3.0V, Idd=65mA)
• Broadband RF from 18 to 32 GHz
• High Gain of 23dB
• Low Gain Flatness: ± 1dB
• Typical Noise Figure of 2.6 dB
• Typical OIP3 of 19dBm
Applications
• Microwave Radio systems
• Satellite VSAT, DBS Up/Down Link
• LMDS & Pt-Pt mmW Long Haul
• Broadband Wireless Access
• WLL and MMDS loops
(including 802.16 and 802.20 WiMax)

Related parts for AMMP-6233-BLKG

AMMP-6233-BLKG Summary of contents

Page 1

... AMMP-6233 GHz GaAs Low Noise Amplifier Data Sheet Description Avago Technologies’ AMMP-6233 is a high gain, low- noise amplifier that operates from 18 GHz to 32 GHz. It has noise figure, over gain and designed easy-to-use drop-in with any surface mount PCB application. Popular applications include microwave ra- dios, 802.16 and satellite VSAT or DBS receivers. The fully integrated microwave circuit eliminated the complex tuning and assembly processes typically required by hybrid (discrete-FET) amplifiers. The surface mount pack- age allows elimination of “ ...

Page 2

... Max channel temperature Tstg Storage temperature Tmax Maximum Assembly Temp Notes: 1. Operation in excess of any of these conditions may result in per- manent damage to this device. The absolute maximum ratings for Vd, Id and Pin were determined at an ambient temperature of 25°C unless noted otherwise. (4,5,6) AMMP-6233 RF Specifications TA= 25°C, Vdd=3.0 V, Idd= 65 mA, Zin=Zo=50 Ω Symbol Parameters and Test Conditions Freq Operational Frequency Gain RF Small Signal Gain NF Noise Figure into 50Ω ...

Page 3

... AMMP-6233 Typical Performance (TA = 25°C, Vdd=3V, Idd=65mA, Zin = Zout = 50 Ω unless noted Frequency (GHz) Figure 1. Gain 0 -5 -10 -15 -20 -25 - Frequency (GHz) Figure 3. Input Return Loss 0 -5 -10 -15 -20 -25 - Frequency (GHz) Figure 5. Output Return Loss  6.0 5.0 4.0 3.0 2.0 1.0 0.0 ...

Page 4

... AMMP-6233 Typical Performance (cont) (TA = 25°C, Vdd=3V, Idd=65mA, Zin = Zout = 50 Ω unless noted Frequency (GHz) Figure 7. Gain over Vdd Frequency (GHz) Figure 9. Gain over Temperature 3.5 4 Vdd (V) Figure 11. Idd over Vdd Note: 1. S-parameters are taken with the Evaluation Board as shown in Figure 14. Effects of board and connector are included in the graphs. Loss of board and connector are de-embeded from Gain data. 2. Noise Figure is measured with a 3-dB pad at the input of the device. Losses are de-embeded from the data shown in Figure 2, 8 and 10. ...

Page 5

... AMMP-6233 Application and Usage Vdd 0.1uF RFin AMMP-6233 Figure 13. Application of AMMP-6233 Figure 14. Evaluation / Test Board (Available to qualified customer re- quests) In Figure 15. Simplified LNA Schematic Biasing and Operation The AMMP-6233 is normally biased with a positive drain supply connected to the VDD pin through a 0.1uF bypass capacitor as shown in Figure 13. The recommended drain supply voltage is 3V important to have 0.1uF bypass capacitor, and the capacitor should be placed as close to the component as possible ...

Page 6

... Figure 16b. PCB Stencil Layouts NOTES: DIMENSIONS ARE IN INCHES [MILIMETERS] ALL GROUNDS MUST BE SOLDERED TO PCB RF Material is Rogers RO4350, 0.010” thick The AMMP Packaged Devices are compatible with high volume surface mount PCB assembly processes. The PCB material and mounting pattern, as defined in the data sheet, optimizes RF performance and is strongly recommended. An electronic drawing of the land pat- tern is available upon request from Avago Sales & Ap- plication Engineering ...

Page 7

Manual Assembly • Follow ESD precautions while handling packages. • Handling should be along the edges with tweezers. • Recommended attachment is conductive solder paste. Please see recommended solder reflow profile. Neither Conductive epoxy or hand soldering is recom- mended. • Apply solder paste using a stencil printer or dot place- ment volume of solder paste will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical and electrical perfor- mance. • Follow solder paste and vendor’s recommendations when developing a solder reflow profile. A standard profile will have a steady ramp up from room tem- perature to the pre-heat temp. to avoid damage due to thermal shock. ...

Page 8

... Carrier Tape and Pocket Dimensions AMMP-6233 Part Number Ordering Information Devices Per Part Number Container AMMP-6233-BLKG 10 AMMP-6233-TR1G 100 AMMP-6233-TR2G 500 Note performance degradation is seen due to esd upto 50v hbm and 200v mm. the dc char- acteristics in general show increased leakage at lower esd discharge voltages. the user is reminded that this device is esd sensitive and needs to be handled with all necessary esd protocols ...

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