UPC8178TK-EV19 NEC, UPC8178TK-EV19 Datasheet
UPC8178TK-EV19
Specifications of UPC8178TK-EV19
Related parts for UPC8178TK-EV19
UPC8178TK-EV19 Summary of contents
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... Old Company Name in Catalogs and Other Documents st On April 1 , 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document valid Renesas Electronics document. We appreciate your understanding. ...
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All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm ...
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... The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. Document No. PU10063EJ02V0DS (2nd edition) ...
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ORDERING INFORMATION Part Number Order Number µ µ PC8178TK-E2 PC8178TK-E2-A 6-pin lead-less minimold (1511) (Pb-Free) Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales office. Remark To order evaluation samples, contact ...
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SYSTEM APPLICATION EXAMPLE Location examples in digital cellular Low Noise Tr These ICs can be added to your system around herein, however, shows only examples, therefore the application can depend on your kit evaluation. ÷N PLL ...
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... Ground pattern on the board should be formed as wide as possible. All the ground pins must be con- nected together with wide ground pattern to decrease impedance defference. Signal output pin. This pin is de- signed as collector output. Due to the high impedance output, this pin should be externally equipped with LC matching circuit to next stage ...
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ABSOLUTE MAXIMUM RATINGS Parameter Symbol Supply Voltage V CC Circuit Current I CC Power Dissipation P D Operating Ambient Temperature T A Storage Temperature T stg Input Power P in Note Mounted on double-sided copper-clad 50 × 50 × 1.6 ...
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TEST CIRCUITS <1> 1.0 GHz DUT <2> 1.9 GHz <3> 2.4 GHz ...
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ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD <1> 1.0 GHz IN Top View Mounting direction (∗1) 42 × 35 × 0.4 mm polyimide board, double-sided copper clad (∗2) Back side: GND pattern (∗3) Gold plated on ...
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GHz IN Top View Mounting direction (∗1) 42 × 35 × 0.4 mm polyimide board, double-sided copper clad (∗2) Back side: GND pattern (∗3) Gold plated on pattern (∗4) : Through holes COMPONENT LIST Form Symbol ...
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GHz IN Top View Mounting direction (∗1) 42 × 35 × 0.4 mm polyimide board, double-sided copper clad (∗2) Back side: GND pattern (∗3) Gold plated on pattern (∗4) : Through holes COMPONENT LIST Form Symbol ...
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TYPICAL CHARACTERISTICS (T CIRCUIT CURRENT vs. SUPPLY VOLTAGE 3.0 2.5 2.0 1 +25°C A 1.0 +50°C +85°C –40°C 0.5 –20° 0.5 1.0 1.5 2.0 2.5 3.0 Supply Voltage V (V) CC Remark The graph indicates nominal ...
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GHz MATCHING S -FREQUENCY 11 MARKER 1 1.0 GHz 1 START 100.000 000 MHz STOP 3 100.000 000 MHz S -FREQUENCY 11 S log MAG 2 dB/ REF –6.9156 ...
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S -FREQUENCY 11 S log MAG 2 dB/ REF –6.8297 11 0 –2 – – 40° –6 –8 –10 + 25°C –12 + 85°C –14 – – 30 dBm, V ...
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OUTPUT POWER vs. INPUT POWER 3 3.0 V –5 2.7 V –10 –15 –20 –25 –30 –20 –10 0 Input Power P (dBm) in OUTPUT POWER, IM vs. INPUT POWER 3 20 OIP ...
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OUTPUT POWER, IM vs. INPUT POWER 3 20 OIP = 3.0 dBm out (undes) 0 –10 –20 P out (des) –30 – (des (undes) – – ...
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GHz MATCHING S -FREQUENCY 11 1: 33.535 Ω –44.393 Ω MARKER 1 1.9 GHz 1 START 100.000 000 MHz STOP 3 100.000 000 MHz S -FREQUENCY 11 S log MAG 2 dB/ REF ...
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S -FREQUENCY 11 S log MAG 2 dB/ REF –8.2405 11 0 –2 – –40°C A –6 +25°C 1 –8 –10 –12 +85°C –14 –16 = −30 dBm 3 ...
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OUTPUT POWER vs. INPUT POWER 3 3.0 V –5 2.7 V –10 2.4 V –15 – 1.9 GHz –25 0 –30 –20 –10 Input Power P (dBm) in OUTPUT POWER, IM ...
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OUTPUT POWER, IM vs. INPUT POWER 3 20 OIP = 2.3 dBm out (undes) 0 –10 –20 P –30 out (des) – (undes) – – 900 MHz –70 ...
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GHz MATCHING S -FREQUENCY 11 1: 26.945 Ω –32.572 Ω MARKER 1 2.4 GHz 1 START 100.000 000 MHz STOP 3 100.000 000 MHz S -FREQUENCY 11 S log MAG 2 dB/ REF ...
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S -FREQUENCY 11 S log MAG 2 dB/ REF –2 – –40°C A –6 +25°C –8 1 –10 –12 +85°C –14 – – 30 dBm 3 ...
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OUTPUT POWER vs. INPUT POWER 3 3 –5 2.7 V –10 2.4 V –15 –20 –25 –10 –30 –20 0 Input Power P (dBm) in OUTPUT POWER, IM vs. INPUT POWER 3 ...
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OUTPUT POWER, IM vs. INPUT POWER 3 20 OIP = 1.1 dBm out (undes) 0 – (undes) –20 –30 IM –40 3 (des) – – 400 MHz ...
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GHz MATCHING S -FREQUENCY 11 1: 67.34 Ω –63.512 Ω 1 GHz 2: 34.416 Ω –46.209 Ω 1.9 GHz MARKER 4 3: 27.732 Ω –34.887 Ω 2.4 GHz 4: 24.257 Ω –25.16 Ω 2.1086 ...
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PACKAGE DIMENSIONS 6-PIN LEAD-LESS MINIMOLD (1511) (UNIT: mm) 24 (Top View) (Bottom View) 1.1±0.1 0.2±0.1 0.9±0.1 1.3±0.05 Data Sheet PU10063EJ02V0DS µ PC8178TK ...
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... Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to V (4) The inductor (L) should be attached between output and V should be adjusted for applied frequency to match impedance to next stage ...
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... NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. • ...
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... For further information, please contact NEC Compound Semiconductor Devices, Ltd. E-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) Hong Kong Head Office TEL: +852-3107-7303 TEL: +886-2-8712-0478 ...