SI4735-B20-GM Silicon Laboratories Inc, SI4735-B20-GM Datasheet - Page 21

• Manufacturer Part Number: SI4735-B20-GM
• Description: IC RX AM/FM/SW/LW RAD RDS 20UQFN
• Manufacturer: Silicon Laboratories Inc

Specifications of SI4735-B20-GM

• Package / Case: 20-UQFN, 20-µQFN
• Frequency: 153kHz ~ 279kHz, 520kHz ~ 1.71MHz, 2.3MHz ~ 21.85MHz, 64MHz ~ 108MHz
• Modulation Or Protocol: AM, FM, LW-SW, WB
• Applications: General Purpose
• Current - Receiving: 19.9mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Features: RSSI Equipped
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -20°C ~ 85°C
• Bus Type: I2C
• Maximum Frequency: 108 MHz, 1710 MHz
• Minimum Frequency: 76 MHz, 520 MHz
• Modulation Technique: AM, FM
• Mounting Style: SMD/SMT
• Function: Radio
• Supply Voltage (min): 2.7 V
• Supply Voltage (max): 5.5 V
• Minimum Operating Temperature: - 20 C
• Maximum Operating Temperature: + 85 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Sensitivity: -
• Memory Size: -
• Data Rate - Maximum: -
• Lead Free Status / Rohs Status: Compliant

Notes: General
Notes: Solder Mask Design
Notes: Stencil Design
Notes: Card Assembly
Symbol
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on IPC-SM-782 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the
1. A stainless steel, laser-cut, and electro-polished stencil with trapezoidal walls should
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads.
4. A 1.45 x 1.45 mm square aperture should be used for the center pad. This provides
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C
GD
D2
E2
D
E
e
f
Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.
solder mask and the metal pad is to be 60 µm minimum, all the way around the pad.
be used to assure good solder paste release.
approximately 70% solder paste coverage on the pad, which is optimum to assure
correct component stand-off.
specification for Small Body Components.
1.60
1.60
2.10
Min
Table 12. PCB Land Pattern Dimensions
Millimeters
2.71 REF
0.50 BSC
2.71 REF
2.53 BSC
Max
1.80
1.80
—
Rev. 0.5
Symbol
GE
ZD
ZE
W
X
Y
2.10
Min
—
—
—
—
Millimeters
0.61 REF
Si473x-B20
Max
0.34
0.28
3.31
3.31
—
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