MC13224V Freescale Semiconductor, MC13224V Datasheet

ZIGBEE PLATFORM 802.15.4 145-LGA

MC13224V

Manufacturer Part Number
MC13224V
Description
ZIGBEE PLATFORM 802.15.4 145-LGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MC13224V

Frequency
2.4GHz
Data Rate - Maximum
250kbps
Modulation Or Protocol
802.15.4 Zigbee
Applications
General Purpose
Power - Output
4dBm
Sensitivity
-100dBm
Voltage - Supply
2 V ~ 3.6 V
Current - Receiving
24mA
Current - Transmitting
29mA
Data Interface
PCB, Surface Mount
Memory Size
128kB Flash, 96kB RAM
Antenna Connector
PCB, Surface Mount
Operating Temperature
-40°C ~ 105°C
Package / Case
145-LGA
Number Of Receivers
1
Number Of Transmitters
1
Wireless Frequency
2.4 GHz
Interface Type
4-Wire SPI, I2C
Output Power
1.5 dBm
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Maximum Supply Current
31 mA
Minimum Operating Temperature
- 40 C
Modulation
OQPSK
Protocol Supported
802.15.4
No. Of Pins
99
Supply Voltage Range
2V To 3.6V
Operating Temperature Range
-40°C To +125°C
Msl
MSL 3 - 168 Hours
A/d Converter
12 Bits
No. Of Timers 8/12/16/32 Bits
0 / 0 / 4 / 0
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC13224V
Manufacturer:
Freescale Semiconductor
Quantity:
1 849
Part Number:
MC13224VR2
Manufacturer:
EPCOS
Quantity:
34 000
Freescale Semiconductor
Technical Data
MC1322x
Advanced ZigBee
Platform-in-Package (PiP) for the
2.4 GHz IEEE
Standard
1
The MC1322x family is Freescale’s third-generation
ZigBee platform which incorporates a complete, low
power, 2.4 GHz radio frequency transceiver, 32-bit
ARM7 core based MCU, hardware acceleration for both
the IEEE 802.15.4 MAC and AES security, and a full set
of MCU peripherals into a 99-pin LGA
Platform-in-Package (PiP).
The MC1322x solution can be used for wireless
applications ranging from simple proprietary
point-to-point connectivity to complete ZigBee mesh
networking. The MC1322x is designed to provide a
highly integrated, total solution, with premier processing
capabilities and very low power consumption.
The MC1322x MCU resources offer superior processing
power for ZigBee applications. A full 32-bit
ARM7TDMI-S core operates up to 26 MHz. A 128
Kbyte FLASH memory is mirrored into a 96 Kbyte
RAM for upper stack and applications software. In
addition, an 80 Kbyte ROM is available for boot
software, standardized IEEE 802.15.4 MAC and
Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its
products.
© Freescale Semiconductor, Inc., 2005, 2006, 2007, 2008, 2009, 2010. All rights reserved.
Introduction
®
802.15.4
- Compliant
1
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 High Density, Low Component Count, Integrated
4 Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5 MCU Peripherals . . . . . . . . . . . . . . . . . . . . . . 19
6 Pin Assignments and Connections . . . . . . 28
7 System Electrical Specification . . . . . . . . . 36
8 Developer Environment . . . . . . . . . . . . . . . . 48
9 Mechanical Diagrams
See
MC13224VR2
MC13226VR2
IEEE 802.15.4 Solution
(Case 1901-01, non-JEDEC)
MC13224V
MC13226V
Table 1
Device
99-Pin [9.5X9.5X1.2mm]
for more details.
Package Information
1
1
Document Number: MC1322x
Ordering Information
MC1322x
1
1
Case 1901-01
Device Marking
MC13224V
MC13224V
MC13226V
MC13226V
Rev. 1.3 10/2010
Package
LGA
LGA
LGA
LGA
51
10

Related parts for MC13224V

MC13224V Summary of contents

Page 1

... System Electrical Specification . . . . . . . . . 36 8 Developer Environment . . . . . . . . . . . . . . . . 48 9 Mechanical Diagrams (Case 1901-01, non-JEDEC) Document Number: MC1322x Rev. 1.3 10/2010 MC1322x Package Information Case 1901-01 99-Pin [9.5X9.5X1.2mm] Ordering Information Device Device Marking 1 MC13224V 1 MC13224V 1 MC13226V 1 MC13226V Table 1 for more details. Package LGA LGA LGA LGA 10 51 ...

Page 2

... Lighting control — Security — Access control — Heating, ventilation, air-conditioning (HVAC) — Automated meter reading (AMR) • Industrial Control TX/RX SWITCH LNA Figure 1. MC1322x RF Radio Interface MC1322x Technical Data, Rev. 1.3 Figure 1. An onboard balun ANALOG TRANSMITTER ANALOG RECEIVER Freescale Semiconductor ...

Page 3

... The MC1322x family is available as two part numbers. These device types differ only in their ROM contents, all other device hardware, performance, and specifications are identical: • MC13224V - this is the original version and is the generic part type. — The MC13224V is intended for most IEEE 802.15.4 applications including MAC-based, ZigBee-2007 Profile 1, and ZigBee RF4CE targets. ...

Page 4

... Table 1 provides additional details about the MC1322x Operating Device Temp Range (TA.) MC13224V -40° to 105° C LGA MC13224VR2 -40° to 105° C LGA Tape and Reel MC13226V -40° to 105° C LGA MC13226VR2 -40° to 105° C LGA Tape and Reel 2 Features This section provides a simplified block diagram and highlights MC1322x features. ...

Page 5

... Dedicated 802.15.4 modem/radio interface module (RIF) — Dedicated NVM SPI interface for managing FLASH memory — Two dedicated UART modules capable of 2 Mbps with CTS/RTS support — SPI port with programmable master and slave operation Freescale Semiconductor MC1322x Technical Data, Rev. 1.3 5 ...

Page 6

... V to 3.6 V operating voltage with on-chip voltage regulators. • Optional buck converter for better battery life. • -40 °C to +105 °C temperature range • RoHS-compliant 9.5mm x 9.5mm x 1.2mm 99-pin LGA package interface 2 S and SPI capability and FIFO data buffering MC1322x Technical Data, Rev. 1.3 Freescale Semiconductor ...

Page 7

... Supports star, mesh and cluster tree topologies • Does not support beaconed networks • Does not supports GTS • Multiple power saving modes • AES-128 Security module • 802.15.4 Sequence support Freescale Semiconductor NOTE NOTE MC1322x Technical Data, Rev. 1.3 Platform”. ® 7 ...

Page 8

... At the Application Layer, the application support layer (ASL) facilitates information exchange between the Application Support Sub-Layer (APS) and application objects. Finally, ZigBee Device Objects (ZDO), in addition to other manufacturer-designed applications, allow for a wide range of useful tasks applicable to home and industrial automation. 8 MC1322x Technical Data, Rev. 1.3 ® Freescale Semiconductor ...

Page 9

... When using the BeeStack codebases on the MC1322x platform, the application should be targeted to the proper part number: • MC13224V should be used for ZigBee Profile 1 applications • MC13226V should be used for ZigBee Profile 2 (Pro) applications BeeStack for the MC1322x platform is a single codebase, device selection is determined by a configuration wizard when the BeeKit project is first developed ...

Page 10

... The MC1322x RF interface provides for a single-ended, 50-Ω port that connects directly to an antenna. There is an onboard balun that converts the single-ended interface to a full differential, bi-directional, on-chip interface with transmit/receive switch, LNA, and complementary PA outputs. The required port 10 MC1322x Technical Data, Rev. 1.3 Freescale Semiconductor ...

Page 11

... Regulated voltage source for PA biasing and powering external components 3.1.2 Modem The modem supports the full requirement of the IEEE 802.15.4 Standard to transmit and receive data packets. In additional, the mechanism is present to measure received signal level to provide CCA, ED, and LQI as required by the 802.15.4 Standard. Freescale Semiconductor MC1322x Technical Data, Rev. 1.3 11 ...

Page 12

... Registers (6 Status Registers Multiplier Barrel Shifter 32-Bit Alu Instruction Pipeline Read Data Register Write Data Register Thumb Instruction Decoder WDATA[31:0] RDATA[31:0] Figure 3. ARM7TDMI-S 32-Bit CPU Core MC1322x Technical Data, Rev. 1.3 Scan Debug Control Instruction Decoder and Control Logic Freescale Semiconductor ...

Page 13

... Controls reference clocks based on default 24 MHz crystal oscillator or optional 13-26 MHz oscillator with PLL (external filter) for 24 MHz frequency synthesis. • MCU watchdog timer (COP) • Software initiated reset • Management control of onboard linear regulators and optional buck regulator Freescale Semiconductor MC1322x Technical Data, Rev. 1.3 Section 7.4, “Supply 13 ...

Page 14

... The buck regulator drops the higher battery voltage to 1.8 - 2.0 Vdc that is applied to the onboard linear regulators. This allows lower net current from the battery to maximize the life of the battery. 14 MC1322x Technical Data, Rev. 1.3 Figure 4 Freescale Semiconductor ...

Page 15

... MACA facilitates these activities via control of the transceiver and off loads the functions from the CPU. A dedicated DMA function moves data between the MACA buffers and RAM on a cycle steal basis and does not require intervention from the CPU. Freescale Semiconductor VDD VBATT ...

Page 16

... Sequences are combinations of radio operations and are highly configurable. — RX warm- µs 16 Sequencer Control Registers Timers DMA TX Packet Buffer RX Packet Buffer MACA FCS Generator/ Checker MC1322x Technical Data, Rev. 1.3 To MCU Bus Freescale Semiconductor ...

Page 17

... CTR encryption in 13 clock cycles • CBC encryption in 13 clock cycles • Encrypts 128 bits as a unit • The 128-bit registers are aligned on quad word boundaries (16 byte) • Self-test mode • Maskable “action complete” interrupt Freescale Semiconductor MC1322x Technical Data, Rev. 1.3 17 ...

Page 18

... RAM. The serial FLASH is accessed via an internal dedicated SPI module (SPIF). The FLASH erase, program, and read capability are programmed through the SPIF port. The FLASH is accessed at boot time to load/initialize RAM. All actual CPU program and data access is from RAM or ROM. 18 MC1322x Technical Data, Rev. 1.3 Freescale Semiconductor ...

Page 19

... MCU Peripherals The MC1322x has a rich set of MCU peripherals I & Freescale Semiconductor Figure 6 shows the peripheral modules Figure 6. MCU Peripherals MC1322x Technical Data, Rev. 1.3 19 ...

Page 20

... During Hibernate or Doze, the KBI are unique in that they are kept alive. Four KBI are outputs and four KBI are inputs. The inputs can be enabled as asynchronous interrupts to wake-up the MC1322x from the sleep mode. 20 MC1322x Technical Data, Rev. 1.3 Freescale Semiconductor ...

Page 21

... OFLAG signal can be set, cleared, or toggled. At match time, an interrupt is generated (if enabled), and the new compare value is loaded into the COMP1 or COMP2 registers from CMPLD1 and CMPLD2 if enabled • The Prescaler provides different time bases useful for clocking the counter/timer Freescale Semiconductor COMP1 Comparator COMP2 Comparator ...

Page 22

... Full duplex four-wire serial interface (RXD, TXD, RTS, and CTS) • Hardware flow control support for RTS and CTS signals • 32-byte receive FIFO and 32-byte transmit FIFO • Programmable sense for RTS/CTS pins (high true/low true) 22 MC1322x Technical Data, Rev. 1.3 Freescale Semiconductor ...

Page 23

... Bus busy detection • Software-programmable bit clock frequency up to 150 kbps • Software-selectable acknowledge bit • On-chip filtering for spikes on the bus Freescale Semiconductor 2 C) Module 2 C) module for the allows for data exchange between the MC1322x Technical Data, Rev. 1.3 ...

Page 24

... SPI FLASH Module (SPIF) The SPIF is an internal SPI block dedicated to control, reading, and writing of the serial FLASH memory (NVM). It uses the same architecture as the general SPI block, but is limited by the characteristics of the FLASH SPI interface. 24 MC1322x Technical Data, Rev. 1.3 Freescale Semiconductor ...

Page 25

... Program options for frame sync and clock generation 2 • Programmable I S modes (Master, Slave) • Programmable internal clock divider • Time Slot Mask Registers for reduced CPU overhead (for Tx and Rx both) • SSI power-down feature Freescale Semiconductor 2 S LSB, MSB aligned MC1322x Technical Data, Rev. 1.3 25 ...

Page 26

... ADC module ntrol O verride equ encer nable IFO (8 x 16-B it, 12-bit valu channel Tag ntrol O verride equ encer nable 300 kH z Figure 8. ADC Module Block Diagram MC1322x Technical Data, Rev. 1 attery A n alog C h ann els nalog Freescale Semiconductor ...

Page 27

... Active channels for each ADC are programmable • Eight active monitors plus battery reference monitors can generate a IRQ • An 8-deep FIFO for recording data • IRQs can be generated by the channel compare values, FIFO status, and sequencers Freescale Semiconductor MC1322x Technical Data, Rev. 1.3 27 ...

Page 28

... Active Signal Pads MC1322x Technical Data, Rev. 1 XTAL_32_OUT 48 XTAL_32_IN 47 73 RF_PLL_FLT 46 VBATT 82 45 LREG_BK_FB 44 91 COIL_BK 43 100 KBI_0_HST_WK 42 KBI_1 41 109 KBI_2 40 KBI_3 118 39 KBI_4 38 127 KBI_5 37 KBI_6 136 36 KBI_7 35 145 SSI_TX 34 SSI_RX MC1322x Freescale Semiconductor ...

Page 29

... UART2_RTS Digital Input/Output 14 UART2_CTS Digital Input/Output 15 UART2_RX Digital Input/Output Freescale Semiconductor Table 2. Pin Function Description 1 Description ADC analog input Channel 0 / ADC sample channel can be used by either GPIO30 ADC_1 or ADC_2. ADC analog input Channel 1/ ADC sample channel can be used by either GPIO31 ADC_1 or ADC_2. ...

Page 30

... SSI Frame Sync / GPIO2 SSI frame sync for data (RX or TX) and is bi-directional. SSI RX data input / GPIO1 SSI serial RX data input. SSI TX data output / GPIO0 SSI serial TX data output. Keyboard Interface Bit 7 / Asynchronous interrupt input. GPIO29 MC1322x Technical Data, Rev. 1.3 Functionality Freescale Semiconductor ...

Page 31

... XTAL_24_OUT Analog Output Primary 24 MHz crystal 50 XTAL_24_IN Analog Input 51 RESETB Digital Input 52 TX_ON Digital Input/Output Freescale Semiconductor 1 Description Keyboard Interface Bit 6 / Asynchronous interrupt input. GPIO28 Keyboard Interface Bit 5 / Asynchronous interrupt input. GPIO27 Keyboard Interface Bit 4 / Asynchronous interrupt input. GPIO26 Keyboard Interface Bit 3 / Used as output for keyboard interface ...

Page 32

... High reference voltage for VREFH for ADC_1. ADC_1 / GPIO40 Low reference voltage for VREFH for ADC_2. ADC_2 / GPIO38 External package GND pads. Connect to ground. Common VSS. External package GND pads. Connect to ground. Common VSS. MC1322x Technical Data, Rev. 1.3 Functionality Freescale Semiconductor ...

Page 33

... Digital Input/Output 131 MCKO Digital Input/Output 132 EVTI_B Digital Input/Output Freescale Semiconductor 1 Description External package GND pads. Connect to ground. Common VSS. Message Data Out Bit 1 output / Nexus debug port message data output Bit 1. GPIO52 Message Data Out Bit 0 output / Nexus debug port message data output Bit 0. ...

Page 34

... Can be connected to VDD when regulated 1.8Vdc mode is used. These pads are provided for extra mechanical attach strength to meet demanding requirements of drop tests. Table 3 shows how the MC1322x pins are Name VBATT GND GND GND GND GND GND GND GND GND Freescale Semiconductor ...

Page 35

... Table 4. Nexus 38-Pin Mictor Connector Assignments Name VBATT(pullup) TDO NC TCK TMS TDI RESET means No Connect. 2 VBATT through a 100k-Ω pullup. 3 VBATT isolated by a 1k-Ω resistor. 4 VBATT through a 100k-Ω pullup. Freescale Semiconductor Table 4 shows the device pins that are connected to the 1 Pin # Pin # ...

Page 36

... Table 5. LGA Package Maximum Ratings MC1322x Technical Data, Rev. 1 the SS BATT Symbol Value T 125 J T -55 to 125 stg MSL3-260 260 -0.3 to 3.7 BATT DDINT Vin -0 0.2) DDINT P 10 max Freescale Semiconductor Unit °C °C °C Vdc Vdc dBm ...

Page 37

... Input Low Voltage (All digital inputs) Input High Voltage (all digital inputs) Input hysteresis (all digital inputs) Internal pullup and pulldown resistors (all port pins and IRQ) Output High Voltage ( mA) (All digital outputs) OH Freescale Semiconductor ) DD Table 7. DC Electrical Characteristics = 25 °C, unless otherwise noted ...

Page 38

... MC1322x Technical Data, Rev. 1.3 Symbol Min Typ Max 20 BATT — TBD I — TBD OLT C — 3 — In for pulldown. Symbol Min Typ Max 0.4 0.6 0.9 2.2 2.3 4.9 3 0.85 .95 Freescale Semiconductor Unit Unit μA μA μA μA μA μA μA μA μA mA ...

Page 39

... Chip Detection (DCD) mode which has 3-4dBm less sensitivity but requires 3-4mA less receiver current, and 2) Non-coherent Detection (NCD) mode which has 3-4dBm greater sensitivity but requires 3-4mA greater receiver current. 2 Minimum set by IEEE 802.15.4 Standard Freescale Semiconductor = 25 °C, unless otherwise noted) A Symbol ...

Page 40

... EVM Symbol PA_POS (Typ) PA_NEG (Typ) 64.7 - j43.9 61.0 - j31.9 Zout 64.5 - j42.9 60.7 - j30.7 64.3 - j42.0 60.4 - j29.5 MC1322x Technical Data, Rev. 1.3 Min Typ Max Unit -2 1.5 4.5 dBm - +4 - dBm - 250 - kbps - -55 - dBm -64 - dBm ohm Unit Ω Freescale Semiconductor ...

Page 41

... The reference oscillator model including external crystal in shown in Standard requires a frequency tolerance less than or equal to +/- 40 ppm as shown in the oscillator specification Table 12. With a suitable crystal (refer to the device frequency tolerance can typically trimmed to be held to +/- 30 ppm over all conditions. MC13224V Course Tune[4] 4pF Course Tune[3:0] 8pF 4pF ...

Page 42

... Mode of oscillation 1 A wider frequency tolerance may acceptable if application uses trimming at production final test. 2 The higher ESR may be acceptable with lower load capacitance. 7.7 Optional 32.768 KHz Crystal Oscillator Specifications MC13224V l Characteristic 1 Crystal frequency Frequency tolerance @ 25 °C Frequency tolerance over temperature ...

Page 43

... Four-bit synchronizer circuits determine the shortest input pulses that can be recognized or the fastest clock that can be used as the optional external source to the timer counter. These synchronizers operate from the peripheral clock rate. Freescale Semiconductor Symbol Min Abracom Corporation crystal part number ABS25-32.768-12.5 -68 ...

Page 44

... Table 18. SPI Timing Symbol Min t peripheral_ CYC Clk CYC t 10 SS_SU t 10 SS_H t 10 SI_SU t 10 SI_H t 20 MI_SU t 0 MI_H MC1322x Technical Data, Rev. 1.3 Max Unit peripheral_bus_clk/3 MHz — t cyc — t cyc t SS_H Typical Max Unit 38 peripheral_ ns Clk *256 Freescale Semiconductor ...

Page 45

... SDA and SCL are open drain outputs SDA LOW SCL HD;DAT S 2 The I C timing limits reflect values that are necessary meet to the I specification. Freescale Semiconductor 2 C system Signal DC Specifications (I2C_SDA and I2C_SCL) Symbol Min V -0 0.7 VBATT IH 0.06 × VBATT V hys V 0 ...

Page 46

... SCL IHmin ) of the SCL signal. LOW >= 250 ns SU;DAT r max Freescale Semiconductor Unit kHz μs μs μs μs μ μs pF ...

Page 47

... LREG_BK_FB = 3 °C, fref = 24 MHz, unless otherwise noted.) Characteristic ADC supply current (per ADC) Reference potential, low Reference potential, high 1 Analog input voltage “Battery” input channel reference voltage 1 Maximum electrical operating range, not valid conversion range. Freescale Semiconductor Table 21. FLASH Characteristics Symbol V prog/erase f FCLK t D_ret Condition Symbol ...

Page 48

... AIN + 0.2 and V - 0.2 for valid conversion. REFH Connector””, is connected to the TDI, Connector”). Development features include: MC1322x Technical Data, Rev. 1.3 Typ Max Unit - 300 KHz 6 ADCCLK cycles 20 — - — — REFL REFH Freescale Semiconductor Bits Bits μ ...

Page 49

... The configuration parameters can be validated inside BeeKit to ensure all values provided are within acceptable ranges prior to generation of a workspace. All this functionality provides a mechanism for developers to configure and validate their network parameters Freescale Semiconductor ™ Wireless Connectivity Toolkit. BeeKit is a stand alone software operating systems ...

Page 50

... Several different development modules and kits will be available to allow evaluation of ZigBee and IEEE 802.15.4 applications. The modules will provide capabilities for Coordinator, Router, and End Device nodes. Reference designs will be available for RF design and low power applications including 2-layer and 4-layer PCBs. 50 MC1322x Technical Data, Rev. 1.3 Freescale Semiconductor ...

Page 51

... Mechanical Diagrams (Case 1901-01, non-JEDEC) Freescale Semiconductor Figure 14. Mechanical Diagram ( MC1322x Technical Data, Rev. 1.3 51 ...

Page 52

... Figure 15. Mechanical Diagram Bottom View ( MC1322x Technical Data, Rev. 1.3 Freescale Semiconductor ...

Page 53

... Freescale Semiconductor NOTES MC1322x Technical Data, Rev. 1.3 53 ...

Page 54

... Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase ...

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