IC RF TXRX SNGL-CHIP LP 20-QFN

CC2500-RTR1

Manufacturer Part NumberCC2500-RTR1
DescriptionIC RF TXRX SNGL-CHIP LP 20-QFN
ManufacturerTexas Instruments
CC2500-RTR1 datasheet
 


Specifications of CC2500-RTR1

Frequency2.4GHzData Rate - Maximum500kBaud
Modulation Or Protocol2-FSK, ASK, GFSK, MSK, OOKApplicationsISM, SRD
Power - Output-30dBm ~ 10dBmSensitivity-104dBm
Voltage - Supply1.8 V ~ 3.6 VCurrent - Receiving17mA
Current - Transmitting21.5mA @ 1 dBmData InterfacePCB, Surface Mount
Antenna ConnectorPCB, Surface MountOperating Temperature-40°C ~ 85°C
Package / Case20-VQFN Exposed Pad, 20-HVQFN, 20-SQFN, 20-DHVQFNOperating Temperature (min)-40C
Operating Temperature (max)85COperating Temperature ClassificationIndustrial
Product Depth (mm)4mmProduct Length (mm)4mm
Operating Supply Voltage (min)1.8VOperating Supply Voltage (typ)2.5/3.3V
Operating Supply Voltage (max)3.6VFor Use With296-24121 - DEV WRLSS TOOL FOR MSP430296-23125 - TARGET BRD WIRELESS EZ430-RF2500296-23031 - DEV WRLSS TOOL FOR MSP430/CC2500296-22903 - KIT EVAL MODULE FOR CC2500296-23077 - KIT DEV FOR CC2500/CC2550
Lead Free Status / RoHS StatusContains lead / RoHS non-compliantMemory Size-
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
Page 81
82
Page 82
83
Page 83
84
Page 84
85
Page 85
86
Page 86
87
Page 87
88
Page 88
89
Page 89
90
Page 90
91
92
93
94
95
96
Page 90/96

Download datasheet (3Mb)Embed
PrevNext
www.ti.com
PACKAGING INFORMATION
(1)
Orderable Device
Status
CC2500-RTR1
ACTIVE
CC2500-RTY1
ACTIVE
CC2500RTK
ACTIVE
CC2500RTKG3
ACTIVE
CC2500RTKR
ACTIVE
CC2500RTKRG3
ACTIVE
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
Package
Package
Pins Package
Type
Drawing
Qty
VQFN
RTK
20
3000 Green (RoHS &
VQFN
RTK
20
92
Green (RoHS &
VQFN
RTK
20
92
Green (RoHS &
VQFN
RTK
20
92
Green (RoHS &
VQFN
RTK
20
3000 Green (RoHS &
VQFN
RTK
20
3000 Green (RoHS &
Addendum-Page 1
(2)
Eco Plan
Lead/Ball Finish
MSL Peak Temp
CU NIPDAU
Level-3-260C-168 HR
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
no Sb/Br)
8-Dec-2009
(3)