RFID UHF GEN II STRAP

RI-UHF-STRAP-08

Manufacturer Part NumberRI-UHF-STRAP-08
DescriptionRFID UHF GEN II STRAP
ManufacturerTexas Instruments
RI-UHF-STRAP-08 datasheet
 

Specifications of RI-UHF-STRAP-08

Rf TypeRead / WriteFrequency860 ~ 960MHz
FeaturesISO18000-6C, 192-bitsPackage / Case8mm x 3mm
Lead Free Status / RoHS StatusLead free / RoHS CompliantOther names481-1115-2
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FEATURES
Meets EPCGlobal™ Gen2 (v. 1.0.9) and
ISO/IEC 18000-6C
860 ~ 960 MHz Global Operating Frequency
Supports Optional Gen2 Commands: Block
Write and Block Erase
192-bit memory: 96-bit Electronic Product
Code (EPC™), 32-bit Access Password, 32-
bit KILL Password, 32-bit TID memory
(Factory Programmed and Locked)
Designed for High-performance, Low Power
Consumption based on most Advanced
Silicon Process Node for RFID (130 nm)
Fast tag Singulation using most Advanced
Anti-Collision Scheme
Suitable for H-field and E-field operation
RoHS Compliant
APPLICATIONS
Supply Chain Management & Distribution
Logistics
Express Parcel Delivery
Airline Baggage Handling
Asset Tagging
ORDERING INFORMATION
Texas Instruments’ UHF Gen2 Strap is available as listed in Table 1:
PART NUMBER
RI-UHF-STRAP-08
EPCGlobal™ UHF Gen2 Strap
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appear at the end of this data sheet.
PRODUCTION DATA Information is current as of publication
data. Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
UHF Gen2 STRAP
DESCRIPTION
Large retailers have issued mandates to their suppliers to ship
cases and pallets of goods/products with RFID Smart Labels
attached.
TI’s Gen2 Straps are intended to simplify the
manufacture of inlays for conversion into Smart Labels for various
applications. The Straps are based on the EPCGlobal™ Gen2
specification (v. 1.0.9) and ISO/IEC 18000-6C
TI’s Gen2 Straps operate with extremely low power and yet
provide long read and write ranges, fast data transfer and high
Smart Label throughput.
A detailed description of the command set, memory and operation
of the Strap is given in the UHF Gen2 Protocol reference Guide
(literature number 11-09-21-700)
DESCRIPTION
Table 1: Part Number
WWW.TI.COM
RI-UHF-STRAP-08
11-09-22-706 – OCT 2006
©
Copyright
2006, Texas Instruments Incorporated
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RI-UHF-STRAP-08 Summary of contents

  • Page 1

    ... Smart Label throughput. A detailed description of the command set, memory and operation of the Strap is given in the UHF Gen2 Protocol reference Guide (literature number 11-09-21-700) DESCRIPTION Table 1: Part Number WWW.TI.COM RI-UHF-STRAP-08 11-09-22-706 – OCT 2006 © Copyright 2006, Texas Instruments Incorporated 1 ...

  • Page 2

    ... Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the Strap. These are the stress ratings only and functional operation of the device at these or any other condition beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to absolute maximum rated conditions for extended periods may affect the device reliability ...

  • Page 3

    ... STRAP MECHANICAL SPECIFICATIONS The mechanical details of each strap is shown below PARAMETER Substrate thickness (PET) Die Height Aluminum layer Thickness Substrate Material Substrate Elasticity (Young’s Modulus) Coefficient of Thermal Expansion (CTE) Strap Web Width Strap Pitch MECHANICAL SPECIFICATIONS VALUE 50 micron (2 mil) 150 micron (6 mil) 10 micron (0 ...

  • Page 4

    OCT 2006 STRAP DELIVERY AND FURTHER HANDLING STRAP DELIVERY Straps are delivered on reels of 40,000 units. The reel details are shown below STRAP MARKINGS Ink dots diameter are used to indicate the status of ...

  • Page 5

    ... Shear Force 6 N (1.35 lbf) CHIP AREA PRESSURE During the Strap conversion process, the pressure on the chip must not exceed 10 N/mm Pressure (per unit die area) 10 N/mm (1450 psi) EXCESSIVE PRESSURE ON THE CHIP AREA WILL RESULT IN THE CHIP/SUBSTRATE CONDUCTOR CRACKING AND ...

  • Page 6

    ... Minimum Bending Radius (towards the center) ESD PRECAUTIONS During winding and un-winding operations, the Strap tape can become electrostatically charged. The high current density of the electrostatic discharge (ESD) can severely damage the Straps’ chips. The amount of ESD very much depends on the winding speed and tension. We strongly advise that de-ionization equipment is installed at all wind/ un-wind points ...

  • Page 7

    ... Strap alignment and to aid inspection and qualification. The pads of the Straps must fall within the tolerance marks outlined on the antenna to determine the correct positioning: The drawings below show Straps, whose placement is within tolerance Off center – low and right The drawings below show Straps with out-of-tolerance placements 3½” (88.9 mm) ...

  • Page 8

    ... The bonding area is shown below. ANTENNA SUBSTRATE MATERIALS With Straps, the creation of inlays is made much easier. Antennas can be produced on a variety of substrate materials including direct printing, using conductive inks onto non-conductive materials such as paper, cartons and thin film polymers. Texas Instruments uses PET (Polyethylene Terephthalate substrate. This material is stable, clear, can be printed and has a melting point close to 250 º ...

  • Page 9

    ... TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof ...