FMG2G300US60E Fairchild Semiconductor, FMG2G300US60E Datasheet

FMG2G300US60E

Manufacturer Part Number

FMG2G300US60E

Description

IGBT MOLDING 600V 300A 7PM-HA

Manufacturer

Fairchild Semiconductor

Datasheet

1.FMG2G300US60E.pdf (7 pages)

Specifications of FMG2G300US60E

Configuration

Half Bridge

Voltage - Collector Emitter Breakdown (max)

600V

Vce(on) (max) @ Vge, Ic

2.7V @ 15V, 300A

Current - Collector (ic) (max)

300A

Current - Collector Cutoff (max)

250µA

Power - Max

892W

Input

Standard

Ntc Thermistor

Mounting Type

Chassis Mount

Package / Case

7PM-HA

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Igbt Type

Input Capacitance (cies) @ Vce

Available stocks

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Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

FMG2G300US60E

Manufacturer:

FAIRCHILD

Quantity:

492

Company:

HONG KONG JIETUO ZIJING INTERNATIONAL TRADING CO., LIMITED

Part Number:

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This is to inform you that a design and/or process change will be made to the following

product(s). This notification is for your information and concurrence.

If you require data or samples to qualify this change, please contact Fairchild Semiconductor

within 30 days of receipt of this notification.

Updated process quality documentation, such as FMEAs and Control Plans, are available for

viewing upon request.

If you have any questions concerning this change, please contact:

PCN Originator:

Name: SONG, HEEYUNG

E-mail: HEEYUNG.SONG@fairchildsemi.com

Phone: 82-32-680-1216

Implementation of change:

Expected 1st Device Shipment Date: 2008/04/06

Earliest Year/Work Week of Changed Product: 0815

Change Type Description: Test Location

Description of Change (From): Assembly & TEST: Fine Silicon Power Networks(FineSPN)

Description of Change (To): Assembly: Fine Silicon Power Networks(FineSPN) Test: DB

Power Tech Inc. It's also certified for ISO9001 and ISO14001 certificated.

Reason for Change : Outsourcing of Final test. There are no changes to equipment and system.

Qual/REL Plan Numbers : Q20070533

Qualification :

This change doesn't require Reliability test.

Results/Discussion

Test: (Bake)

Lot

Q20070533AABAKE

Product Id Description : All IGBT MODULE devices packaged with 25PM-AA, 7PM-GA,

7PM-HA, 7PM-IA. The products affected by this change are listed below in the

"Affected FSIDs" section.

Affected FSIDs :

FMG2G100US60

DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL

Technical Contact:

Name: SONG, HEEYUNG

E-mail: HEEYUNG.SONG@fairchildsemi.com

Phone: 82-32-680-1216

Device

FMG2G75US60

FMG2G150US60

24-HOURS

0/11

FMG2G150US60E

Date Issued On : 2008/01/22

Date Created : 2007/12/03

Failure Code

PCN# : Q4074901

Pg. 1

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FMG2G300US60E Summary of contents

Page 1

... This is to inform you that a design and/or process change will be made to the following product(s). This notification is for your information and concurrence. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. Updated process quality documentation, such as FMEAs and Control Plans, are available for viewing upon request ...

Page 2

... FMG2G200US60 FMG2G300US60E FMG2G50US60 FMG2G300LS60E FMG2G400LS60 FMG2G75US60 FMG2G300US60 FMG2G400US60 Pg. 2 ...

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