HiPerFET
TM
Power MOSFET
Single Die MOSFET
Preliminary data sheet
Symbol Test Conditions
V
T
= 25°C to 150°C
DSS
J
V
T
= 25°C to 150°C, R
= 1MΩ
DGR
J
GS
V
Continuous
GS
V
Transient
GSM
I
T
= 25°C
D25
C
I
T
= 25°C;
Note 1
DM
C
I
T
= 25°C
AR
C
E
T
= 25°C
AR
C
≤ I
, di/dt ≤ 100 A/µs, V
dv/dt
I
S
DM
≤ 150°C, R
= 2 Ω
T
J
G
P
T
= 25°C
D
C
T
J
T
JM
T
stg
V
50/60 Hz, RMS
t = 1 min
ISOL
I
≤ 1 mA
t = 1 s
ISOL
M
Mounting torque
d
Terminal connection torque
Weight
Symbol
Test Conditions
(T
= 25°C, unless otherwise specified)
J
V
V
= 0 V, I
= 1mA
DSS
GS
D
V
V
= V
, I
= 8mA
GS(th)
DS
GS
D
I
V
= ±20V, V
= 0V
GSS
GS
GS
I
V
= V
DSS
DS
DSS
V
= 0 V
GS
R
V
= 10V, I
= I
DS(on)
GS
D
T
Note 2
© 2003 IXYS All rights reserved
IXFE 55N50
IXFE 50N50
Maximum Ratings
500
500
±20
±30
55N50
50N50
55N50
200
50N50
220
≤ V
DD
DSS
500
-40 ... +150
150
-40 ... +150
2500
3000
1.5/13 Nm/lb.in.
1.5/13 Nm/lb.in.
19
Characteristic Values
Min.
Typ.
Max.
500
2.5
T
= 25°C
J
T
= 125°C
J
55N50
50N50
V
I
DSS
D25
500 V
50 A
500 V
47 A
≤ ≤ ≤ ≤ ≤ 250 ns
t
rr
ISOPLUS 227
(IXFE)
TM
G
V
V
V
V
47
A
50
A
A
G = Gate
A
S = Source
55
A
Either Source terminal at miniBLOC can be used
as Main or Kelvin Source
60
mJ
Features
5
V/ns
•
Low cost direct-copper bonded
aluminium package
W
•
Encapsulating epoxy meets
°C
UL 94 V-0, flammability classification
°C
•
2500V isolation
°C
•
Low drain to case capacitance
•
Low R
HDMOS
V~
DS (on)
•
Rugged polysilicon gate cell structure
V~
•
Unclamped Inductive Switching (UIS)
rated
•
Low package inductance
g
•
Fast intrinsic Rectifier
•
Conforms to SOT-227B outline
Applications
•
DC-DC converters
•
Battery chargers
•
Switched-mode and resonant-mode
V
power supplies
•
4.5
V
DC choppers
•
Temperature and lighting controls
±200
nA
µA
25
Advantages
2 mA
•
Easy to mount
•
90 m Ω
Space savings
100 m Ω
•
High power density
R
DS(on)
90 mΩ Ω Ω Ω Ω
100 mΩ Ω Ω Ω Ω
S
S
D
D = Drain
process
TM
DS98904(04/03)