IXFE50N50

Manufacturer Part NumberIXFE50N50
DescriptionMOSFET N-CH 500V 50A SOT-227B
ManufacturerIXYS
SeriesHiPerFET™
IXFE50N50 datasheets

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Specifications of IXFE50N50

Fet TypeMOSFET N-Channel, Metal OxideFet FeatureStandard
Rds On (max) @ Id, Vgs100 mOhm @ 25A, 10VDrain To Source Voltage (vdss)500V
Current - Continuous Drain (id) @ 25° C50AVgs(th) (max) @ Id4.5V @ 8mA
Gate Charge (qg) @ Vgs330nC @ 10VInput Capacitance (ciss) @ Vds9400pF @ 25V
Power - Max500WMounting TypeChassis Mount
Package / CaseSOT-227, miniBLOCConfigurationSingle Dual Source
Transistor PolarityN-ChannelResistance Drain-source Rds (on)0.1 Ohms
Drain-source Breakdown Voltage500 VGate-source Breakdown Voltage+/- 20 V
Continuous Drain Current50 APower Dissipation500 W
Maximum Operating Temperature+ 150 CMounting StyleSMD/SMT
Minimum Operating Temperature- 40 CVdss, Max, (v)500
Id(cont), Tc=25°c, (a)47Rds(on), Max, Tj=25°c, (?)0.1
Ciss, Typ, (pf)9400Qg, Typ, (nc)330
Trr, Typ, (ns)-Trr, Max, (ns)180
Pd, (w)500Rthjc, Max, (ºc/w)0.25
Package StyleISOPLUS227™Lead Free Status / RoHS StatusLead free / RoHS Compliant
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HiPerFET
TM
Power MOSFET
Single Die MOSFET
Preliminary data sheet
Symbol Test Conditions
V
T
= 25°C to 150°C
DSS
J
V
T
= 25°C to 150°C, R
= 1MΩ
DGR
J
GS
V
Continuous
GS
V
Transient
GSM
I
T
= 25°C
D25
C
I
T
= 25°C;
Note 1
DM
C
I
T
= 25°C
AR
C
E
T
= 25°C
AR
C
≤ I
, di/dt ≤ 100 A/µs, V
dv/dt
I
S
DM
≤ 150°C, R
= 2 Ω
T
J
G
P
T
= 25°C
D
C
T
J
T
JM
T
stg
V
50/60 Hz, RMS
t = 1 min
ISOL
I
≤ 1 mA
t = 1 s
ISOL
M
Mounting torque
d
Terminal connection torque
Weight
Symbol
Test Conditions
(T
= 25°C, unless otherwise specified)
J
V
V
= 0 V, I
= 1mA
DSS
GS
D
V
V
= V
, I
= 8mA
GS(th)
DS
GS
D
I
V
= ±20V, V
= 0V
GSS
GS
GS
I
V
= V
DSS
DS
DSS
V
= 0 V
GS
R
V
= 10V, I
= I
DS(on)
GS
D
T
Note 2
© 2003 IXYS All rights reserved
IXFE 55N50
IXFE 50N50
Maximum Ratings
500
500
±20
±30
55N50
50N50
55N50
200
50N50
220
≤ V
DD
DSS
500
-40 ... +150
150
-40 ... +150
2500
3000
1.5/13 Nm/lb.in.
1.5/13 Nm/lb.in.
19
Characteristic Values
Min.
Typ.
Max.
500
2.5
T
= 25°C
J
T
= 125°C
J
55N50
50N50
V
I
DSS
D25
500 V
50 A
500 V
47 A
≤ ≤ ≤ ≤ ≤ 250 ns
t
rr
ISOPLUS 227
(IXFE)
TM
G
V
V
V
V
47
A
50
A
A
G = Gate
A
S = Source
55
A
Either Source terminal at miniBLOC can be used
as Main or Kelvin Source
60
mJ
Features
5
V/ns
Low cost direct-copper bonded
aluminium package
W
Encapsulating epoxy meets
°C
UL 94 V-0, flammability classification
°C
2500V isolation
°C
Low drain to case capacitance
Low R
HDMOS
V~
DS (on)
Rugged polysilicon gate cell structure
V~
Unclamped Inductive Switching (UIS)
rated
Low package inductance
g
Fast intrinsic Rectifier
Conforms to SOT-227B outline
Applications
DC-DC converters
Battery chargers
Switched-mode and resonant-mode
V
power supplies
4.5
V
DC choppers
Temperature and lighting controls
±200
nA
µA
25
Advantages
2 mA
Easy to mount
90 m Ω
Space savings
100 m Ω
High power density
R
DS(on)
90 mΩ Ω Ω Ω Ω
100 mΩ Ω Ω Ω Ω
S
S
D
D = Drain
process
TM
DS98904(04/03)

IXFE50N50 Summary of contents

  • Page 1

    ... V = ±20V GSS DSS DS DSS 10V DS(on Note 2 © 2003 IXYS All rights reserved IXFE 55N50 IXFE 50N50 Maximum Ratings 500 500 ±20 ±30 55N50 50N50 55N50 200 50N50 220 ≤ DSS 500 -40 ... +150 150 -40 ... +150 2500 3000 1.5/13 Nm/lb.in. 1.5/13 Nm/lb.in. ...

  • Page 2

    ... Notes: 1. Pulse width limited by T JM. 2. Pulse test, t ≤ 300 ms, duty cycle d ≤ 2 Test current: T IXFE55N50 27 IXFE50N50 IXYS reserves the right to change limits, test conditions, and dimensions. IXYS MOSFETs and IGBTs are covered by one or more of the following U.S. patents: Characteristic Values Min. Typ. ...