MPXC2011DT1 Freescale Semiconductor, MPXC2011DT1 Datasheet

SENSOR PRESSURE MEDICAL CHIP PAK

MPXC2011DT1

Manufacturer Part Number
MPXC2011DT1
Description
SENSOR PRESSURE MEDICAL CHIP PAK
Manufacturer
Freescale Semiconductor
Series
MPXC2011r
Datasheet

Specifications of MPXC2011DT1

Pressure Type
Differential
Operating Pressure
1.45 PSI, 10 kPa
Port Size
Female, 0.128" (3.2512mm)
Output
24 ~ 26mV
Voltage - Supply
10V
Termination Style
PCB
Operating Temperature
15°C ~ 40°C
Package / Case
4-ChipPak
Mounting Style
Through Hole
Maximum Operating Temperature
+ 40 C
Minimum Operating Temperature
+ 15 C
Operating Supply Voltage
3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPXC2011DT1
Manufacturer:
FREESCALE
Quantity:
20 000
Freescale Semiconductor
© Freescale Semiconductor, Inc., 2006, 2008-2010. All rights reserved.
NOTE: The die and wire bonds are exposed on the front side of the Chip Pak (pressure is applied to the backside of the device).
MPXC2011DTI
MPXC2012DTI
High Volume Sensor for Low
Pressure Applications
pressure sensor package which is ideal as a sub-module component or a
disposable unit. The unique concept of the Chip Pak allows great flexibility in
system design while allowing an economic solution for the designer. This new
chip carrier package uses Freescale Semiconductor's unique sensor die with its
piezoresistive technology, along with the added feature of on-chip, thin-film
temperature compensation and calibration.
Features
• Low Cost
• Integrated Temperature Compensation and Calibration
• Ratiometric to Supply Voltage
• Polysulfone Case Material (ISO 10993)
• Provided in Easy-to-Use Tape and Reel
NOTE:Freescale Semiconductor is also offering the Chip Pak package in
Freescale Semiconductor has developed a low cost, high volume, miniature
Device Name
application-specific configurations, which will have an “SPX” prefix,
followed by a four-digit number, unique to the specific customer
Front side die and wire protection must be provided in the customer's housing. Use caution when handling the devices
during all processes.
Package Options
Tape and Reel
Tape and Reel
Case
423A
423A
No.
ORDERING INFORMATION
MPXC2011DT1/MPXC2012DT1
CHIP PAK PACKAGE
CASE 423A-03
Gauge
Pressure Type
Differential
Application Examples
• Respiratory Diagnostics
• Air Movement Control
• Controllers
• Pressure Switching
Absolute
MPXC2011DT1
MPXC2012DT1
Pressure Sensors
0 to 75 mmHg
(0 to 10 kPa)
Date Code, Lot ID
Date Code, Lot ID
Device Marking
Pressure
MPXC2011DT1
Rev 8, 04/2010

Related parts for MPXC2011DT1

MPXC2011DT1 Summary of contents

Page 1

... Gauge Differential 423A • 423A • CHIP PAK PACKAGE MPXC2011DT1/MPXC2012DT1 CASE 423A-03 Pressure MPXC2011DT1 Rev 8, 04/2010 MPXC2011DT1 MPXC2012DT1 Pressure Sensors mmHg ( kPa) Application Examples • Respiratory Diagnostics • Air Movement Control • Controllers • Pressure Switching Device Marking Absolute Date Code, Lot ID ...

Page 2

... MPXC2011DT1 2 The MPXC2011DT1 contains a silicone dielectric gel which covers the silicon piezoresistive sensing element. The gel is a nontoxic, nonallergenic elastomer system which meets all USP XX Biological Testing Class V requirements. The properties of the gel allow it to transmit pressure ...

Page 3

... FSS ±0.1 — — %V FSS ±0.1 — — %V FSS -1.0 — 1.0 %V FSS -1.0 — 1.0 mV Ω 1300 — 2550 Ω 1400 — 3000 — 1.0 — ms — ±0.5 — — %V FSS MPXC2011DT1 3 ...

Page 4

... Pressure FRONT VIEW BACK VIEW MPXC2011DT1 4 PACKAGE DIMENSIONS DETAIL DETAIL A CASE 423A-03 ISSUE C CHIP PAK PACKAGE –T– END VIEW NOTES DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982 CONTROLLING DIMENSION: INCH. INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.240 0.260 6.10 6 ...

Page 5

... For Literature Requests Only: Freescale Semiconductor Literature Distribution Center 1-800-441-2447 or +1-303-675-2140 Fax: +1-303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com MPXC2011DT1 Rev. 8 04/2010 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document ...

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