TC-175-125 Loctite, TC-175-125 Datasheet

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TC-175-125

Manufacturer Part Number
TC-175-125
Description
THERMSTRATE APPLICATOR BAR
Manufacturer
Loctite
Series
LOCTITE® Thermstrate® TCr
Type
Phase Change Thermal Compoundr
Datasheet

Specifications of TC-175-125

Size / Dimension
50 gram Applicator Bar
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
1000-100
36170
852815
PRODUCT DESCRIPTION
Thermstrate® TC is a phase change thermal interface material
suitable for use between a heat sink and a variety of heat
dissipating components. This product is supplied as a dry
compound in bar form, packaged in a unique easy to use
applicator, which flows in the installation at the phase change
temperature and conforms to the surface features of the heat
sink and component. Upon flow, air is expelled from the
interface, reducing thermal impedance and the material
performs as a highly efficient thermal transfer medium.
Thermstrate TC is a convenient alternative to die cut preforms.
Custom
Thermstrate 2000, are available upon request for a wide range
of applications
TYPICAL APPLICATIONS
Micro processors, hybrid power modules, solid state relays,
power transistors, power modules, IGBT’s, RF components
etc. Typically used between any heat dissipating electrically
isolated component and a heat sink or thermal solution.
MATERIAL PROPERTIES
One application of Thermstrate TC results in a compound
coating thickness of approximately 0.25 mils (0.00635mm).
Data for this coating thickness is provided below.
Substrate
Compound
Thickness
(Nominal)
Thermal Impedance
@
D5470
@137.8
ASTM D5470
Thermal Impedance
@100psiASTM
D5470
@689.5
ASTM D5470
PHYSICAL PROPERTIES
Part Number (Standard)
Phase change temperature
Volumetric
change
Viscosity
temperature
Color
No silicones in the compound formulation.
THE TECHNICAL INFORMATION CONTAINED HEREIN IS INTENDED AS REFERENCE ONLY. PLEASE CONTACT LOCTITE
20psi
CORPORATION QUALITY DEPARTMENT FOR ASSISTANCE AND RECOMMENDATIONS ON SPECIFICATIONS FOR THIS
parts
above
expansion
ASTM
.
KPa,
KPa,
of
phase
the
Units
inches
mm
°C-in
°C-
cm
°C-in
°C-
cm
upon
2
2
/W
/W
2
2
equivalent
/W
/W
change
phase
NOT FOR PRODUCT SPECIFICATIONS
Thermstrate
.00025
.00635
.015
.097
.010
.065
TC-175-125
TC
preformed
60°C
15%
Thixotropic
Opaque White
PRODUCT.
material,
PRODUCT PERFORMANCE
Thermal Impedance vs Mounting Pressure
The performance of any phase change thermal interface
material will be improved by increasing the mounting pressure
at the interface. The graph below shows the thermal
impedance values generated on an ASTM D5470 platform.
The test block dimensions are 2” x 2”, the finish is 64
microinches and the flatness is .002 inches/inch. The power
level is 80 watts.
PRODUCT CHARACTERISTICS
The graph above shows the typical performance for
Thermstrate TC when placed between a device and a heat
sink, under a clamp load of 10psi. The temperature at the case
of the device and the heat sink are recorded. During the first
reflow cycle, i.e. prior to phase change, Thermstrate TC
exhibits relatively high thermal impedance. Once the material
has changed phase one time, all subsequent operations will
see the thermal impedance values indicated on the curve
traces which approximately parallel the horizontal axis.
Thermstrate ® TC
Technical Data Sheet
November 2002
L

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TC-175-125 Summary of contents

Page 1

... PRODUCT CHARACTERISTICS .00025 .00635 .015 .097 .010 .065 TC-175-125 60°C 15% The graph above shows the typical performance for Thermstrate TC when placed between a device and a heat Thixotropic sink, under a clamp load of 10psi. The temperature at the case of the device and the heat sink are recorded. During the first reflow cycle, i ...

Page 2

... Application of this material should be simple with little requirement for repeated application on the same surface. No dispensing or squeegeeing equipment is required. The TC Applicator Bar can be used on an unlimited variety of heat sinks, cold plates, or other component designs, maximizing flexibility. They are intended to be used to deliver a minimum coating thickness on any heat transfer device ...

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