MC9S08JE64CLH Freescale Semiconductor, MC9S08JE64CLH Datasheet

IC MCU 8BIT 64K FLASH 64LQFP

MC9S08JE64CLH

Manufacturer Part Number
MC9S08JE64CLH
Description
IC MCU 8BIT 64K FLASH 64LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08JE64CLH

Core Processor
HCS08
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, SCI, SPI, USB
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
33
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 6x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
S08JE
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
12 KB
Maximum Clock Frequency
48 MHz
Operating Supply Voltage
- 0.3 V to + 3.8 V
Maximum Operating Temperature
+ 105 C
3rd Party Development Tools
EWS08
Development Tools By Supplier
TWR-SER, TWR-ELEV, TWR-MCF51JE-KIT, TWR-S08JE128-KIT, TWR-LCD
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

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Part Number:
MC9S08JE64CLH
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
MC9S08JE128 series
Covers: MC9S08JE128 and MC9S08JE64
8-Bit HCS08 Central Processor Unit (CPU)
On-Chip Memory
Power-Saving Modes
Clock Source Options
System Protection
Development Support
Peripherals
Freescale Semiconductor
Data Sheet: Advanced Information
An Energy-Efficient Solution from Freescale
This document contains information on a new product. Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2009-2010. All rights reserved.
Up to 48-MHz CPU above 2.4 V, 40 MHz CPU above 2.1 V, and
20 MHz CPU above 1.8 V across temperature of -40°C to 105°C
HCS08 instruction set with added BGND instruction
Support for up to 32 interrupt/reset sources
128 K Dual Array Flash read/program/erase over full operating
voltage and temperature
12 KB Random-access memory (RAM)
Security circuitry to prevent unauthorized access to RAM and
Flash
Two ultra-low power stop modes. Peripheral clock enable register
can disable clocks to unused modules to reduce currents
Time of Day (TOD) — Ultra-low power 1/4 sec counter with up to
64s timeout.
Ultra-low power external oscillator that can be used in stop modes
to provide accurate clock source to the TOD. 6 usec typical wake
up time from stop3 mode
Oscillator (XOSC1) — Loop-control Pierce oscillator; 32.768 kHz
crystal or ceramic resonator dedicated for TOD operation.
Oscillator (XOSC2) — for high frequency crystal input for MCG
reference to be used for system clock and USB operations.
Multipurpose Clock Generator (MCG) — PLL and FLL; precision
trimming of internal reference allows 0.2% resolution and 2%
deviation over temperature and voltage; supports CPU
frequencies from 4 kHz to 48 MHz.
Watchdog computer operating properly (COP) reset Watchdog
computer operating properly (COP) reset with option to run from
dedicated 1-kHz internal clock source or bus clock
Low-voltage detection with reset or interrupt; selectable trip points;
separate low-voltage warning with optional interrupt; selectable
trip points
Illegal opcode and illegal address detection with reset
Flash block protection for each array to prevent accidental
write/erasure
Hardware CRC to support fast cyclic redundancy checks
Single-wire background debug interface
Real-time debug with 6 hardware breakpoints (4 PC, 1 address
and 1 data) Breakpoint capability to allow single breakpoint setting
during in-circuit debugging
On-chip in-circuit emulator (ICE) debug module containing 3
comparators and 9 trigger modes
CMT— Carrier Modulator timer for remote control
communications. Carrier generator, modulator and driver for
dedicated infrared out. Can be used as an output compare timer.
IIC— Up to 100 kbps with maximum bus loading; Multi-master
operation; Programmable slave address; Interrupt driven
Preliminary — Subject to Change
64-LQFP 10mm x 10mm
Input/Output
Package Options
byte-by-byte data transfer; supports broadcast mode and 11-bit
addressing
PRACMP — Analog comparator with selectable interrupt;
compare option to programmable internal reference voltage;
operation in stop3
SCI — Two serial communications interfaces with optional 13-bit
break; option to connect Rx input to PRACMP output on SCI1 and
SCI2; High current drive on Tx on SCI1 and SCI2; wake-up from
stop3 on Rx edge
SPI1— Serial peripheral interface (SPI) with 64-bit FIFO buffer;
16-bit or 8-bit data transfers; full-duplex or single-wire
bidirectional; double-buffered transmit and receive; master or
slave mode; MSB-first or LSB-first shifting
SPI2— Serial peripheral interface with full-duplex or single-wire
bidirectional; Double-buffered transmit and receive; Master or
Slave mode; MSB-first or LSB-first shifting
TPM — Two 4-channel Timer/PWM Module; Selectable input
capture, output compare, or buffered edge- or center-aligned
PWM on each channel; external clock input/pulse accumulator
USB — Supports USB in full-speed device configuration. On-chip
transceiver and 3.3V regulator help save system cost, fully
compliant with USB Specification 2.0. Allows control, bulk,
interrupt and isochronous transfers.
ADC12 — 12-bit Successive approximation ADC with up to 4
dedicated differential channels and 8 single-ended channels;
range compare function; 1.7 mV/°C temperature sensor; internal
bandgap reference channel; operation in stop3; fully functional
from 3.6V to 1.8V, Configurable hardware trigger for 8 Channel
select and result registers
PDB — Programmable delay block with 16-bit counter and
modulus and prescale to set reference clock to bus divided by 1 to
bus divided by 2048; 8 trigger outputs for ADC12 module provides
periodic coordination of ADC sampling sequence with sequence
completion interrupt; Back-to-Back mode and Timed mode
DAC — 12-bit resolution; 16-word data buffers with configurable
watermark.
Up to 47 GPIOs and 2 output-only pin and 1 input-only pin.
Voltage Reference output (VREFO).
Dedicated infrared output pin (IRO) with high current sink
capability.
Up to 16 KBI pins with selectable polarity.
81-MBGA 10x10 mm
80-LQFP 12x12 mm
64-LQFP 10x10 mm
Document Number: MC9S08JE128
80-LQFP 12mm x 12mm
Rev. 3, 04/2010
81-MapBGA 10mm x10mm

Related parts for MC9S08JE64CLH

MC9S08JE64CLH Summary of contents

Page 1

... IIC— 100 kbps with maximum bus loading; Multi-master operation; Programmable slave address; Interrupt driven This document contains information on a new product. Specifications and information herein are subject to change without notice. © Freescale Semiconductor, Inc., 2009-2010. All rights reserved. Document Number: MC9S08JE128 64-LQFP 10mm x 10mm byte-by-byte data transfer ...

Page 2

... CPU, and all module information. – This document contains information on a new product. Specifications and information herein are subject to change without notice. © Freescale Semiconductor, Inc., 2009-2010. All rights reserved. 2.15 VREF Specifications............................................................. 35 3 Ordering Information......................................... 41 3 ...

Page 3

... Programmable Delay Block (PDB) SAR ADC differential channels SAR ADC single-ended channels Voltage reference output pin (VREFO) 1 Port I/O count does not include two (2) output-only and one (1) input-only pins. 2 Each differential channel is comprised of 2 pin inputs. Freescale Semiconductor Feature MC9S08JE128 81 131072 ...

Page 4

... Cyclic Redundancy Check (CRC) Keyboard Interrupt (KBI) Voltage Reference (VREF) Voltage Regulator (VREG) Interrupt Request (IRQ) Flash Wrapper GPIO Port Control The block diagram in Figure 1 shows the structure of the MC9S08JE128 series MCU. 4 Table 2. Versions of On-Chip Modules Preliminary — Subject to Change Version Freescale Semiconductor ...

Page 5

... Figure 1. MC9S08JE128 series Block Diagram Freescale Semiconductor Preliminary — Subject to Change Devices in the MC9S08JE128 series 5 ...

Page 6

... The following two figures show the 64-pin LQFP pinout configuration. PTA0/SS1 IRO PTA4 PTA5 PTA6 PTA7 PTB0 PTB1/BLMS VSSA VREFL NC NC DADP2 NC DADM2 64-LQFP Figure 2. 64-Pin LQFP Preliminary — Subject to Change 48 PTD7/RX1 47 PTD6/TX1 46 PTD5/SCL/TPM1CH3 45 PTD4/SDA/TPM1CH2 44 PTD3/TPM1CH1 43 PTD2/TPM1CH0 42 PTD1/CMPP2/RESET 41 PTD0/BKGD/MS 40 PTC7/KBI2P2/CLKOUT/ADP11 39 PTC6/KBI2P1/PRACMPO/ADP10 38 PTC5/KBI2P0/CMPP1/ADP9 37 PTC4/KBI1P7/CMPP0/ADP8 36 PTC3/KBI1P6/SS2/ADP7 35 PTC2/KBI1P5/SPSCK2/ADP6 34 PTC1/MISO2 33 PTC0/MOSI2 Freescale Semiconductor ...

Page 7

... IRO 2 PTA1/KBI1P0/TX1 3 PTA2/KBI1P1/RX1/ADP4 4 PTA3/KBI1P2/ADP5 5 PTA4 6 PTA5 7 PTA6 8 PTA7 9 PTB0 10 PTB1/BLMS 11 VSSA 12 VREFL DADP2 DADM2 Freescale Semiconductor 80-LQFP Figure 3. 80-Pin LQFP Preliminary — Subject to Change Devices in the MC9S08JE128 series PTE4/CMPP3/TPMCLK/IRQ PTE3/KBI2P6 PTE2/KBI2P5 PTE1/KBI2P4 PTE0/KBI2P3 PTD7/RX1 PTD6/TX1 PTD5/SCL/TPM1CH3 PTD4/SDA/TPM1CH2 PTD3/TPM1CH1 PTD2/TPM1CH0 PTD1/CMPP2/RESET PTD0/BKGD/MS ...

Page 8

... PTC4 VREFH VDDA PTB2 PTB3 Figure 4. 81-Pin MAPBGA Preliminary — Subject to Change PTF4 PTF3 PTE4 PTF1 PTF0 PTE3 PTE5 PTE2 PTE1 PTD5 PTD7 PTE0 PTD2 PTD3 PTD6 PTB7 PTC7 PTD4 PTC0 PTC1 PTC2 PTD0 PTC5 PTC6 PTD1 PTB4 PTB5 Freescale Semiconductor ...

Page 9

... DADM3 DADP0 DADM0 VREFO H3 28 — DADP1 H2 29 — DADM1 Freescale Semiconductor Table 3. Package Pin Assignments ALT1 ALT2 ALT3 SS1 — — — — — KBI1P0 TX1 — KBI1P1 RX1 ADP4 KBI1P2 ADP5 — — — — — — — — ...

Page 10

... IRQ Preliminary — Subject to Change Composite Pin Name VREFH VDDA VSS2 PTB2/EXTAL1 PTB3/XTAL1 VDD2 PTB4/EXTAL2 PTB5/XTAL2 PTB6/KBI1P3 PTB7/KBI1P4 PTC0/MOSI2 PTC1/MISO2 PTC2/KBI1P5/SPSCK2/ADP6 PTC3/KBI1P6/SS2/ADP7 PTC4/KBI1P7/CMPP0/ADP8 PTC5/KBI2P0/CMPP1/ADP9 PTC6/KBI2P1/PRACMPO/ADP10 PTC7/KBI2P2/CLKOUT/ADP11 PTD0/BKGD/MS PTD1/CMPP2/RESET PTD2TPM1CH0 PTD3/TPM1CH1 PTD4/SDA/TPM1CH2 PTD5/SCL/TPM1CH3 PTD6/TX1 PTD7/RX1 PTE0/KBI2P3 PTE1/KBI2P4 PTE2/KBI2P5 PTE3/KBI2P6 PTE4/CMPP3/TPMCLK/IRQ Freescale Semiconductor ...

Page 11

... USB_DP VBUS VSS1 VDD1 PTF6 PTF7 PTG0 B3 — — PTG1 Freescale Semiconductor ALT1 ALT2 ALT3 — — — — — — TX2 — — RX2 — — — — — — RX2 TPM2CH1 — TX2 TPM2CH0 — SCL — — SDA — ...

Page 12

... All values shown in the typical column are within this category. Those parameters are derived mainly from simulations. D The classification is shown in the column labeled “C” in the parameter tables where appropriate. 12 NOTE Table 4. Parameter Classifications NOTE Preliminary — Subject to Change Freescale Semiconductor ...

Page 13

... This device contains circuitry protecting against damage due to high static voltage or electrical fields; however advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (for instance, either Freescale Semiconductor Table 5. Absolute Maximum Ratings Rating Symbol ...

Page 14

... Four-layer board — 2s2p 81-pin MBGA 80-pin LQFP 64-pin LQFP ) in °C can be obtained from: J × θ ÷ 273° Preliminary — Subject to Change Value Unit °C –40 to 105 –40 to 105 °C 135 °C °C Eqn. 1 and T ( neglected I/O Eqn. 2 Freescale Semiconductor ...

Page 15

... Table 8. ESD and Latch-Up Protection Characteristics # Rating 1 Human Body Model (HBM) 2 Machine Model (MM) 3 Charge Device Model (CDM) 4 Latch-up Current 125°C A Freescale Semiconductor × 273°C) + θ × and T can be obtained by solving D J Table 7. ESD and Latch-up Test Conditions Description ...

Page 16

... V DD > 2 all digital 0.85 x inputs 2.7 V > ≥ 1.8 V Preliminary — Subject to Change 1 Typ Max Unit C — 3.6 V — — — — — — — — 100 mA D — 0 — 0 — 0 — 100 mA D — — — — Freescale Semiconductor ...

Page 17

... C Input Capacitance, all pins RAM retention voltage RAM 18 V POR re-arm voltage POR 19 t POR re-arm time POR Freescale Semiconductor Table 9. DC Characteristics (Continued) Condition all digital inputs, > 2 all digital inputs, 2.7 > V ≥ DD 1.8 V all digital inputs — ...

Page 18

... DD — V falling DD — V rising DD — — 11 — and V SS Preliminary — Subject to Change 1 Min Typ Max Unit C 2.11 2.16 2. 2.16 2.23 2. 1.80 1.84 1. 1.88 1.93 1. 2.36 2.46 2. 2.36 2.46 2. 2.11 2.16 2. 2.16 2.23 2. — 50 — 1.15 1.17 1. LVDL . DD Freescale Semiconductor . ...

Page 19

... Maximum is highest voltage that POR is guaranteed. 9 Run at 1 MHz bus frequency 10 Low voltage detection and warning limits measured at 1 MHz bus frequency. 11 Factory trimmed 3.0 V, Temp = 25°C DD Freescale Semiconductor range during instantaneous and operating DD > greater than Preliminary — Subject to Change Preliminary Electrical Characteristics ...

Page 20

... P 25 TBD mA 105 P –40 to — 105 –40 to — 105 –40 to — 105 –40 to TBD mA C 105 –40 to — 105 –40 to — 105 –40 to — 105 –40 to μA — T 105 –40 to μA — T 105 μA — –40 to μA — T 105 Freescale Semiconductor ...

Page 21

... Stop2 mode S2I 6 supply cur- DD rent Stop3 mode No clocks active S3I 7 supply cur- DD rent 1 Data in Typical column was characterized at 3.0 V, 25° typical recommended value. Freescale Semiconductor Bus 1 V (V) Typ DD Freq 3 24 MHz TBD 3 20 MHz TBD 3 8 MHz TBD ...

Page 22

... Typical Max Unit — 3.6 V μA — 60 μA — 40 — – 0.3 — — 20.0 mV — μs — 1.0 Freescale Semiconductor — ...

Page 23

... Programmable reference generator voltage 13 range 2.8 12-bit DAC Electricals Table 13. DAC 12LV Operating Requirements # Characteristic 1 Supply voltage 2 Reference voltage 3 Temperature Output load capacitance 4 5 Output load current Freescale Semiconductor Table 12. PRACMP Electrical Specifications Symbol Min 1.8 In2 DD25 t — PRGST Vstep –0.25 Vprgout V In ...

Page 24

... C µA 100 C 500 µA C (TBD) 200 µs C (TBD) 30 µ µs C 1(TBD) µs C 100 mV C (TBD) — ± 8 LSB C ± 1 LSB C ± 0.5 %FSR C ± 0.5 %FSR C (TBD) — See Typical mV C (TBD) Drift figure that follows. TBD µV/yr C Freescale Semiconductor ...

Page 25

... Analog Source AS Resistance 9 f ADC Conversion ADCK 10 Clock Freq 3.0 V, Temp = 25 °C, f Typical values assume V DDAD reference only and are not tested in production potential difference. Freescale Semiconductor Table 15. 12-bit ADC Operating Conditions Conditions Min Typ Absolute 1.8 Delta to V -100 DDAD ...

Page 26

... Figure 6. ADC Input Impedance Equivalency Diagram 26 SIMPLIFIED INPUT PIN EQUIVALENT CIRCUIT Pad Z AS leakage due to input protection + V ADIN – INPUT PIN INPUT PIN INPUT PIN Preliminary — Subject to Change Z ADIN SIMPLIFIED CHANNEL SELECT CIRCUIT ADC SAR ENGINE R ADIN R ADIN R ADIN R ADIN C ADIN Freescale Semiconductor ...

Page 27

... Non-Linearity 11-bit differential mode 10-bit single-ended mode 9-bit differential mode 8-bit single-ended mode Integral 12-bit single-ended mode Non-Linearity 11-bit differential mode 10-bit single-ended mode 9-bit differential mode 8-bit single-ended mode Freescale Semiconductor = V , > 1. REFH DDAD REFL SSAD 1 Symb Min Typ — ...

Page 28

... Typical values are for ADCK Preliminary — Subject to Change Max Unit C Comment ±2.0 2 LSB T V ADIN V SSAD ±1.0 T ±1.0 ±0.5 T ±0.5 ±3.5 2 LSB T V ADIN V DDAD ±1.5 T ±1.5 ±0.5 T ±0.5 ±0.5 2 LSB leakage AS In current (refer to DC characteristi cs) — mV/× — — Freescale Semiconductor = = ...

Page 29

... This specification applies to any time the FLL reference source or reference divider is changed, trim value is changed, DMX32 bit is changed, DRS bit is changed, or changing from FLL disabled (BLPE, BLPI) to FLL enabled (FEI, FEE, FBE, FBI crystal/resonator is being used as the reference, this specification assumes it is already running. Freescale Semiconductor Symbol Min t — ...

Page 30

... BUS Jitter C Ambient) ° 1 Min Typ Max f 32 — 38.4 lo fhi 1 — 5 fhi 1 — 16 fhi 1 — See Note — — — — 1 — R — 0 — S — 100 — R — — — Freescale Semiconductor . Unit kHz MHz MHz MHz MΩ kΩ kΩ ...

Page 31

... See crystal or resonator manufacturer’s recommendation. 4 This parameter is characterized and not tested on each device. 5 Proper PC board layout procedures must be followed to achieve specifications. o Freescale Semiconductor Symbol Low range, low gain (RANGE = 0, HGO = 0) Low range, high gain (RANGE = 0, HGO = 1) High range, low gain (RANGE = 1, ...

Page 32

... Preliminary — Subject to Change 1 Min Typical Max C dc — — — 800 990 1500 D (TBD) 100 — — — — D cyc 500 — — D 100 — — 100 — — 1 cyc D 100 — — 1 cyc Freescale Semiconductor Unit MHz μ ...

Page 33

... This is the minimum pulse width that is guaranteed to pass through the pin synchronization circuitry. Shorter pulses may or may not be recognized. In stop mode, the synchronizer is bypassed so shorter pulses can be recognized in that case. 4 Timing is shown with respect to 20% V RESET PIN IRQ/KBIPx IRQ/KBIPx Freescale Semiconductor Table 19. Control Timing Parameter 4 , Low Drive Slew rate control ...

Page 34

... TPMext t TPMext t clkh t clkl t ICPW t TPMext t clkh t clkl Figure 9. Timer External Clock t ICPW t ICPW Figure 10. Timer Input Capture Pulse Preliminary — Subject to Change Min Max Unit MHz Bus 4 — t cyc 1.5 — t cyc 1.5 — t cyc 1.5 — t cyc Freescale Semiconductor ...

Page 35

... All timing is shown with respect to 20% V assumes slew rate control disabled and high drive strength enabled for SPI output pins. 3 Time to data active from high-impedance state. 4 Hold time to high-impedance state. Freescale Semiconductor describe the timing requirements for the SPI system. Table 21. SPI Timing 2 Symbol Min ...

Page 36

... LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB BIT BIT MSB OUT Figure 11. SPI Master Timing (CPHA = (2) MSB IN BIT (2) MSB OUT BIT Figure 12. SPI Master Timing (CPHA = 1) Preliminary — Subject to Change 3 LSB IN 12 LSB OUT 3 LSB IN LSB OUT Freescale Semiconductor ...

Page 37

... Not defined, but normally MSB of character just received SS (INPUT) SCK (CPOL = 0) (INPUT) SCK (CPOL = 1) (INPUT) MISO SEE (OUTPUT) NOTE 8 MOSI (INPUT) NOTE: 1. Not defined, but normally LSB of character just received Freescale Semiconductor BIT MSB OUT 7 BIT Figure 13. SPI Slave Timing (CPHA = ...

Page 38

... Mass 10,000 — D_ret Preliminary — Subject to Change supply. For more detailed DD Typical Max Unit — 3.6 V — 3.6 V — 200 kHz μs — 6. Fcyc 4 t Fcyc 4000 t Fcyc 20,000 t Fcyc — — cycles 100,000 — 100 — years Freescale Semiconductor ...

Page 39

... Table 23. Internal USB 3.3 V Voltage Regulator Characteristics # Characteristic 1 Regulator operating voltage 2 VREG output input with internal VREG V USB33 3 disabled 4 VREG Quiescent Current Freescale Semiconductor http://www.usb.org. Symbol Min Typ V 3.9 — regin V 3 3.3 regout ...

Page 40

... V — (TBD) — TBD ppm/year — 0.10 µA — 75 µA — 125 µA — 1.1 mA — 100 µV/mA — TBD mV TBD — dB Max Unit C 50 °C C Max Unit C TBD µA C Freescale Semiconductor — Notes Notes ...

Page 41

... Ordering Information This appendix contains ordering information for the device numbering system. MC9S08JE128 and MC9S08JE64 devices. Freescale Semiconductor Figure 15. Typical Output vs. Temperature TBD Figure 16. Typical Output vs. V Preliminary — Subject to Change Ordering Information DD 41 ...

Page 42

... Table 28. Package Descriptions Abbreviation Designator LQFP LQFP Map PBGA or website (http://www.freescale.com), and enter the appropriate document number (from Preliminary — Subject to Change Table Available Packages 64 LQFP 80 LQFP 81 MAPBGA 64 LQFP Case No. Document No. LH 840F-02 98ASS23234W 98ASS23174W LK 917-01 98ASA10670D MB 1662-01 Freescale Semiconductor ...

Page 43

... The following revision history table summarizes changes contained in this document. Rev Date 0 6/2009 Initial release of the Data Sheet. 1 7/2009 Updated MCG and XOSC 2 04/2010 Updated electrical characteristic data. Freescale Semiconductor Description of Changes Average internal reference frequency Preliminary — Subject to Change Revision History . 43 ...

Page 44

... Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer ...

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